二手 KLA / TENCOR 6220 Surfscan #181364 待售

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ID: 181364
优质的: 2001
Non-patterned Wafer Inspection System Model No.: 519928 Compatible for 2", 3", 82mm, 4", 5", 6", 8" Thickness: SEMI standard wafer thickness Material: Any opaque, polished surface which scatters less than 5 percent of incident light Smaller sizes factory-set at time of order Defect Sensitivity: 0.09 micrometer diameter PSL sphere equivalent with greater than 80 percent capture rate Haze/Sensitivity: 0.02 ppm minimum Resolution: 0.002 ppm Repeatability: Count repeatability error less than 0.5 percent at 1 standard deviation (Mean count greater than 500, 0.364mm dia. latex spheres) Count Accuracy: Better than 99 percent (verified with VLSI Standards’ Relative Standard) Spatial Resolution: 50mm spacing, minimum Dynamic Range: 0.07 micrometer to 9,999mm in a single measurement Throughput: 100 wph (200mm) at 0.12mm Contamination: Less than 0.005 particles/cm2 greater than 0.15 mm dia. per single pass Cassette Handling: Single puck wafer handling from two cassettes (one sender/receiver, one receiver) Illumination Source: 30 mW Argon-Ion laser, 488 nm wavelength Operator Interface: Mouse and/or dedicated user keypad Physical Characteristics/Height: 168 cm (66 in.) Shipping Weight: 300 kg (670 lbs) Installation Requirements/Vacuum: 508mm (20 in.) Hg. Electrical: 200-240V, 50/60 Hz Power Requirement: 2 kVA Ducted Venting: Two 102mm (4 in.) exhaust hoses Environment: Class 10 or better 2001 vintage.
KLA/TENCOR 6220 Surfscan是一种晶圆测试和计量设备,可用于一系列晶圆级测量。它基于KLA光学晶片检测系统,结合扫描电子显微镜(SEM)、激光扫描显微镜(LSM)、薄膜测量(TFM)等不同光学技术,检测和量化晶片上的缺陷。KLA 6220 Surfscan有多种应用。它可以测量一系列表面参数,包括表面平面度、阶梯高度、线宽、表面缺陷和扩散特性。这为晶圆过程控制和缺陷度量提供了关键反馈。该单元具有快速傅立叶变换(FFT)分析和屏幕到图像比较的数据处理能力。它还可以通过使用高级算法和自动化来最小化运算符偏差错误。6220提供强大的功能来提高晶圆性能。它可以利用基于软件的模式识别快速对缺陷进行分类和分类。它还能够快速测量单个晶圆上的多个测量点。此外,它还提供了在晶片上执行复杂自动化例程的能力,如现场级半定量化、晶片映射和平面化分析。TENCOR 6220 Surfscan可用于多种应用,包括模对模、芯片对芯片、封装对模和原子对原子测量。它能够从不同的系统和网络传输数据,并具有用于测试结果的大存储容量。此外,它还配备了一系列保护系统,以提高可靠性并减少停机时间。6220 Surfscan专为在晶圆测试和计量中高效使用而设计。它是一种经济高效的自动化机器,专为可重复性和准确性而设计。其先进的光学技术提供了检测和量化晶片缺陷的能力。此外,它还具有内置的数据处理能力和先进的模式识别和快速测量技术。
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