二手 ACCRETECH / TSK PG 300 RM #9165695 待售
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ID: 9165695
晶圆大小: 12"
优质的: 2006
Wafer backside grinder, 12"
(4) Chucks mounted to an indexing table system
Auto cleaning unit
Windows NT based operating system
Rough grind station with thickness monitor
Fine grind station with thickness monitor
Integrated polish station with conditioning unit
Graphical user interface (GUI)
LCD Touch panel
Frame laminating system
Alignment system
Front-side wafer de-taping system
Backside OCR
SEMI S2-93 Certified
Options:
By passable door interlock for PG, RM and slurry supply unit
Pad thickness parameter: Allow up to 6 mm pad
2 Channel temperature control unit for cooling spindle
Heating polish head
In-line UV system
Post process thickness measurement gauge
DAF Tape laminator for Pre-cut tape (DAF / Dicing tape)
(1) US Standard facility adapter kit
OCR / BCR (RM unit)
(3) BCR for Input carriers
Interface: SECS / GEM
8" Notched wafer kit for PG300
8" Notched wafer kit for RM300
(2) 8" Wafer cassette / Frame adaptors
Bar-code printer unit
(9) Slot cassette capability
Auto lot split capability
Gas (With (2) cameras for street alignment)
RFID For spinner chuck
Missing parts:
(1) Load port A
(1) 12" H1 Arm
(1) 12" H2 Pad
(1) 12" Spinner table
(1) 12" H4 Pad
(1) 12" Mounting table
(1) 12" Outer ring frame table
(1) 12" Peeling table
(2) Load Port bar code readers
(2) PG Touch screen panels
(1) CCD Camera and controller
(1) Spinner LED
(2) RM Pro-face monitors
2006 vintage.
ACCRETECH/TSK PG 300 RM是一种晶圆研磨、研磨、抛光设备，设计用于半导体工业。它是生产高平面度和高微粗糙度薄片的综合解决方桉。该系统可以精确控制研磨、研磨和抛光过程，以达到所需的平面和表面粗糙度。它有一个特别设计的磨轮、研磨板和金刚石垫以确保所有工艺参数保持在要求的水平之内。TSK PG300RM是由PLC控制的全自动单元,带有设备控制面板,以便于操作。该机由一台由伺服电动机驱动的C型框架和研磨台，以及用于固定研磨轮、研磨板和金刚石垫的横梁组成。C型框架和台面设计具有良好的稳定性和减振性能。它还有一个内置的清洁工具，以确保研磨台保持无杂物。磨轮和研磨板安装在横梁上，由PLC精确控制。砂轮用于晶片的粗磨和变薄，研磨板用于精磨和除尘。金刚石垫用于将晶片抛光至光滑的光洁度。ACCRETECH PG 300RM还配备了CCD摄像头，可以实时监控过程。该资产能够使晶片的直径不超过300毫米。也能容纳各种材料，如熔融二氧化硅、石英、蓝宝石等。ACCRETECH PG 300 RM非常适合生产具有出色平面和表面粗糙度的优质晶片。它是研磨、研磨、抛光晶片的综合模型，为半导体制造商提供了高效、经济高效的解决方桉。
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