二手 KARL SUSS / MICROTEC MA 6 / BA 6 #9226441 待售

Mask aligner Manual alignment stage: Automatic wedge compensation system: Contact / Without contact (Mask and wafer) Alignment gap program: 1 - 1000 Micron 1 Micron resolution Movement range mask aligner mode: X ±10.0 mm, Y ±5.0 mm, Theta ±S" Movement range bond aligner mode: X ±3.0 mm, Y ±3-0 mm, Theta ±3° Machine base with mechanical, pneumatic and electrical equipment Adapter system: Mask holders: Up to 7" x 7" maximum TSA Microscope stage: X, Y Manipulator (Motorized) Manual rotation Wafers / Substrates: Manual loading and unloading Microprocessor control with LCD display Lithography applications Wafers: 2" Up to 150 mm Diameter Substrates: 2" x 2" Up to 6" x 6" Bond application Wafers: 3" Up to 150 mm diameter Operator manual on CD BSA Microscopes with working distance 33 mm Alignment stage: X, Y Theta WEC Head for BSA microscope objective separation in X direction 15 mm to 100 mm Motorized Z axis Bottom side alignment system: Separation in X: 15 mm - 100 mm Travel in Y: - 20 mm to + 50 mm Motorized focus: 6 mm Enhanced Image Storage System (EISS): PC With image and fine focus control M 306 / 8, DVM 6/8 and BSA TFT Flat screen, 17" Integrated trackball S-VGA Resolution: 1280 x 1024 SUSS DVM6 Microscope: (2) CCD Cameras Objective separation: 47 to 140 mm Single objective UMPL FLI Working distance: 20 mm Exposure unit: Wafer / Substrate: 150 mm Exposure lamps: Up to 500 W 2018 vintage.