二手 CYBEROPTICS SE 300 Ultra #293742440 待售

3D Solder Paste Inspection (SPI) system Board thickness: 0.5-5 mm Underside component clearance: 25.4 mm Conveyor speed range: 150-450 mm/sec Conveyor height: 889 to 990 mm Laser range: 640-870 nm Maximum inspection area: 508 x 503 mm Maximum pad size in FOV: 5 x 10 mm Extended height range sensor Micropad sensor Mechanical board stop Auto-width adjust conveyor Rear-fixed rail conveyor Uninterruptible Power Supply (UPS) Panel size capacity: Maximum: 508 x 508 mm Minimum: 101 x 40 mm Board edge clearance: Top: 2.5 mm Bottom: 3 mm Typical inspection speeds: High speed: 29.0 sq. cm/sec High resolution: 16.0 sq. cm/sec Unload and fiducial: 3-4 sec X and Y Pixel size: High speed: 40 microns High resolution: 20 microns Field of view: 10 x 20 mm Paste height range: 50-350 microns Optional sensor: 50-610 microns Height resolution: 0.125 microns Maximum board wrap: 6.35 mm 2008 vintage.