二手 SEZ / LAM RESEARCH DV-38 #9098878 待售
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ID: 9098878
晶圆大小: 12"
优质的: 2006
Etchers, 12"
Power: 400VAC / 3P+N , 63A, 50 / 60Hz
General data
Equipment platform:
(8) Chambers
Handling: Sankyo frontside
(1) Chemistry
Cassette loading:
Operator: Yes
Overhead transport system (OHT): Yes
Fab layout:
Through the wall: Yes
Front machine section:
Front frame:
(3) Load ports
Front section:
Robot & controller
Robot end effector
Main PC
Front FFU
Buffer station
Rear section:
General data for chemical blend module (CBM)
Material: FM-complaint (Mat.: PVDF)
Door hinges: Left
Position of CCC, UPS for CCC and hand shake box: Left
Position of monitor & keyboard: Left
Position of the CBM Type B: Seperate
CBM Type B connected to system: DV38F
Rear section:
ECO
FFU
Control cabinet
Process section Left:
PSL 1:
Process chamber
Chuck
Spindle unit
Dispenser motors
PSL 2:
Process chamber
chuck
Spindle unit
Dispenser motors
PSL 3:
Process chamber
chuck
Spindle unit
Dispenser motors
PSL 4:
Process chamber
chuck
Spindle unit
Dispenser motors
Gas facility box:
Regulators & MFC's
CDS:
Pump,valves, chemistry lines
General data for chemical blend module (CBM):
Material: FM-complaint(Mat.: PVDF)
Door hinges: Right
Position of CCC, UPS for CCC and hand shake box: Right
Position of monitor & keyboard: Right
Position of the CBM Type B: Seperate
CBM Type B connected to system: DV38F
Process Section Right:
PSR 1:
Process chamber
Chuck
Spindle unit
Dispenser motors
PSR 2:
Process chamber
chuck
Spindle unit
Dispenser motors
PSR 3:
Process chamber
chuck
Spindle unit
Dispenser motors
PSR 4:
Process chamber
chuck
Spindle unit
Dispenser motors
2006-2007 vintages.
SEZ/LAM RESEARCH DV-38是一款耐用且可靠的蚀刻和灰化器,可提供一致的高质量加工结果。该设备有单室或双室配置,具有自动或手动晶片安装功能。该系统包括由高速直线电动机驱动的三英寸晶圆卡盘。卡盘能够进行水平、垂直和双向移动,并且该单元提供优化的蚀刻/灰化轮廓,晶圆到腔室间隙为0.005"-0.400"。SEZ DV-38集成了数字晶圆定位机(DWPS)和闭环伺服工具,用于精确的晶圆定位。它拥有集成的过程控制和监控资产,其中包括晶圆温度测量、腔室压力和配方管理。该型号配备了可选的温度和流量控制器,允许精确的处理条件和严格的过程参数控制。LAM RESEARCH DV-38旨在快速、准确地处理标准晶片和探索性晶片。直观的操作员界面允许快速设置和操作,设备设计为直接访问过程参数。该系统还被设计为可扩展的,能够服务于各种外围设备,如抵抗带和平面化系统。提供可选的高压力和低压力配置,允许对高速率过程超压10 torr。DV-38用于半导体晶圆加工,能够提供高性能的蚀刻和灰化工艺。它为实验处理和过程开发提供了一个可靠的平台,能够以批处理或连续处理模式运行。该设备易于安装和维护,能够提供一致且可重复的结果。
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