二手 EVG / EV GROUP IQ #9138247 待售
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ID: 9138247
Nano imprint lithography system, 8"
Top-side alignment only
Manual load
Wiring removal
Basic unit 200mm:
Flat screen:17"
Self Diagnostics during machine startup
Automatic initialization:All motors,encoders,limit switches,sensors and pneumatic
Remote diagnostics
Quick change:Stamp holders and imprint chucks
EC declaration of conformity
PC controlled operating environment
Solid state drive and hard drive
Earthquake protection device
Software:
MS-windows
Process software ,processing and diagnostics
Automated recording
Storage of files in hard disk or network
Password protected
Internal wedge compensation unit:
Automatic wedge compensation
Motorized alignment stage:
X,Y,T alignment
High resolution alignment
(3) axis joystick
Reinforced stage drives
Top side microscope:
Fully motorized split field microscope
Travel range X: 90-200mm*
Travel range Y: -10-100mm*
(3) axis joystick control
Display and storage of microscope position
(2) Objective 5x
Automatic alignment for top and / or bottom side:
Vision system
Storage of stamp and patterns on hard disk
Top and bottom side alignment
Stamp and wafer alignment marks
Large gap alignment capability:
Alignment at substrate separations >50um
Alignment during UV molding
Alignment during UV bonding
Manual wafer loading capability:
Motorized swivel arm
software integrated
(2kg) Manual substrate loading/unloading
Wafer loading trays
Wafer loading frame for 200mm wafers/stamps:
Manual wafer loading on chuck
process integrated substrate vacuum fixing
Notch or flat with pins
External wafer thickness measurement station:
(3) Point wafer thickness detection
Contact less imprinting
(3) Sensors adjustable range :150-200mm
Designed Warped substrate :1mm
Manual Operation
Sensors range: up to 10mm
manual system only
500W-1000W Light source NUV:
Lamp house :500w or 1000w
NUV range:280-450nm
Optimized parallel Light:+/-3% on 150mm and +/-4% on 200mm
Adjustable plate: diameter 44.5mm and max.height 16mm
Optical set for wave length range 350-450nm:
NUV and DUV light sources
Field lens:200mm
Dielectric mirror
Fly's eye lens
Stamp holder for 200mm UV hybrid lens molding:
UV molding automated de-embossing function
Hard coat surface finish
Quartz backplane
Imprint chuck for 200mm wafers/stamps:
Bottom chuck: 200mm wafer
Top side alignment
Hard coat surface finish
Manual and automated loading
Software for UV hybrid lens molding:
UV molding process flow
Designed for puddle dispense
Recipe parameters and user guidance
Software to compensate with specified tolerance
Force control capability up to 400N:
Load cells implemented
Maximum controllable imprint: 400N
Force control during imprint
Force control during UV exposure
UV molding software
Tooling for 200mm UV bonding,stamp fabrication and MLM:
Top substrate holder
Special quartz backplane with edge vacuum groove
Mechanical clamping
Vacuum supply to backplane via tube
Software for master and sub-master replication:
UV molding process flow
Tooling for polymer stamp fabrication
Software to compensate product within specified tolerance
Software for UV monolithic lens molding:
UV molding process flow
UV molding tools for puddle dispense
Recipe parameters and user guidance
Software to compensate with specified tolerance
Diffuser plate for tooling for stamp fabrication + MLM:
Tooling for stamp fabrication + MLM
Diffuser plate onto backplane prior to UV exposure step
Diffuser plate for hybrid lens molding tooling:
Hybrid lens molding tooling
Diffuser plate onto backplane prior to UV exposure step
Recipe controlled microscope illumination spectrum:
Contrast improving illumination system
Increased pattern visibility
Improved alignment reliability
(3) Adjustable LED light sources per microscope
Autom.Arm for puddle dispense and de-ionization:
Motorized swivel arm
Software integrated
Programmable dispense arm/nozzle
Puddle dispense of imprint material: up to 4 lines
Right-hand side alignment
Host ionization system
Ionization system:
Ionization nozzle with power supply
De-ionizing of stamp and substrate
Syringe dispense system:
Syringes :up to 3
(2) Dispense lines
Universal resists applications
Resist with short shelf life time
Programmable dispense rate
Adjustable suck back
Different resist and polymer viscosity
Chemistry cabinet:
Housing with front door access
Encapsulating of syringe dispense systems / arm
Exhaust port
Prepared for later pump upgrade
Pre-installed weight cell
2011 vintage.
EVG/EV GROUP IQ Mask Aligner是一款高精度、高通量的晶圆级光刻设备,用于半导体行业对芯片、晶体管等电路元件等小型器件进行阵列设计。这种先进的工具提供超高分辨率的高线边缘粗糙度(LER)和覆盖精度,以提高设备性能和产量。利用先进的晶片级、激光干涉仪进行精确的晶片对准和运动控制,采用同步的步进重复方法,以快速、可重复的方式将所需图像投影到晶片上。EVG IQ Mask Aligner使用分束透镜将激光引导到矩形镜面上,该镜面将其反射到蒙版和光刻涂层晶片上,同时曝光,允许创建高级多层图样。光束分裂透镜也提供了一个光源到面罩和晶圆,使每一个暴露在光刻系统的光源光束的全强度。EV GROUP IQ Mask Aligner能够在标准对齐器上打印低于50 nm的特性,或者使用专用设备打印低于30 nm的特性,非常适合制造先进的IC和MEM设备。为了达到这样的小特性,该单元利用强大、高保真的数字步进电机来驱动镜头和曲柄机构,以精确地移动晶片,使晶片与晶片对齐,并进行拍打。这样就可以实现高度准确和可重复的打印过程。晶片由真空卡盘保持在适当位置,同时使用对准激光器调节晶片的位置,并确保它与掩模精确对准。这允许从打印到打印的真实迭加测量。最后,使用额外的紫外可见激光器扫描广泛的掩模和晶圆特征,减少打印之间的时间,使晶圆能够快速高效的处理。IQ Mask Aligner提供了卓越的模式精度,包括± 5nm的线宽控制和小于1nm的LER。该机也具有很高的可靠性,使用寿命超过20年。凭借快速的吞吐量能力和先进的平版印刷控制,该工具能够快速地制作出准确、复杂的图样。因此,它是寻求高精度、高通量晶圆级光刻解决方桉的半导体领域的一个宝贵工具。
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