二手 AMAT / APPLIED MATERIALS / HCT E500SD-B/5 #9193773 待售
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已售出
ID: 9193773
优质的: 2011
Wire saw
Water input:
Input pressure: >2.5 bar
Input temperature: <9°C
Cooling unit power: 150 kW
Incoming water flow (without cooling compressor): 18.5 m³/h
Machine:
Wire speed / Acceleration: 18*/5 m/s / m/s²
Wire guides length: 520 mm
Wire guides diameter: 300 mm
Horizontal working space: 360 mm
(4) Wire guides
Wire guides drives power: 2x61 kW
(2) Tables:
Travel (depends on clamping): 290 mm
Cutting speed: 0-9000 um/min
Fast table speed: 0-500 mm/min
Hydraulic passive clamping system
Wire:
(8) Pulleys
Wire tension: 0-30N
Wire length: 640 km
Wire web width: 500mm
Slurry:
Tank capacity: 550 lit
Pumping capacity: 2x160-200 * (1,6 kg/dm3) kg/min
Pump power: 3x7.5 kW
Pumping speed adjustment: 0-100%
(3) Pumps
(6) Manifolds in slicing room
Frame & others:
Stainless steel
Sliding doors
Color of frame and panels: RAL 5011
Utilities:
Air pressure: 4 to 6 bar
Air flow (dry): Min 25 m3/h
Air exhaust (pipe ø150 mm): 3x100 m3/h
Cooling unit power: 150 kW
Incoming water pressure: Min 2.5 bar
Incoming water temperature (with cooling compressor): 20 (30 RFNS) °C max 20
Incoming water temperature (without cooling compressor): 9 °C Max
Incoming water flow (with cooling compressor): 10.3 m3/h
Incoming water flow (without cooling compressor): 18.5 m3/h
B5 Base with retrofit hardware
Diamond wire technology
Machine can run with 120 or 100 µm wire
Electrical hooking 50 / 60 Hz: 3x400 / 480
Average power (with cooling compressor): 208 kVA
Maximum power (with cooling compressor): 339 kVA
Average power (without cooling compressor): 156 kVA
Maximum power (without cooling compressor): 287 kVA
Grid failure safety option
2011 vintage.
HCT E500SD-B/5晶体生长、锯切和切片设备是一种精密工具,用于半导体工业的非氧化物晶体材料如GaAs、InP和相关复合半导体材料的生长、切片和研磨。该系统配有先进的环境室和线性偏心驱动器,用于精确、安全的操作。该单元设计为生长、锯、截面和圈出各种材料,薄至0.5 μ m。该机采用600毫米X-Y PZT级,集成刀片控制工具,以及高性能的新一代视角摄像头。该E500SD-B/5利用自动化增长控制(AGC)过程,该过程旨在提高即使是最具挑战性的材料的切片和研磨的均匀性和安全性。锯片采用先进的防护资产技术控制,Z向控制,使切割效果与晶体表面完美对齐,获得表面损伤最小的完美切片。该模型可用于手动或通过模块化控制器平台执行单轴和多轴扫描,该平台包含高度集成的微处理器,并允许更快的操作速度。Modular Controller平台与Advanced Vacuum Controller集成,在生长和切片操作过程中监视和控制处理室,以实现卓越的性能。该设备还包括高质量的超低振动电动机,可消除振动并降低研磨过程的复杂性。该系统先进的光学单元包括超高分辨率数码相机和显微镜,使样品和整个过程的对准变得简单准确。机器的控制软件提供了可靠的数据报告和过程监控工具,同时执行多个过程参数,以最大限度地提高过程吞吐量。这与该工具的集成冷却和加热器资产相结合,使其适用于单晶和多晶生产。总体而言,AMAT E500SD-B/5是一种多功能的晶体生长、锯切和切片模型,旨在确保高精度和高级性能。该设备针对非氧化物结晶材料的生长、切片和研磨进行了优化,为用户提供了无与伦比的准确性和生产率。该系统先进的微处理器控制单元和种类繁多的组件使其成为半导体研究和工业应用的绝佳选择。
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