二手 AMAT / APPLIED MATERIALS Vantage Radiance #293586616 待售

ID: 293586616
Rapid Thermal Processing (RTP) system, 12" Process: RadOx (2) Chambers Wafer type: SNNF Platform type: Vantage 3.X Position A and B: (V352) RadOx2 Chamber A and B process: Toxic RP OHT WIP Delivery Dual 2-slot active cool down station E99 Docked reading capability Load port: SELOP 7 Load port operator interface: Standard (8) lights Configurable colored lights Top air intake system Upper E84 interface enabled OHT Upper E84 PIO sensors and cables E99 Carrier ID: TIRIS With RF Operator access switch 4-Color configurable light towers Interface A option Out the back connection type: RP Out the back connection H2 (2) Water cooling chambers RP Integration hardware: Chamber A and B Standard RAGB rear light tower Vantage skin: (2) Toxic chambers IPUP Transfer pump Open loop tuner MFC type: STEC Core anneal and RTO Monitor 1: Flat panel with keyboard on stand, 17" Monitor 2: Flat panel on stand, 17" Monitor 1 & 2 cables: 25 ft with 16 feet effective No RTP Abatement Unit SEMI F47 Semi S2 compliance RTP Chamber type: Radiance RadOx 2, 12" Technology option: Open loop tuner MFC Type: STEC Core anneal and RTO Rotation type: WRLD Toxic Low flow O2: 5 SLM High flow O2: 50 SLM Oxygen analyzer H2: High flow Low flow Side inject No process N2 for flammable MNFLD Gas pallet type: TOXIC RP Common gas pallet No MWBC improvement kit Chamber integration lines: RadOx2 RP Pump cable: 81 Feet Base ring: RadOx2 base ring Line 1 / N2 (N/O), 50 SLM Line 2 / O2, 50 SLM Line 3 / O2, 5 SLM Line 6 / H2, 15 SLM - side inject high flow Line 7 / H2, 22 SLM - high flow Line 8 / H2, 2 SLM - low flow Line 10 / N2 (P/P), 30 SLM Restrictor Line 11 / He, 30 SLM Line 12 / N2 (BP), 50 SLM Line 13 / N2 (Maglev), 100 SLM Docking station FST install kit Does not include Hard Disk Drive (HDD) 2013 vintage.
AMAT/APPLIED MATERIALS Vantage Radiance是一种用于半导体器件制造的快速热处理器(RTP)。它产生快速的加热和冷却循环,对于晶圆级设备的商业化生产至关重要。RTP是一种单晶片快速热退火系统,具有大石英管、红外灯阵列及相关光学器件,以及控制半导体层灯加热均匀性的可调平台。其有效工艺温度范围为0°C至900°C,工艺时间为5-60秒,晶圆表面均匀度为+/-1 °C。AMAT Vantage Radiance采用了精密的计算机控制和热壁真空室,以确保温度精度和环境完整性。其红外灯提供高强度、均匀的时空辐照度,使晶圆级均匀性极佳。其热墙真空设计确保了清洁和无污染物的环境,在加工过程中不需要氮气或氦气气氛,从而提供了低拥有成本和高效率。RTP的设计目的是以均匀的温度分布、优异的晶圆级均匀性和广泛的工艺温度提供高速和可重复的退火结果。它采用先进的清洁室技术,为高速工艺优化提供了更高的工艺保真度、可重复性和性能,包括用于工艺优化的高精度光谱匹配。APPLIED MATERIALS Vantage Radiance还配备了广泛的诊断和控制系统,提供有关温度、工艺时间和能耗的实时数据。它包括自动化样品加载和晶圆交换、工艺和热循环调度以及工艺验证等功能。此外,一个独特的诊断系统可提供流程反馈,并且可以安全地远程访问,以监督系统性能并远程调整流程参数。Vantage Radiance是一款小巧坚固的RTP,专为可靠生产高性能半导体器件而设计。它拥有成本低、精度高、自动化方便,是半导体器件生产的理想工具。
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