二手 TEL / TOKYO ELECTRON Telius SP 305 SCCM #9074890 待售

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TEL / TOKYO ELECTRON Telius SP 305 SCCM
已售出
ID: 9074890
Dielectric etcher, 12" Standard Specifications Software Revision: Linux 5.75 Rev 001 Lot Stability Dummy SW: Software for running lot stability wafer OEE WPH Software: Yes GEM SEC Revision: TBD Wafer Size: Diameter 300+/- 0.20mm(SEMI M1.15), Notch Carrier: FOUP (Comply with SEMI E47.1 (25wafers)) Inter Face: 5 carrier stage (Continuous flow operation) with Semi compliant MENV and FIMS assemblies Online Connection: GEM / CIM GJG (Hardware Interface : Ethernet 100Base-Tx) Interface A: Yes Utility Box: Regulator: Air/AR2500(SMC), N2/SQ-420E(VERIFLO), He/SQMICRO(VERIFLO) Utility Box: Manual Valv: OGD20V-6RM-K / OGD10V-4RM-K (CKD) Utility Box: Pressure Gauge: Bourdon Gauge Loader Mod Corrosion Prevent: NO, without Corrosion Prevent Load Lock Pressure Monitor: Pressure Switch: VSA100A (INFICON) Load Lock Pressure Monitor: Pirani gauge: TTR211S LEYBOLD) Load Lock Pressure Monitor: CM: 626A01TDE (MKS) Maintenance Monitor: 2 (Flat Panel Display Touch Screen Type) Water Leak Detector: 5 (LM;1, each PS;1) Signal Tower: Red/Yellow/Green/Blue (Upper Left of Front x1 & Upper right section of loader on maintenance side x1) Data Back up: USB& MO EMO: Front x3, Rear x6 Cable Length: One 15m and one 16m (Interconnection, RF cables) Inter Locks: External (When the I/L signal is received from Factory, gas valves are closed) Fittings: No brass fittings Supporting Remote Units Chiller: UBRPD5A-2T  Coolant: Lower:FC3283, Upper:FC40 Chiller Hose: BRINE HOSE 15/14M Handy Maintenance Controller: LCD DISPLAY UT3-TLN21-A RF Generator TOP: AGA-50B2 RF Matcher TOP: AMN-50B2 RF Generator Bottom: WGA-50E Matching Controller: WMN-50H6(2MHZ/5KW)(PS3) Pen Record Box: 2L80-00212-12 Loader Module: SELME2112ZS22-AD5 LOAD PORT: NO, Bolts-L type DRIVE UNIT: SBX92102928 READER OPTICAL: ISS-1700-1TELCC Carrier ID Reader: NO,V640series+V700-L22 (Omron) APC: 12" (320MM) Hardware Configuration Proc Chbr 1,2,3,4: SCCM Oxide; Y203 Coating Chamber hardware: FCC Endpoint type: SE2000ii ESC type: Ceramics ESCwith STD Vpp Focus ring: 3.4mm Thunderwall He Gas Inlet: Ceramic Thunderwall with Ceramic pusher pins Polished focus ring: O FC lower insulator: FC lower insulator w/quartz upper ring shield Magnet Shield: O Oring for Chbr Body-Depos: Armorcrystal, Chemraz SC657 CEL Body ASSY: Brine Control Mode TMP: TMP-3403LMC-T4(VG300) (SHIMADZU) TMP Back Pressure Monitor: 51A11TGA2BA003 (MKS) Dry Pump: ESR80WN, KEG approved Final Valve, Heater: Valve; AGD21V-6RM-GWL4 (CKD) Filter: Filter; CEP-TM_HL-VR-03PB (Toshiba Ceramic) APC: Pendulum Motion Dia., 320mm(VAT), R.T.~90deg Pressure Monitor: C/M (Process Monitor) : 627BRETDD2P (MKS), 45deg, 30Pa Pressure Monitor: C/M (Self Check) : 627B11TDC2P (MKS), 45deg, 1330Pa Pressure Monitor: B.A. Gauge (CM Calibration) : BPG400 (INFICON), 2.0x10-5 ~ 0.1Pa Pressure Monitor: N,41A13DGA2AA040 (MKS), no process impact Pressure Monitor: Pressure Switch : 51A11TGA2BA010 (MKS), H2/fluoro gas Gas Box Configuration: Gas line 1- N2 1000 sccm-AERA FCD985CT-BF Gas line 2- C4F8 200 sccm-AERA FC-D985CT-BF Gas line 3- Ar 2000 sccm-AERA FC-D985CT-BF Gas line 4- O2 50 sccm-AERA FC-D985CT-BF Gas line 5- CH2F2 30 sccm-AERA FC-D985CT-BF Gas line 6- CHF3 200 sccm-AERA FC-D985CT-BF Gas line 7- CF4 200 sccm-AERA FC-D985CT-BF Gas line 8- C4F8 50 sccms-AERA FC-D985CT-BF Gas line 9- C3F8 50 sccms-AERA FC-D985CT-BF Gas line 10- C4F6 50 sccm-AERA FC-D985CT-BF Gas line 11- O2 1000 sccm-AERA FC-D985CT-BF Gas line 12- Ar 500 sccm-AERA FC-D985CT-BF Purge: N2 (Process Grade N2) Filter: CNF1004USG4 (Nihon Pall) Regulator: SQMICRO (VERIFLO) Filter (N2): CNF1004USG4 (Nihon Pall) Valve: Primary side(Utility-MFC):Mega mini (FUJIKIN) Valve: Secondary side(MFC-PC):Mega one (FUJIKIN) Piping: Dual Piping (for Gas leak containment, Gas box to Final valve & Exhaust through Gas box) Gas Leak Detection Port: 5 Ports (6.35mm, Swagelok L-type) Final Pressure Switch: 51A (MKS) Pressure Gauge: Bourdon Gauge (with inside finishing) Pressure Gauge: Bourdon Gauge (with inside finishing) 0.4MPa SP3 Gas Line Connection: No GBROR: GBROR Process Kit Configuration: WINDOW, SHIELD DEPO (DRM2) QUARTZ (ES1D05-400022-14) WINDOW DEPO SAF0.5(DRM2) SAPPHIRE (ES1D10-406499-11) SHIELD, UPPER 300MM RING – Quartz (ES3D05-250025-11) Insulator, ESC Enclosure (COC) – Quartz (ES3D05-300142-13) Cover Ring, 360- L (M) – Quartz (ES3D05-300243-11) RING, BTM SHIELD Y-AL, SE (ES3D10-100844-11) PLATE,EXHAUST Y-AL, SE (ES3D10-100845-11) SHUTTER, BTM TYPE Y-AL, SE (ES3D10-101152-13) SHIELD,DEPO (ES3D10-101195-11) Focus Rg, 360-302-COC (ES3D10-201448-13) Insulator, lower T32-BI-NC (ES3D10-202405-13) WINDOW,DEPO CLP/Y2O3-100P(N) (ES3D10-350344-12) SCREW PIN LOCK, Cerazol: Ceramic (ES3D10-404011-11) Si Upper Electrode (ES3D10-253020-11) CEL ASSY (ES3D87-052656-11) ESC ASSY (with ceramic pusher pins) (ES3D87-002056-13) Damage/Missing Parts: Non reported, please reconfirm at tool inspection Currently installed.
TEL/TOKYO ELECTRON TELIUS SP 305 SCCM是一种表面安装涂层和蚀刻机,用于创建错综复杂的印刷电路板(PCB)。该装置设有用于多氯联苯和部件运输的传送带,以及用于精确定位的电子视觉系统。该机能够在高分辨率和多层的情况下应用干燥膜光刻胶和液体抗蚀剂,从而实现精细的表面布线。它也可用于元件的后处理,如通孔连接器、焊料掩模等。TEL Telius SP 305 SCCM具有高达400 mm/s的高速晶片处理速度,并通过性能对均匀盲区和/或掩埋区进行过程中控制。它还包括用于精确蚀刻控制的多区域控制器,可实现复杂形状的高精度蚀刻和铣削。该装置还包括视觉对准、孔洞识别、去掉短裤等一系列特殊功能。TOKYO ELECTRON TELIUS SP 305 SCCM配备了基于TELBEANS实时PC的系统,允许方便的用户界面控制。它还包括一个通用模具系统,方便装卸蚀刻电路板。该装置还与多种光阻材料兼容,包括正负色调光敏和液体抗蚀剂。该机设计为连续运行,具有加热基板装载区,具有优化的热边设计,高通量。其激光标记盖片在蚀刻时保护电路板,节省时间和材料。Telius SP 305 SCCM具有直观易用的界面和众多功能,是制造高质量电路板和组件的绝佳设备。
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