二手 ESC ELAS #9131115 待售

製造商
ESC
模型
ELAS
ID: 9131115
晶圆大小: 6"-8"
RF / DC Sputtering system, 6"-8" RF Magnetron RF Diode operation Loadlock cryo pump, 8" Chamber, 10" Rectangular Heliarc welded 304 Stainless steel plate: 16 mm View-port: Pyrex window Pump-out port: 225 mm Diameter Load lock: 2-Level elevator Non-coated pallets loaded on upper level Processed pallets unloaded from lower level VITON O-ring Feedthrough: Linear bellows Magnetically coupled drive Drive: Hydraulics Low pressure drive Motion: Loading and unloading Fully-automatic computer controlled Capacity: Diameter wafers: 6-150 mm Diameter wafers: 4-200 mm Drive: Precision DC motor With optical encoder feedback control Chain drive Labyrinth shielded Option: DC Bias / RF Bias Coating speed: 3-350 cm/min, Bi-directional Vacuum system: Load lock CTI-CRYOGENICS Cryo-Torr 8 Vacuum pump Vacuum valve: 6" ASA (7-1/8" Diameter) Gate valve Electro-pneumatic operation Valves: 1-1/2" Bellows sealed Electro-pneumatic operation Roughing pump: 27 CFM (762 l/min) With process chamber Main chamber: CTI-CRYOGENICS Cryo-Torr 10 Vacuum pump Vacuum valve: ASA Gate valve, 10" Electro-pneumatic operation for gas throttling Load lock and cryo regeneration: 27 CFM Mechanical pump Anti-back-streaming trap for mechanical pump 1-1/2" Bellows sealed electro-pneumatic operation Etch platform: Moves vertically to engage / Disengage the pallet Cooling: Water-cooled Material: Stainless steel Insulator: Pyrex Dark space shield: Stainless steel Residual gas analyzer RF Generator: Continuously-rated and specifically designed for sputtering: 1 kW ISM Frequency: 13.56 MHz FCC and OSHA DC Magnetron power supply: ADVANCED ENERGY Pinnacle Power supply, 12 kW System performance specifications: Process parameter control ranges: Description / Minimum / Maximum / Units Sputtering pressure / 1 / 90 / Millitor Scan speed (bi-directional) / 3 / 350 / cm/min DC Sput / 100 / 12,000 / Watts RF Sput / 0.02 / 2.10 / kVA - / 0.1 / 2.00 / kW Etch revel (Note 2) / 0.02 / 1.50 / kVA - / 0.1 / 1.50 / kW DC Bias capability: Internal mechanism: DC Power DC Bias activated during DC sputtering Power supplies: 150 V.
ESC ELAS是一种电化学蚀刻/灰化设备,旨在满足现代薄膜电子的精密蚀刻要求。它是一个坚固而高效的蚀刻系统,利用高密度、脉冲直流功率进行快速、均匀的处理。该单元设计用于广泛的蚀刻应用,包括金属、氧化物、聚合物等可蚀刻薄膜材料。该工艺能够实现每分钟高达几百纳米的蚀刻速率,对选择性、深度、线宽和表面粗糙度进行非常精确的控制。ELAS机器是建立在成熟的技术,包括一个密封,铜套躯干绝缘和耐腐蚀。该机组还配备了集成加热元件,以保持稳定的温度和自调压力调节的功率调节蚀刻室。这确保了统一的蚀刻过程,并促进了极其精确的可重复结果。为达到最佳蚀刻速率,该工具采用了多种蚀刻机构,包括化学气相沉积或CVD,以及高温炉工艺。单独控制的惰性气氛允许更长的蚀刻时间,产生更深的蚀刻。或者,在真空环境中使用等离子体蚀刻可以实现效率更高的短时蚀刻。ESC ELAS资产可以处理范围广泛的晶圆尺寸,从小型芯片到大型矩形面板。它还配备了XYZ级,允许在处理过程中精确放置和固定工人。该模型还包括电子束和X射线蚀刻工艺,以获得更精确的蚀刻结果。所有这些功能结合在一起,使ELAS成为精确蚀刻需求的绝佳选择。该装置非常可靠,能够持续产生高质量的蚀刻结果。此外,它允许用户通过高级诊断程序持续监控蚀刻过程,并提供高重复性的结果。因此,它是工业市场上高精度电子生产应用的理想选择。
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