二手 KARL SUSS / MICROTEC ABC 200 #9204391 待售
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ID: 9204391
晶圆大小: 8"
Wafer bonder, 8"
Optimized for aligned fusion bonding
Adhesive
Thermo compression
Anodic triple stack bonding
SUSS MICROTEC MHU 200AA179
FL Current: 100.0 A
Interrupt capacity: 5 kA
Maximum individual load: 6.5 A
GENMARK GB8-MT-80050601 Manipulator
(6) Module stations
Input:
Vacuum 8 mm 150 mbar
Nitrogen 8 mm 100 PSI
8 Bar: 120 PSI
Air 8 mm 120 PSI
8.25 Bar maximum 110 PSI
7.5 Bar minimum
SUSS MICROTEC Pressure switch S1001EBR10-018
GENMARK Automation system controller, P/N 980010658A2 MDL Large
GP Robot firmware version: GB8YPE - 6.38 beta 8
Supply voltage: 208 VAC, 60 Hz, 4 Wire, 3-Ph
SUSS MICROTEC CP200 06,1006225
Interrupt capacity: 14 kA
FL Current: 6.8 A
Maximum individual load: 6.5 A
SIEMENS Sitop
OMARON CPM2C
(2) 20EDR
(2) TS001
Supply voltage: 208 VAC, 50/60 Hz, 1-Ph
(2) SUSS MIROTEC SB150/200 06,1000344
TYCO 2M50FC Boards
Input for N2 7 bar maximum
Air 7 bar maximum
Vacuum 100 mbar maximum
Power: 230 V at 25 A / Phase
SUSS MICROTEC BA200 Plus Gen II 06,1025253
FL Current: 25 A
Maximum individual load: 2.5 A
XYZ Microscope left:
AEROTECH ES16434-3
ALS10020 / ALS10008 / ABL10025
XYZ Microscope right:
AEROTECH ES16434-4
ALS10020 / ALS10008 / ABL10025
AEROTECH ES16434-11
ALS1000 Style linear motor stage
75 MM-NO HC-LT-M-Y-CM
Right micro: 6/9, 6/24 6/2, 6/25 6/1, 6/6, 6/5, 6/26 6/3, 6/27 6/4, 6/8, 6/7, 6/20 6/2, 6/13, 6/12 6/1, 6/11, 6/10, 6/17, VAK, 6/12
Left micro: 6/9, 6/4, 6/3, 6/6, 6/5, 6/1, 6/2, 6/8, 6/7, 6/12, 6/13, 6/23 6/4, 6/22 6/3, 6/5, 6/8, 6/15, 6/7, 6/6
Supply voltage: 208 VAC, 50/60 Hz, 4 Wires, 3-Ph
(2) SUSS MICROTEC SB150/200 06,1000344
Interrupt capacity: 10 kA
FL Current: 20 A
Maximum individual load: 17.5 A
HITECH INSTRUMENTS K1550 Gas analyzer
HITECH INSTRUMENTS Z1030 Oxygen analyzer
Dual heater power controller: 06, 1002223
FESTO ADVU-50-20-P-A, 000000, 00156552 VN41, Pmax=10 bar / 145 PSI
GSM057-L/08/06 Reactor
Supply voltage: 208 VAC, 50/60 Hz, 4 Wires, 3-Ph
Includes:
(4) GOODRICH ITAR Sensors
(2) NAVITAR 1-60350IR Lenses
(2) NAVITAR 1-62922 2X F-Mount lenses
NAVITAR 1-62922IR 2X F-Mount lens
(2) NAVITAR 1-60350IR With MITUTOYO M plan apo NIR 10x / 0.26
(3) Bonder covers
VIEWSONIC VX2239WM: (3) Displays
PROMIS ID FG41018 Chuck
PROMIS ID FG41003 Chuck
TSA BA Chuck
EDWARDS XDS10 Pump
(2) BOC EDWARDS XDS10C Pumps
(2) Perfection WM-4042-61: 04/08, 09/05 Cassettes
ERGOTRON Manipulator table
LAUDA WK1200 Circulation chiller.
KARL SUSS/MICROTEC ABC 200是一种专业级、先进的晶圆粘合剂,用于精确的粘合应用。它为晶圆键合微结构和MEMS结构提供了0.3微米位置精度的高精度对准。它采用模块化设计,配备全自动对齐和组装设备,使粘合器能够处理各种粘结过程。该粘合剂支持多种模模和模底粘合工艺,包括几种类型的共晶以及热压和阳极粘合。它被设计成特别具有精确的重复性和0.01-0.1%的收益率。MICROTEC ABC200具有强大的激光烧蚀系统,用于精确对准和重复,以及专有的真空机器人装置,用于精确处理晶片,包括纳米片和MEMS结构。它具有集成的X-Y定位机,精度和可重复性为0.03微米,可精确装配。晶圆尺寸范围(直径117毫米至200毫米)支持大多数行业标准晶圆尺寸。它能够用氧化铝层或其他可粘结材料将厚度范围高达10微米的晶片粘合到500微米。KARL SUSS ABC-200还提供了一种先进的自动化控制工具,能够与众多附件进行交互,从而可以轻松自定义已建立的流程参数。它拥有两个7英寸触摸屏显示屏和两个行业标准逻辑端口,允许用户直观地编程和控制晶圆粘合过程的各个方面。为了全面了解整个绑定过程,MICROTEC ABC-200提供了一整套监控和记录功能以及实时流程分析选项。KARL SUSS ABC 200是用于先进晶圆粘合应用的一种用途极为广泛且可靠的粘合器。它提供了卓越的精度,可重复性和产量与集成的自动化控制资产,确保高效,可靠的晶圆结合过程。
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