二手 EVG / EV GROUP IQ #9138247 待售

看起来这件物品已经卖了。检查下面的类似产品或与我们联系,我们经验丰富的团队将为您找到它。

製造商
EVG / EV GROUP
模型
IQ
ID: 9138247
Nano imprint lithography system, 8" Top-side alignment only Manual load Wiring removal Basic unit 200mm: Flat screen:17" Self Diagnostics during machine startup Automatic initialization:All motors,encoders,limit switches,sensors and pneumatic Remote diagnostics Quick change:Stamp holders and imprint chucks EC declaration of conformity PC controlled operating environment Solid state drive and hard drive Earthquake protection device Software: MS-windows Process software ,processing and diagnostics Automated recording Storage of files in hard disk or network Password protected Internal wedge compensation unit: Automatic wedge compensation Motorized alignment stage: X,Y,T alignment High resolution alignment (3) axis joystick Reinforced stage drives Top side microscope: Fully motorized split field microscope Travel range X: 90-200mm* Travel range Y: -10-100mm* (3) axis joystick control Display and storage of microscope position (2) Objective 5x Automatic alignment for top and / or bottom side: Vision system Storage of stamp and patterns on hard disk Top and bottom side alignment Stamp and wafer alignment marks Large gap alignment capability: Alignment at substrate separations >50um Alignment during UV molding Alignment during UV bonding Manual wafer loading capability: Motorized swivel arm software integrated (2kg) Manual substrate loading/unloading Wafer loading trays Wafer loading frame for 200mm wafers/stamps: Manual wafer loading on chuck process integrated substrate vacuum fixing Notch or flat with pins External wafer thickness measurement station: (3) Point wafer thickness detection Contact less imprinting (3) Sensors adjustable range :150-200mm Designed Warped substrate :1mm Manual Operation Sensors range: up to 10mm manual system only 500W-1000W Light source NUV: Lamp house :500w or 1000w NUV range:280-450nm Optimized parallel Light:+/-3% on 150mm and +/-4% on 200mm Adjustable plate: diameter 44.5mm and max.height 16mm Optical set for wave length range 350-450nm: NUV and DUV light sources Field lens:200mm Dielectric mirror Fly's eye lens Stamp holder for 200mm UV hybrid lens molding: UV molding automated de-embossing function Hard coat surface finish Quartz backplane Imprint chuck for 200mm wafers/stamps: Bottom chuck: 200mm wafer Top side alignment Hard coat surface finish Manual and automated loading Software for UV hybrid lens molding: UV molding process flow Designed for puddle dispense Recipe parameters and user guidance Software to compensate with specified tolerance Force control capability up to 400N: Load cells implemented Maximum controllable imprint: 400N Force control during imprint Force control during UV exposure UV molding software Tooling for 200mm UV bonding,stamp fabrication and MLM: Top substrate holder Special quartz backplane with edge vacuum groove Mechanical clamping Vacuum supply to backplane via tube Software for master and sub-master replication: UV molding process flow Tooling for polymer stamp fabrication Software to compensate product within specified tolerance Software for UV monolithic lens molding: UV molding process flow UV molding tools for puddle dispense Recipe parameters and user guidance Software to compensate with specified tolerance Diffuser plate for tooling for stamp fabrication + MLM: Tooling for stamp fabrication + MLM Diffuser plate onto backplane prior to UV exposure step Diffuser plate for hybrid lens molding tooling: Hybrid lens molding tooling Diffuser plate onto backplane prior to UV exposure step Recipe controlled microscope illumination spectrum: Contrast improving illumination system Increased pattern visibility Improved alignment reliability (3) Adjustable LED light sources per microscope Autom.Arm for puddle dispense and de-ionization: Motorized swivel arm Software integrated Programmable dispense arm/nozzle Puddle dispense of imprint material: up to 4 lines Right-hand side alignment Host ionization system Ionization system: Ionization nozzle with power supply De-ionizing of stamp and substrate Syringe dispense system: Syringes :up to 3 (2) Dispense lines Universal resists applications Resist with short shelf life time Programmable dispense rate Adjustable suck back Different resist and polymer viscosity Chemistry cabinet: Housing with front door access Encapsulating of syringe dispense systems / arm Exhaust port Prepared for later pump upgrade Pre-installed weight cell 2011 vintage.
EVG/EV GROUP IQ Mask Aligner是一款高精度、高通量的晶圆级光刻设备,用于半导体行业对芯片、晶体管等电路元件等小型器件进行阵列设计。这种先进的工具提供超高分辨率的高线边缘粗糙度(LER)和覆盖精度,以提高设备性能和产量。利用先进的晶片级、激光干涉仪进行精确的晶片对准和运动控制,采用同步的步进重复方法,以快速、可重复的方式将所需图像投影到晶片上。EVG IQ Mask Aligner使用分束透镜将激光引导到矩形镜面上,该镜面将其反射到蒙版和光刻涂层晶片上,同时曝光,允许创建高级多层图样。光束分裂透镜也提供了一个光源到面罩和晶圆,使每一个暴露在光刻系统的光源光束的全强度。EV GROUP IQ Mask Aligner能够在标准对齐器上打印低于50 nm的特性,或者使用专用设备打印低于30 nm的特性,非常适合制造先进的IC和MEM设备。为了达到这样的小特性,该单元利用强大、高保真的数字步进电机来驱动镜头和曲柄机构,以精确地移动晶片,使晶片与晶片对齐,并进行拍打。这样就可以实现高度准确和可重复的打印过程。晶片由真空卡盘保持在适当位置,同时使用对准激光器调节晶片的位置,并确保它与掩模精确对准。这允许从打印到打印的真实迭加测量。最后,使用额外的紫外可见激光器扫描广泛的掩模和晶圆特征,减少打印之间的时间,使晶圆能够快速高效的处理。IQ Mask Aligner提供了卓越的模式精度,包括± 5nm的线宽控制和小于1nm的LER。该机也具有很高的可靠性,使用寿命超过20年。凭借快速的吞吐量能力和先进的平版印刷控制,该工具能够快速地制作出准确、复杂的图样。因此,它是寻求高精度、高通量晶圆级光刻解决方桉的半导体领域的一个宝贵工具。
还没有评论