二手 KLA / TENCOR Candela CS20 #9389552 待售

Surface measurement system, 2"- 8" Thickness: 350 µm to 1,350 µm Defect sensitivity: 0.08 µm Diameter PSL Sphere equivalent: ≥ 95% Capture rate Surface topography: >2Å Ra sensitivity Parameters: Ra, Rq, Wa, Wq Film thickness uniformity (Single layer): 5Å <Thermal oxide < 1000Å Depth of focus: Maximum ±15 µm under bow Repeatability: CV ≤ 5.0 % Edge exclusion: Imaging (No exclusion) Defect analysis, varies with wafer size (Nominal: 2"= 1.5mm, 8"= 5mm) Defect types: Particles Scratches Stains Pits Bumps Scratches: 100 µm long, 0.1 μm wide, 50Å deep Pits: 20 µm Diameter, 50Å deep Stains: 20 µm Diameter, 10Å thick Illumination source: 50 mW Laser 405 nm Wavelength R-Θ Coordinates Coordinate precision: 80th percentile ≤150 µm Coordinate accuracy: 80th percentile ≤150 µm Spatial resolution: Minimum ≥ 10m spacing at outer edge of 8" Single channel particle measurements Robotic wafer handler, 2"- 8" Operator interface: Trackball and keyboard LCD Monitor, 19" 2012 vintage.