二手 JFP MICROTECHNIC PP-1 #9212083 待售

Epoxy die bonder With micro placer Picking and placement: Delicate IC devices Laser diodes / Sensors Micro-mechanical parts Micrometer X & Y stage bases Single head: Single / Dual camera Dual head: Stamping / Dipensing Stamping Rotary dish Adjustable blade Eject system for wafer Options Mini-gripper pickup tool Automatic place stepper Motorized table kit Inspection camera & zoom System: Table top machine / Stand alone Motorized transfer arm & vertical Z Vacuum tool holders: PP5 Series Dummy cycle: 700 cph Throughput: 300 p-400 p / hour Die and substrate: Minimum component size: 100*100 µm Component size: 20 mm Wafer sorter: 8" Work holders: Height adjustable Working area: 200 x 300 (mm) External timer controller Manually handled Gel pack / waffle pack Vision: Field of view: Adjustable Optical resolution: 4µm/pixel / 1.5µm/pixel Maximum field of view: 11 m / 4 mm (2) CCD Color cameras high resolution Digital cross hair Adjustable digital video box generators (2) TFT Monitors, 17" Features Low picking force: <7 g Slow touch down speed for delicate device Repeat ability: +/- 15 µm Place force adjustable Platforms for: Compact laser bar stacker / Unstacker Characterization / Test of lasers High flexibility and controlled parameters Interface / Guide menu on PC Power: 100 / 230 VAC, 300 watt Dry air: 5 bar Vacuum: 70%.