二手 STS / SPTS Multiplex ICP #9277059 待售
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ID: 9277059
晶圆大小: 6"
Reactive Ion Etcher (RIE), 6"
Process: BOSCH
Type: Automatic
Multiplex ASE-HR, 6”
EBARA A30W Dry pump
EBARA AAL10 Dry pump
No chiller
Chamber:
BOSCH Process
Gas line:
MILLIPORE FC2901 4V Viton 600SF6/300C4F8/100N2/100N2
ENI ACG3B-06 / AS310424
Power supply: 300 W, 13.56 MHz
RF Supply / Matching unit:
ENI ACG3B-06 / AS310424
Power supply: 300 W, 13.56 MHz
ADVANCED ENERGY MN3150011-000N SE / AS306817
Power supply: 500 W, 400 KHz
Chamber substrate, 6"
TRIPOD Mechanical wafer clamp electrode
With He backside cooling
Process chamber:
ICP V2 Unified ISO250
With 100 adapter
LEYBOLD MAG2000CT Turbo pump
EBARA A30W Dry pump
Chamber externals
Includes:
EDWARDS D14641000 Gauge
SMC ZSE6B Pressure switches
MKS E27B17DD5B
NW16 Bypass pump line
Gas box
Lower electrode:
ICP WTC TRIPOD Lift
Substrate clamping / Platen: ICP WTC TRIPOD, 6"
Includes:
MKS 750B11T 10T
MKS 1179A51CR1BV-S: 50 sccm
Upper electrode with aperture mounting
Upper electrode source: ICP Balun
Upper RF enclosure / MU: Balun, 1 kW
Chamber lid: ICP Heated
RF Generators:
Upper: ENI ACG3B-06 / AS310424
Power supply: 300 W, 13.56 MHz
Lower: ADVANCED ENERGY MN3150011-000N SE / AS306817
Power supply: 500 W, 400 KHz
TTI / THURLBY THANDAR INSTRUMENTS TGP110 Pulse generator
Frequency: 10 MHz
Bypass pumping: Automatic NW16
Heated foreline: ICP
NW40 Pumping line
Gasbox: Minimum (4) lines with PFC1 module
EBARA A30W Dry pump
Gases / MFC Size (sccm) / Seal type / Gas type
C4F8 / 300 sccm / Viton / Clean
SF6 / 600 sccm / Viton / Clean
N2 / 100 sccm / Viton / Clean
N2 / 100 sccm / Viton / Clean
Loadlock:
Carousel vacuum loadlock
Carousel loadlock parts: (2) Substrates, 6"
EBARA AAL10 Dry pump
Power supply: 208 V, 3 Phase, 60 Hz.
STS/SPTS Multiplex ICP,又称同步分时并行分时多路复用离子蚀刻Asher,是一种专门的蚀刻器和asher,用于精确蚀刻和灰分微和纳米尺度模式。可用于修改小而复杂形状的微观结构,并用于MEMS、微流体、3D打印等应用。STS Multiplex ICP具有高功率射频发生器,产生高频、高功率离子流。这些离子在材料去除过程中精确蚀刻掉材料,而ICP的车载气体输送设备确保气流在整个过程中均匀分布。此外,ICP高效的计算机控制定时系统使蚀刻和灰化过程保持同步,防止重复过程对设备造成任何中断或损坏。SPTS Multiplex ICP还提供了对沉积厚度和均匀性的精确控制。离子流可以调整到需要沉积的特定区域,同时还提供了根据需要调整流速、离子密度和流速的灵活性。这为用户提供了无与伦比的精确度,使他们能够创建复杂的模式,几乎不会受到污染。Multiplex ICP的计算机控制软件允许用户根据自己的特定应用需求对流程参数进行编程。这使用户能够自定义其蚀刻和灰化过程,以满足其项目的确切要求。软件还跟踪机器性能,并允许用户管理其流程数据,确保每个项目成功完成。总之,STS/SPTS Multiplex ICP是一种专门的蚀刻和灰化器,它为蚀刻和灰化微量和纳米级图样提供了卓越的精度和控制。它是研究人员和工程师寻找可靠和先进的蚀刻和灰化解决方桉的理想工具。
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