二手 EVG / EV GROUP 620 #9227524 待售

Mask aligner, 6" Top side alignment Large gap alignment Separation distance: 0-300 µm Wafer thickness: 0.1-10 mm Semi automatic loading With mechanical pre-alignment on chuck Storage rack: (5) Aligner tools PC Controlled environment Solid state drive Hard drive Graphical User Interface (GUI) User interface: Keyboard and monitor Large gap alignment: Lamp house: 350 W / 500 W / 1000 W Light integrator for lamp control Light uniformity: 100 mm: ± 2% 150 mm: ± 4% Optical set wavelength range: 350-450 nm Dielectric mirror Field lens, 6" Lamp: 500 W Manual filter changing unit Without filter / Carrier Filter carrier with manual filter changing unit: Carrier with narrow band filter: 365 nm (i-Line) UV Intensity meter without UV probe: Support use of UV probes (Simple PnP) No UV probe included UV Intensity meter probe Single channel probe: 365 nm Alignment stage with precision micrometers: Alignment in X, Y and Θ with micrometer spindles Motorized Z-axis Automatic wedge compensation system for print gap control Adjustable WEC and exposure contact force EVG Aligner microscope resolution factor -2 Digital signal processing Digital zoom capabilities Standard backside alignment: Crosshair and overlay processes Top side microscope: Motorized split field microscopes for alignment in visible light Anti vibration table: Adjustable height Plate natural stone Polished with (4) pneumatic cushions Central air supply (4) Pressure regulators For mounting of earthquake protection devices CCD Cameras: Top and bottom side Objective position storage Travel range of top side microscope: X: 30 (8) -150 mm Y: -70 / +70 mm Objective: 5x Mask holder: 7" x 7" Masks with loading frame Mask contact area: Hard coated and lapped surface finish Bottom loading system with automated vacuum transfer Exposure of wafers: Round opening UNIVERSAL Wafer chuck, 6" with spacers Wafer contact area: Hard coated and lapped surface finish With windows for bottom side alignment Integrated proximity spacers for wedge error compensation in wafer Vacuum contact with substrates up to 1.5 mm thickness.