二手 EVG / EV GROUP 6200 #9238655 待售

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製造商
EVG / EV GROUP
模型
6200
ID: 9238655
晶圆大小: 4"-8"
优质的: 2017
Semi automated double side mask aligner, 4"-8" Manual handling High resolution top and bottom side split field microscopes Constant power and intensity dose mode Wafer thickness: 0.1 - 10 mm (For top side configuration only) Semi automatic loading with mechanical pre-alignment on chuck Quick change of mask and chuck Storage rack for up to (5) aligner tools PC Controlled operating environment Graphical User Interface (GUI) for visualization User interface including keyboard and monitor Lamp: 1000 W Hg Objective: 10x Standard exposure modes: Vacuum contact Proximity Hard Soft 500 W-1000 W Light source: Lamp house for 500 W / 1000 W Hg or HgXe lamps Supports various optical sets Including light integrator for accurate lamp control Light uniformity better than ±3% for 6" wafer and ±4% for 8"wafer Adjustment plate for UV probes with diameter 44.5 mm and maximum height 16 mm Optical set for wave length range: 350 - 450 nm Field lens, 8" Dielectric mirror Fly's eye lens Alignment stage: Fully motorized X, Y theta and Z alignment stage via three axis joystick With DC motor controllers for cursor key fine alignment Automatic wedge compensation system designed for optimized print gap control Adjustable WEC and exposure contact force Automatic alignment for top and / or bottom side includes COGNEX patmax: Vector based image recognition Storage of trained mask and substrate patterns on hard disk Comply with user definable alignment marks for top and bottom side alignment Key identification feature for multi layer alignment key design For scaled (Over / under etched) alignment keys Easy operation with menu assisted training of mask and wafer alignment marks Alignment results are dependent upon process conditions and material properties Nano align technology package: Increases EVG aligner microscope resolution by factor ~2 (for improvement of alignment results or extended depth of focus) Improved image quality due to 100 % digital signal processing Enhanced digital zoom capabilities Supports cross hair and overlay mode for standard backside alignment processes Mask holder for 9 x 9" masks with loading frame: According to EVG standard design: Round opening for exposure of wafers Hard coated and lapped surface finish for mask contact area Bottom loading system with automated vacuum transfer Vacuum contact wafer chuck 8": According to EVG standard design: For manual wafer loading with pre-alignment aid Hard coated and lapped surface finish for wafer contact area With Windows for bottom side alignment Supports proximity soft hard and vacuum contact exposure Seal for vacuum contact Supports vacuum contact with substrates up to 1.5 mm thickness Mask holder for 7 x 7" masks with loading frame: According to EVG standard design Round opening for exposure of wafers Hard coated and lapped surface finish for mask contact area Bottom loading system with automated vacuum transfer Mask holder for 5 x 5" masks with loading frame: According to EVG standard design Round opening for exposure of wafers Hard coated and lapped surface finish for mask contact area Bottom loading system with automated vacuum transfer Vacuum contact wafer chuck 4"-6": For manual wafer loading with pre-alignment aid Hard coated and lapped surface finish for wafer contact area With Windows for bottom side alignment Supports proximity soft hard and vacuum contact exposure Seal for vacuum contact Supports vacuum contact with substrates up to 1.5 mm thickness Exposure uniformity: Wafer: Up to < ±3% across, 6" Up to < ±4% across, 8" Top side microscope: Motorized split field microscopes for alignment in visible light With high resolution CCD cameras for top and bottom side Travel range of top side microscope: X: 30 (optional 8) - 200 mm Y: ± 75 mm Bottom side microscope: Motorized split field microscopes for alignment in visible light With high resolution CCD cameras Travel range of bottom side microscope: X: 30 (8) mm - 154 mm Y: ± 12 mm Spare parts: Qty Description (3) Tension springs (4) Tension springs d1, 4/De15, 4/Lo49/R0,6 (5) O-Rings 3x2 (5) O-Rings 2x1 (1) Lip seal, 6" (2) Lip seals, 8" (1) Lip seal, 4" (2) Micro switches SPDT 1p (1) Temperature switch (2) Rotary switches CA4 A722-600-FS4 (5) G-fuse 7000135 T4A 250V 5x20 (5) G-fuse 7000135 T2.5A 250V 5x20 (1) Pneumatic cylinder (2) Micro switches SPDT 1p (1) Ellipsoid mirror 8'' EOF 390-4-AF (1) Motor MGK 1616E012S /900:1 16/5 M16/5 09 (1) Cutting insert (1) Power supply (3) Pneumatic cylinders (2) Pneumatic cylinders DSNU-16-40-P-A (1) Power supply 100W, 12 VDC TXL-12S (1) MGK 1524E012SR +15/8-485: 1 +IE2-512 (2) Light barriers (1) Trackball 816TC712 11 0 USB (2) Couplings WAC 10-3-3 (1) MGK 2342S024CR+23/1-14:1+IE2-16 (1) Linear measurement system DIT30.73 0.5 um (4) Pressure sensors (2) Light barriers (1) Power supply 24 VDC, 230 W (2) Light barriers (2) Proximity switches (2) Proximity switches (1) Adjustment unit 9POI Sub-D mate l=15 cm (1) Suction cup unit WEC (2) Thermo couple units TKI 05/25 Type K (1) Timing belt 6 T2, 5-200 (4) Operation manuals 2017 vintage.
EVG/EV GROUP 6200是一种蒙版对准器,是一种先进的设备,设计用于光刻行业中使用的标线或蒙版的对准、曝光和开发。此计算机是通用的,配置为满足用户的特定需求。它是制造电路、元件和零件等用于先进半导体应用的微加工工艺的理想工具。EVG 6200具有高分辨率的图样投影仪,可以准确地将图样投射到掩模最陡峭的侧面。这种投影是由于电子面罩对齐器而实现的,它使用户能够准确地将面罩对齐基板,确保它能够精确、精确地配合。高分辨率投影也保证了高画质。EV GROUP 6200提供了许多其他功能,以确保制造质量和安全性能。例如,该系统采用独特的"集成成像技术",它结合了许多光学、机械、电气和软件组件。它还包括一个自动对准器,它不断校准投影和光学元件,确保最大精度。6200配备了高级操作模块,用户可以控制口罩的位置、方向和倾斜。它还配备了机械臂,用于面罩和基板的精确和连续对准。这样可以精确地暴露口罩,并确保结果与印刷电路板完全一致。此外,EVG/EV GROUP 6200还具有多种安全功能,如洁净室空气单元、自动卡纸检测、自动防止过度暴露以及其他提高机器准确性和安全性的保护机制。为支持其前沿性能,掩码对齐器具有基于Windows的人机界面、灵活的极性反演范围和全面的故障报告工具。综上所述,EVG 6200是一款高级且精密的掩码对齐器,使用户能够以最高的精度和精确度对齐掩码。此资产提供卓越的准确性和精确度、精确控制、安全功能以及易于使用的用户界面。对于需要精密微加工的人来说,它是一个很好的工具。
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