二手 STEAG / MATTSON / AST 2800 #9205415 待售
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ID: 9205415
晶圆大小: 8"
RTP System, 8"
Configuration:
Dual load lock single chamber RTP
General configuration:
30L N2 High:
50psi / 2Bar / Tool, dynamic (Full N2 flow)
60psi / 2.8Bar / Tool, static (No N2 flow)
10L O2 High:
40psi / 2Bar / Tool, dynamic (Full O2 flow)
42psi / 2.5Bar / Tool, static (No O2 flow)
O2 Low:
40psi / 2Bar / Tool, dynamic (Full O2 flow)
42psi / 2.5Bar / Tool, static (No O2 flow)
10L Ar:
40psi / 2Bar / Tool, dynamic (Full Ar flow)
43psi / 2.5Bar / Tool, static (No Ar flow)
CDA:
90psi
Tool: 5.5bar
Chamber high cool:
Bottom: 17/18 m³/h
Top: 26/27 m³/h
Chamber H20 cooling: 6.8LPM
TC Amplifier test
With Omega meter
O2 Sensor final testing:
3ppm O2: 30L N2 Flow in chamber in 30 second
4-5ppm O2: 5L N2 Flow in chamber in 60 seconds
Robot atation names:
A: Primary sender
I: Secondary receiver
F: Furnace
D: Cooling station 0
Cooling station 1 (No cooling station 1, used for dummy station)
C: Dummy wafer station
Pyrometer calibration:
Un-calibrated pyrometer check: Pyro 878C output at 1080TC
With emis 1300
Calibration recipe: TOMCAL.2
Calibration file: TRCAL0923
Network setup:
Network ID / Machine name: 03AST
Facility name:
Serial gemSecs used
Expansion board: COM8
AST 01 and 02 RTP:
Physical dummy wafer station: No
Cooling station: Dummy wafer station C
Gas panel: TYLAN MFC's
Robot:
Equipe 307
No swivel cassette stations
Install connections: 03AST
Gasbox above rear of tool: Supplies MFCs
N2
O2
H2 Mix
Ar
Connections at bottom rear tool:
CDA: 1/4" Swagelok / 90- 120psi
PCWS: 1/2" Swagelok / 8slpm
PCWR: 1/2" Swagelok / 60 - 120PSI
PCWS: 1/2" Swagelok
PCWR: 1/2" Swagelok
HiFlow N2: 1/2" Swagelok / >90PSI in operation
Cooling N2: 1/4Inch Swagelok / 10 - 30 slpm
Vent1: 3/8" Swagelok / Acid exhaust
Vent2: 3/8" Swagelok / Acid exhaust
11/2" Exhaust / 11/2" / Tube acid exhaust
Middle bottom of tool:
Blower output / 4" Tube / Heat exhaust
Front tool:
House vacuum / 1/4" Swagelok / 600 mbar
Power supply: 43KVA / 208VAC / 3 Phase / 125amps / 125 Max fusable.
STEAG/MATTSON/AST 2800快速热处理器是一种用于半导体材料厚膜高速处理的工具。它允许在高效的热环境中对薄膜进行热处理,提供快速的斜坡速率并消除热梯度。处理器具有内置的空气再循环技术,可确保表面加热过程中的温度均匀。处理器的温度传感器消除了热梯度的影响,使其更加可靠。高达900°C和1350°C的高温范围使得厚膜能够快速热处理。它还具有低压氧化、还原和氮化区,允许在加工过程中进一步制造和应用材料。处理器具有可变冷却源和控制器,以及用于温度控制的附加冷却源。它还提供各种强制气体冷却系统,包括空气和氮气。用户可以根据应用程序选择冷却量。AST 2800的另一个特点是其内置的多区域可编程软件。这允许在不同温度下处理不同的薄膜厚度,每个区域都有自己的控制器。用户还可以使用预先安装的程序来快速设置时间和协调不同温度过程中的多种配方。处理器提供可调节的晶片盒式磁带支架,以确保平整和均匀的处理。它还能够启动、拆卸和正面讲课过程。自动机接口允许全面晶片传输和卸载。STEAG AST2800是一个有价值的工具,有利于各种行业,如化合物和有机半导体。用于电介质、金属等材料的快速热加工,允许新型半导体材料的制造和应用。易用性和准确性使各种行业的生产和效率得以提高。
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