二手 ULVAC TDE 300M Custom #9186778 待售

3D Plasma etcher Substrate load station and carrier: Wafer substrate cassette (9) Tubular substrates (Φ1.25mm x 8.5") Parallel fixed spacing: 0.5”-1” Helium gas cooling RF Connection Load-lock isolation chamber: Based on BROOKS VCE-2 (For wafer substrate cassette) Load-lock transfer chamber: Based on BROOKS VTS-4 (Vacuum transfer system) Isolation valve (VAT Series) MESC-compatible rectangular valve Substrate transfer robot (4.5 3-Axis Electro Mechanical Solutions) Control box for RF plasma: Power distribution components: Circuit breakers, relays and PLC modules RF Power supply: RF Antenna power supply: 40MHz, 1 kW Vacuum pumping system: ULVAC LR-90 Load-lock chamber dry pump: Dry vacuum pump Transfer chamber dry pump Process chamber pump Turbo molecular pump Computer control system: Operator interface PC Based user interface Programmable logic controller GE Series Real time control system based on PLC Software: PLC System control software Windows based NT or higher OS DDE Server Process gas inlet system: Internal framed gas box Mass flow controlled gas inlet (4) Process gas lines 316L Stainless steel plumbing, EP, welded with VCR fittings In-line filters With additional process chamber POU filtration Compressed air system: Valve actuation and door seating Cooling system (chiller): Tubular substrate helium gas Dry air cooling system Process chamber: Chamber size: ~59 liters Dual plates Capacity: Coupled plasma Applications: 3-D Tubular substrate dry etching Currently crated and warehoused 2007 vintage.