二手 ESEC 3088iP #9091742 待售
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ID: 9091742
优质的: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP是一种全自动化、低容量、精密的线材粘合器,能够产生可靠、高质量的粘合剂。它采用了一种专有的高速多步自动工艺，用于银、金和铝线的粘合。ESEC 3088I P的卓越设计能够针对特定的组件,因此非常适合高密度组件和大型组件。3088 IP具有最高的粘结精度,可执行可重复、高速、精确的粘结条件。ESEC 3088 IP采用硬化钢制成的四轴头和先进的伺服控制止动设备,确保了粘结力的恒定和可重复性。头部还设计了一个目标拟合系统，允许更精确地对准粘合垫，从而实现完美的粘合结果。3088iP还具有直观的用户界面、用户友好的图形操作单元以及速度能力高达每秒60个周期的运动控制机器。该工具易于学习和操作，用户界面允许快速、轻松地进行设置和编程。图形用户界面提供错误代码和视觉反馈,以便用户可以随时检查计算机的状态。3088I P非常适合各种制造环境,尤其是医疗设备、电气/电子和汽车OEM。它是市场上最可靠、准确、最具成本效益的电线绑定器之一。该机设计可靠、灵活、产品高效。因此,它是要求苛刻、精细的焊接要求的理想选择.
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