二手 STEAG / MATTSON / AST 2800 #9159583 待售
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ID: 9159583
Single chamber RTP system, 8"
Dual load lock
Facilities / General configuration:
30L N2 High:
50psi @ Facilities, 2bar @ tool, dynamic (full N2 flow)
60psi @ Facilities, 2.8bar @ tool, static (no N2 flow)
10L O2 High:
40psi @ Facilities, 2bar @ tool, dynamic (full O2 flow)
42psi @ Facilities, 2.5bar @ tool, static (no O2 flow)
O2 Low: 40psi @ Facilities, 2bar @ tool, dynamic (full O2 flow)
42psi @ Facilities, 2.5bar @ tool, static (no O2 flow)
10L Ar:
40psi @ Facilities, 2bar @ tool, dynamic (full Ar flow)
43psi @ Facilities, 2.5bar @ tool, static (no Ar flow)
CDA:
Facilities: 90psi
Tool: 5.5 Bar
Chamber high cool:
Bottom: 17/18 m3/h
Top: 26/27 m3/h
Chamber H20 cooling:
Facilities: 6.8LPM
TC Amplifier test with omega meter:
Setpoint Feedback
1000C 1001.5
800 800.5
600 599.6
400 398.8
O2 Sensor final testing:
30L N2 flow in chamber @ 30 second: 3ppm O2
5L N2 flow in chamber @ 60 seconds: 4-5ppm O2
Robot station names:
A: Primary sender
I: Secondary receiver
F: Furnace
D: Cooling station 0
No cooling station 1
C: Dummy wafer station
Pyrometer calibration:
Un-calibrated pyrometer check: Pyro 878C output at 1080TC with emis1300
Calibration recipe: TOMCAL.2
Calibration file: TRCAL0923
Network setup:
Serial GemSecs
Expansion board: COM8
GEMBOX.INI Host: localhost
SHSCFG.INI Gembox host: localhost
RTP:
No physical dummy wafer station
MFC:
TYLAN Gas panel
TYLAN O2 Sensor
EQUIPE 307 robot
No swivel cassette stations
Gasbox above rear of tool: (supplies MFCs):
N2, N2, O2, H2Mix, Ar
Facilities connections at bottom rear of tool:
CDA: SWAGELOK 90-120PSI, 1/4"
PCWS: SWAGELOK 8slpm, 1/2"
PCWR: SWAGELOK 60-120PSI, 1/2"
PCWS: SWAGELOK, 1/2"
PCWR: SWAGELOK, 1/2"
HiFlow N2: SWAGELOK >90PSI, 1/2"
Cooling N2: SWAGELOK 10-30SLPM, 1/4"
Vent1 / Vent2 (Acid exhaust): SWAGELOK, 3/8"
11/2 Inch exhaust: 11/2 Inch tube Acid exhaust
Middle bottom of tool:
Blower output (Heat exhaust): 4" Tube
Front of tool:
House vacuum: SWAGELOK 600 mbar, 1/4"
Electrical requirements:
Power consumption: 43 kVA
Voltage: 208 VAC, 3 Phase
Current per phase: 125 A
125 Max fusable
Missing parts:
(1) Endeffector universal, 47900058
(1) Tube AST furnanec 8in, 58700001
(2) Quarts tray elbow, MATTSON Technology, 58800003
(1) Tray quarts wafer, MATTSON Technology, 58900085
(1) Plate top liner plates, LTD Materials, Inc., 11823-000
(2) Fiber optic cable IPC-ILC, 19200195
(1) Plate hotliner 8 IN, MATTSON Technology, 47800189
(1) Pyrometer AST 2800, MATTSON Technology, 17000164
(1) Controller AST Pre-Aligner, ESC-201
(1) Harddrive AST SEAGATE 160GIG, ST3160318AS
(1) ILC, PCU 2.4g SEIMENS, ILC-3
(1) Robot, ATM-307, PRI, ATM-307
(1) Pre-Aligner, 8 inch, PRI, PRE-201B
(1) Temp controller PCB
(6) IGBT
(2) Outer door panels.
STEAG/MATTSON/AST 2800快速热处理器是一种半导体处理工具，用于电子行业的先进应用。它专为生产当今先进的半导体芯片以及未来最苛刻的封装而设计。AST 2800由两个主要组件组成：热控制系统和应用室。热控制系统具有较高的温度均匀性和温度稳定性以及较低的热梯度和快速、可重复的上升和下降时间。STEAG AST2800具有-160°C至700°C的精确、灵活的温度范围,即使是最精细的晶片和组件也能处理。它还具有精确的时间和温度控制功能,可为各种流程提供精确的设置。针对中高功率剖面和快速热循环时间对热控制系统进行了优化,从而提高了吞吐量。应用室有四个独立可控的区域，即底部、顶部、惰性和氮气，还包括用于引入用于环境控制的气体的工艺端口。该腔室可随时确保压力稳定性,并为各种工艺提供灵活性。它还为加载、卸载和处理晶片和组件提供了广泛的选项。2800 Rapid Thermal Processor非常适合先进的高级封装应用,例如Cu支柱和无芯翻转芯片附件,也非常适合大批量生产需要。凭借其高分辨率的温度控制能力和坚固的腔室设计，AST2800是最苛刻的芯片生产的完美工具。
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