二手 HTG 84-3 #9198923 待售
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ID: 9198923
优质的: 1986
UV Mask aligner
With microscope
UV Lamp power supply
High resolution
Sub-micron printing
Contact and proximity exposures
Scale production alignment capability
Silicon, GaAs, LiNb, InP
Consistent printing:
Wafers
Rectangular substrates
Odd sized / Brittle materials
Single or split field viewing
Up to 600x magnification on the optics
Alignment accuracy: ±1 µm
Precise wafer to mask leveling
Highly collimated UV/deep UV exposure systems
Two channel intensity controlling power supply systems
Stationary alignment tooling
Vibration isolation console
Differential micrometers
Self planarizing chucks
Wafer chuck and mask holder included
Wafer chuck motions:
X, Y, Z and ø (direct drive)
Z-Axis adjustment: ±750µ
Air-bearing planarization system
Wafer / Substrate size: Up to 6.0" wafers / Square substrates
Mask rotation: 180°
Mask size: 7.0" x 7.0"
Vacuum mask clamp
Pneumatic mask assembly lift
Front side alignment accuracy: <0.5µ
Printing resolution:
Near UV: <0.8µ
Mid UV: <0.4µ
Deep UV: <0.3µ
Control functions:
Power
Test
Substrate vacuum
Mask vacuum
Contact vacuum
Expose
Cycle
Skip
Mask lift
N2 Purge
Timer:
000.1 to 999.9 sec
0.1 increments
Gauges:
System vacuum
Contact vacuum
N2
1986 vintage.
HTG 84-3是半导体器件制造过程中使用的掩模对齐器。它是一种先进的工具,能够以最高的精度和精确度对半导体掩模进行对准和阵列化。84-3的主要部件包括一个掩模对准主单元、一个真空室和一个真空设备。掩模对准器主单元由X-Y级、激光对准系统、真空单元组成。掩模对准主单元负责将掩模、激光投影机和真空对准级移动到真空室内的适当位置。激光投影工具由激光源、准直仪和一系列将激光束投射到掩模和晶圆上对准的透镜组成。激光源通常是氦-硼(He-Ne)激光器。准直器用于将激光束聚焦在掩模或晶圆的小直径上。激光投影资产还包括一个检查模型,用于检测掩模和晶圆的位置和形状的不规则性。检查设备由一系列摄像机组成,这些摄像机能够捕获掩模和晶片的图像,然后将图像与预先编程的数据进行错误比较。真空室用于密封掩模和晶片,以便精确对准。该腔室包含一个真空系统,它可以防止压力累积,从而干扰对准过程的精度。真空装置还保护掩模和晶片免受尘埃颗粒或其他碎片的污染。HTG 84-3非常精确,能够将掩模和晶片对准0.0025mm的精度。机器也很快,能够在0.2秒内对准掩模和晶片,并且可以用于各种应用,如接触和非接触掩模。总体而言,84-3是一款用途广泛且可靠的掩模对齐器,旨在提供卓越的性能和准确性。其精度和精确度使其成为半导体器件制造的宝贵工具。
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