二手 EVG / EV GROUP 6200 Infinity #9189343 待售

Bond aligner, 8" Wafer to wafer aligner: Subsequent wafer bonding applications General: Software adjustable Wafer separation distance: 0 - 300 μm Wafer thickness: 0.1 - 4.4 mm Total stack thickness: 4.5 mm Semi automatic loading with mechanical prealignment Quick change of chuck Automatic pressure Vacuum transfer Alignment accuracy: ± 1μm High process objectives NRTL Listing mark: UL STD 61010A-1 Storage rack: (5) Aligner tools Software: MS-Windows PC Controlled operating environment Self explaining commands Remote diagnostics1 Software for bond alignment: Recipe parameters User guidance Optical alignment: (2) Wafers Silicon direct bonding (SDB) Substrate configurations: Si+Glass, Si+Si Subsequent anodic Thermo-compression Fusion bonding processes: EVG 500 series bond system Nanoalign technology package: High performance frame grabber running COGNEX PatMax vision software technology Increases EVG aligner microscope resolution: Factor ~2 Image quality: 100 % Digital signal processing Key identification feature: Multi layer alignment key design Scaled (Over / Under etched) alignment keys Enhanced digital zoom capabilities Crosshair mode: Standard backside alignment processes Alignment stage motorized: Alignment stage: X, Y, theta, Z Joystick alignment: Via (3) axes DC Motor controllers: Cursor key fine alignment Automatic wedge compensation system: Optimized print gap control WEC Contact force: 0.5 - 40 N adjustable Shift between mask and wafer: No Automatic alignment for top / bottom side: Vision system (Integrated in PC) Storage: Trained mask Substrate patterns on hard disk Software integrated in EVG 6200 computer controller Alignment marks: Top / Bottom side alignment Alignment results: Process conditions Material properties Bottom side microscope: Motorized splitfield microscopes Visible light with high resolution CCD cameras Digitized alignment keys (Mask) / Cross hair Travel range: X: 78 mm - 180 mm Y: ± 12 mm (2) Objectives: 5x (3.6x - 20x) Objective: 3.6x: Field of view per objective: ~ 1.5 mm x 1 mm Rack unit: Integrates EVG 6200 system Operating elements Monitor vibration isolated Prepared for robotic auto load system Bond tool universal, 8": Anodic Thermo compression Silicon direct bonding process Bond chuck with mechanical clamping Loading chuck Separation flags Currently warehoused 2008 vintage.