二手 AMAT / APPLIED MATERIALS Vantage Radiance #293587172 待售

ID: 293587172
Rapid Thermal Processing (RTP) system, 12" Process: RadOx (2) Chambers Wafer type: SNNF Platform type: Vantage 3.X Position A and B: (V352) RadOx2 Chamber A and B process: Toxic RP OHT WIP Delivery Dual 2-slot active cool down station No remote control system E99 Docked reading capability Load port: SELOP 7 Load port operator interface: Standard (8) lights Configurable colored lights Top air intake system Upper E84 interface enabled OHT Upper E84 PIO sensors and cables E99 Carrier ID: TIRIS With RF Operator access switch 4-Color configurable light towers Interface A option eDiagnostic Out the back connection type: RP Out the back connection H2 (2) Water cooling chambers RP Integration hardware: Chamber A and B Standard RAGB rear light tower Vantage skin: (2) Toxic chambers IPUP Transfer pump Open loop tuner MFC Type: STEC Core anneal and RTO Monitor 1: Flat panel with keyboard on stand, 17" Monitor 2: Flat panel on stand, 17" Monitor 1 and 2 cables: 25 ft with 16 feet effective SEMI F47 Semi S2 compliance RTP Chamber type: Radiance RadOx2, 12" Technology option: Open loop tuner MFC Type: STEC Core anneal and RTO Rotation type: WRLD Toxic Low flow O2: 5 SLM High flow O2: 50 SLM Oxygen analyzer H2: High flow Low flow Side inject No process N2 for flammable MNFLD Gas pallet type: TOXIC RP Common gas pallet No MWBC improvement kit Chamber integration lines: RadOx2 RP Pump cable: 81 Feet Base ring: RadOx2 base ring Line 1 / N2 (N/O), 50 SLM Line 2 / O2, 50 SLM Line 3 / O2, 5 SLM Line 6 / H2, 15 SLM, Side inject high flow Line 7 / H2, 22 SLM, High flow Line 8 / H2, 2 SLM, Low flow Line 10 / N2 (P/P), 30 SLM Restrictor Line 11 / He, 30 SLM Line 12 / N2 (BP), 50 SLM Line 13 / N2 (Maglev), 100 SLM Docking station FST install kit Does not include Hard Disk Drive (HDD) 2016 vintage.
AMAT/APPLIED MATERIALS Vantage Radiance是一种快速热处理器,旨在在半导体制造过程中快速高效地加热晶圆。它是市场上最先进的热处理系统之一,为芯片制造商提供了许多功能和优势。AMAT Vantage Radiance具有高功率、快速热处理炉,设计用于传递均匀热量,最高温度范围可达1300 °C。这伴随着每步不到0.1秒的快速斜坡时间,使其能够快速准确地达到温度设定点。这有助于缩短晶圆循环时间,使芯片制造商能够制造更先进的半导体器件。APPLICED MATERIALS Vantage Radiance还配备了Advanced Control Equipment,允许操作员管理和控制热处理所需的各种过程和条件。这包括多种监测条件的工具,如温度、压力、气流和晶圆表面条件。该系统还允许校准炉子的烹饪参数,以确保每批晶片的最佳性能。此外,Vantage Radiance利用了一个专利的多过程控制单元(MPCS),它可以对多个晶圆同时运行进程。这样可以快速同时加热多个晶片,而不会影响热过程的准确性和控制。MPCS还具有不同工艺步骤的热配方,可快速生成一致的结果。总而言之,AMAT/APPLIED MATERIALS Vantage Radiance是一款先进的快速热处理机,旨在提高半导体制造的效率和性能。AMAT Vantage Radiance凭借其高功率炉、高级控制机和多过程控制工具,能够快速、准确地满足各种热处理需求。
还没有评论