二手 CANON MPA 600 FA #9060105 待售
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已售出
ID: 9060105
Projection aligner, 6"
Slit: 1.6mm
Includes:
Illumination power check meter, 7”
Focus tilt mask, 7”
DR Mask
Projection system:
Projection mirror:
Total reflection UM02
Magnification: 1x
Image size:
Stationary: Arcuate image 150 mm (L) x 1.6 to 2.0 mm (W), with radius of 95 mm
Scanning: Φ6 (150 mm) Over entire surface, excluding that under (3) disk claws
Magnification: 1x
Effective F number: Fe 3.5
Wavelengths used:
Printing (UV): 365 nm (i-line), 405 nm (h-line) & 436 nm (g-line)
Manual alignment: E-line (546 nm) & orange light
Auto alignment: 633 nm (He-Ne Gas laser)
Illuminator:
Light source:
USHIO ELECTRIC USHY-2002MA 2 kW Super-high-pressure mercury lamp
Illumination range:
Length: 150 mm
Width: 1.6 to 2.0 mm
Radius: 95 mm
Illumination uniformity: Within ±3%
Effective light source: σ = 0.7, σ = 0.6, σ = 0.5
Exposure:
Scanning speed: Φ5" (Φ125 mm)
Setting range: 5.0 - 150.0 sec (for 5" wafer)
Setting units: Uniform 0.1 sec increments
Scanning mechanism:
Feed / Control methods
Closed loop method with DC servo motor drive
Scanning speed: 5.0 to 150.0 sec (25 mm/sec-0.83 mm/sec) for 5" wafer
Carriage position setting:
Setting range: -75 mm to 75 mm
Increment: 0.01 mm
Setting accuracy: ±10 /µm
Alignment scope:
Objective lens: 10x, NA 0.2
Eyepiece: 10x, 15x
Erector lens: 1x, 2x, 3x
Low-magnification lens: 0.3x
Distance between objective lenses:
30 to 109.6 mm (Traveling simultaneously on both sides of center position)
Setting range of objective lens distance: 30.00 to 109.6 mm in 0.02 mm increments
Focusing travel (both fields of view): ±2 mm
Auto alignment:
Laser beam scanning
Light source: He-Ne Gas laser (633 nm), polarized type 5 mW
Dedicated patterns are used for auto alignment
Offset control: Read/write possible in range of 0 to 7.9 /µm
Tolerance setting: 0.25 (0.15) /µm, 0.5µm, 1 µm
Auto alignment time: Within 7 sec
Observation in auto alignment mode possible
Auto feeder:
Auto/manual switching: Automatic / Manual wafer feed selectable
Feed method: Belt & auto hand
Wafer size: 4"-6"
Applicable carrier: FLUOROWARE Type carrier: Standard
Capacity: 25 wafers
Pitch: 3/16"
Projection system focusing:
Focus adjustment: ±1.5 mm
Travel amount obtained by one rotation of knob: 10 µm
Power supply:
MPA-600FA: 200 VAC, 3Φ, 6 kVA, 50/60 Hz
Air supply unit: 200 VAC, 3Φ, 8 kVA, 50/60 Hz.
CANON MPA 600 FA是CANON开发的用于晶圆级封装的高精度掩模对准器。它是一种功能齐全的仪器,具有多种特性和功能,非常适合用于各种设备制造应用程序。佳能MPA600FA利用高分辨率投影对准设备,利用红外光精确投射和对准面罩图桉到晶圆表面。该系统可进行精细的位置调整,并有助于将掩模图桉精确且可重复地对准晶片表面。MPA-600FA还配备了一个大功率激光退火装置,允许用户为各种目的对晶片的选定区域进行热处理。这台机器能够在整个晶片上产生均匀的热量,确保均匀的表面形成,并防止由于温度相关的问题而导致设备故障。MPA 600 FA配备了定制设计的金属面罩支架,使用户能够在对准时将金属面罩精确定位并连接到晶片上。它还具有自动光学步进器,大大提高了对准过程的速度和精度。CANON MPA 600FA还包括一个自动化控制工具,使仪器易于操作和管理。该资产包括一个用户友好的图形界面,允许用户在没有任何事先培训的情况下执行各种操作,如选择参数或控制掩码。CANON MPA-600 FA还提供了多种安全功能来保护用户和设备,包括在操作异常时自动关闭模型和内置除尘器,以防止灰尘和碎屑进入仪器。CANON MPA-600FA是需要高精度遮罩对准仪表的半导体器件制造商的绝佳选择。凭借其强大的功能、精确的对准设备和先进的安全功能,MPA-600 FA是在晶圆级封装应用中实现最佳效果的理想工具。
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