二手 ASM Eagle 60 #135194 待售

Wire bonders with vertical LED Specifications: Bonding system: Bonding method: thermosonic (TS) BQM mode: constant current, voltage, power and normal (programmable) Loop type: normal, low, square, penta, J, VLED, FLEX XY resolution: 0.2µm Z resolution (capillary traveling motion): 0.4µm Fine pitch capability: 35µm pitch at 0.6 mil wire No. of bonding wires: up to 3000 Program storage: 1000 programs on hard disk Multimode transducer system: programmable profile, control and vibration modes Vision system: Pattern recognition time: 60 ms/point Pattern recognition accuracy: ± 0.37µm Lead locator detection: 12 ms/lead (3 leads/frame) Lead locator accuracy: ± 2.4 µm Post bond inspection: first bond, second bond and wire tracing Maximum die level different: 400 to 500µm Material handling system: Indexing speed: 200 to 250ms at 0.5" pitch Indexer resolution: 1µm Lead frame position accuracy: ± 2 mil Applicable lead frame: W: 24 to 73mm at bonding area in Y = 65mm 24 to 90mm at bonding area in Y = 48mm L: 280mm (magazine) T: 0.075 to 0.8mm Applicable magazine: W: 98mm (maximum) L: 140 to 280mm H: 180mm (magazine) Magazine pitch: 2.4 to 10mm (0.09" to 0.39") Device changeover: < 4 minutes Package changeover: < 5 minutes Number of buffer magazines: 3 (maximum 435mm) Does not include a Cu kit for Cu wire bonding 2002 to 2005 vintage.