二手 TDK AFM 15 #9083098 待售
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ID: 9083098
Flip chip packing system, 5", 6", 8" & 12"
Mounting tact time: 0.75sec / chip
Mounting precision: ± 7μm / 3σ
Footprint: 0.99 m2
12" wafer capacity of:
Chip (Chip): MAX: 2.5W × 2.5D × 1.0Tmm
MIN: 0.3W × 0.3D × 0.1Tmm
(Option: Max 7.0W × 7.0Dmm)
Substrate (substrate): MAX: 180W × 120D × 3.0Tmm
MIN: 50W × 50D × 0.3Tmm
(Option: MAX 8 inch Wafer)
Mounting tact Time (installation cycle time): 0.8sec / chip
(Including 0.2sec process time)
Accuracy (accuracy): ± 7μm / 3σ
MAX Load (maximum load): 25N (option: 50N, 100N)
Chip Supply (chip supply): 5,6,8.12inch wafer etc.
Wafer magazine auto loading
Standard Features:
Pre-heating units
Bonds heater table
Automatic nozzle cleaning
Ultrasonography
Bump height measurement collapse
Bump-free detection
Bad mark detection
Wafer Sita axis correction
Wafer expansion
Hot blow
Monitoring the nozzle surface
Local area network
Nozzle engagement counter
Production management data
Option and Special Features:
Magazine loading / unloading
High-efficiency air filter
Static eliminator
Profile Monitor (USA, load, bump height)
Chip Tray Supply
Map data (irregularities between the bonding machine, etc.)
Bonds nozzle heater
Substrate (package) special fixtures
Bond test (pre, post)
Bonds nozzle polishing jig
Ultrasonic horn (for large chip.
TDK AFM 15是一种全自动接触粘合器,专为半自动、大容量的产品装配而设计。它设计精确度和一致性,在紧凑的占地面积内实现高水平的可靠性和准确性。该设备能够生产线键、铝片键、耦合键、板对板以及其他基于板的组装工艺。TDK AFM-15是一种即插即用设备,托管在3轴XY-table运动系统上。该粘合器具有精密的粘合头，能够实现10微米的z轴放置精度。该单元提供广泛的粘合功能，包括焊料、环氧树脂和激光，以及包括圆形、扁平和切丁在内的各种线材尺寸、材料和线材极性。AFM 15有一台完全由计算机控制的机器,具有广泛的设置库,允许为可重复的大批量生产预编程配方。除了自动化的刀具设置和设备匹配外,AFM-15还为电线粘合提供了全方位的可编程功能,如功率级别、色带大小、电线速度、预知、厚度补偿和表面光洁度。该资产可容纳单线或双线粘合，钢丝-钢笔直径范围从12毫升（约0.3毫米）到35毫升（约0.9毫米）。该粘合剂与包括TPE、Eutectic、SnPb在内的各种无铅焊料化学物质以及类似糊状的焊料化合物兼容。TDK AFM 15装在密封铝钢模组中，旨在将振动和其他环境扰动降至最低。电源需求由内置电源调节，输入电压为220-240 VAC 50/60 Hz。该设备具有自我诊断功能,确保持续可靠的操作,并包括安全模型以帮助防止意外生产错误。设备符合RoHS、REACH和WEEE标准。
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