二手 ULVAC SMI-60H #293647824 待售
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ID: 293647824
晶圆大小: 12"
优质的: 2007
Medium current hydrogen ion implanter, 12"
DI Water circulator
(2) Mass flow controllers
(20) Transfer particles: ±0.2 µm
Ion source head: H2+, 4He+
X-Ray leak rate: 0.6 µSv/h
Gas supply line:H2 / He Gas bottle
Vacuum pumping system:
EBARA AA10N Dry pump
SHIMADZU TMP803M Turbo molecular pump, 800 liter/sec
SHIMADZU TMP1003M Turbo molecular pump, 1000 liter/sec
Process chamber: SHIMADZU TMP3203M Turbo molecular pump, 3000 liter/sec
EBARA AA10N Dry pump Turbo molecular pump 300 liter/sec
Pirani vacuum gauge
Ionization vacuum gauge
End station (Transfer chamber / Process chamber)
Substrate size: 230mm x 180 mm x 0.7 mm
Vacuum transfer system: Vacuum transfer robot
Platen: ESC
Substrate scanning system: Y-Stage
ATM transfer robot
Clean unit
(2) Rorze RV201-F05-004-1 Foup Opener
Notch aligner: for 300 mm and 200 mm
Conversion kit for 200mm / 300mm:
Platen, cooling plate, L/L plate
Vacuum robot pick-up
Maximum beam current:
8mA at 60 keV at H2+
8mA at 35 keV at He+
Beam current stability: ≤±10 % / hour
Implant uniformity: ≤5％ (Distribution of peak depth)
Implant condition: H2+ , 60kV, 3.0E16 ions/cm
Measurement condition: SIMS 5piont (Within wafer)
Mass analyzing capability: H2+, 4He
Substrate size: 230 mm x 180 mm
Dose integrator capability: 1.0E15 –2.0E17 ions/cm²
Wafer tilt angle: 0 to 60° (±1°)
Metal contamination: Surface <5x1010/cm² (Fe, Ni, Cr, Zn, Cu by TXRF)
Implant condition: H2+ ,60keV, 3.0E16 ions/cm²
Ultimate pressure :
Ion Source: 6.7x10-4 Pa(5.0x10-6Torr)
Beam Line: 6.7 x 10-5 Pa(5.0x10-7Torr)
Process chamber: 6.7 x 10-5 Pa(5.0x10-7Torr)
Ion extraction system:
Extraction power supply
Extraction electrode
Beam focusing system:
Einzel-lens
Power supply
Mass analyzer magnet:
Deflection Coil Magnet, 90°
Power supply for magnet: 10V / 60A
Analyzing slit
Post acceleration system:
Acceleration tube
High voltage power supply
Beam focusing system:
Magnetic quadrupole lens
Power supply
Beam monitoring system:
Pre-amplifier
Dose monitor
Control system:
Computer
End-station / Pumping control: Sequencer
UPS For computer
Energy range:
30keV to 70keV (for H2+)
30keV to 35keV (for He+)
Spare parts: Ion source consumable parts
Power: 35~60keV
Dose: 1.0 x 10^15 ~ 2.0 x 10^17 H2+ions/cm²
Max RP: ~600 nm
Manuals included
2007 vintage.
ULVAC SMI-60H是半导体工业中一种领先的离子植入器和监控器。是提供市场上最高植入精度的高性能工具。它旨在提供高效、高精度的离子植入过程，具有卓越的可重复性和最低限度的维护要求。SMI-60H利用先进的控制和加速技术提供了最佳的离子植入工艺。它配备了最先进的光束成形系统，在选择光束轮廓、电场和磁场时允许最大的灵活性。该系统可实现难以置信的精确植入结果,光束碎片可忽略不计。另外，各种类型的离子可以用于各种类型的底物和植入物。ULVAC SMI-60H的用户界面直观易用。玩家可以轻松地快速设置不同植入的过程和参数。它还配备了全面的材料分析功能，以确保最佳的植入结果。此外，综合监测功能确保用户掌握优化流程和改进流程输出所需的所有信息。SMI-60H还配备了智能温度控制系统，确保基板加热到最佳加工温度。这降低了对基板热损伤的潜在风险。此外，它还将植入的颗粒保持在稳定和安全的环境中，从而确保其准确性。ULVAC SMI-60H是为最大的安全性和可靠性而设计的,拥有众多的安全系统和传感器。这允许用户操作设备而不必担心，同时以最小的设备故障机会进行离子植入。此外,该设备的设计效率很高,且设置灵活,能够缩短工艺周期时间,从而确保最大限度地提高生产效率。SMI-60H是一个非常强大和可靠的离子植入器和监控器。它利用先进的技术和功能，实现精确和准确的植入过程，与最低限度的维护所需。由于其直观的用户界面，用户可以快速轻松地设置各种植入并监控结果。综合安全系统确保用户和基板的最大安全。所有这些特性和技术使ULVAC SMI-60H任何半导体行业的理想选择。
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