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AMAT / APPLIED MATERIALS Centura 200 EPI
ID: 9384326
优质的: 2021
PECVD System, 8" Chambers: Chamber A: ATM Epi Chamber B: ATM Epi Chamber C: ATM Epi Chamber F: Single slot cooldown STD Transfer Wide body loadlock System voltage: 480V Frequency: 60Hz Transformer capacity: 480V to 208V / 300Amps CB1 Current rating: 300 Amps Leak detectors: Gas panel, H2 Mainframe exhaust: H2 Clean room monitor: TFT Stand alone Maintenance room monitor: TFT Stand alone Gas panels: Gas panel type: Configuable FUJIKIN Gas panel exhaust position: CH-A (Only for configurable type) Platter mixer Platter chamber-A Platter chamber-B Platter chamber-C (2) Mixed dopants (1) Silicon source Fujikin FCST Main H2: 100 slm Slit H2: 30 slm Minimum HCl: 1 slm Maximum HCl: 30 slm TCS: 20 slm Dope (INJ): 300 sccm Dope mixer (SRC): 500 sccm Dope mixer (DIL H2): 20 slm Pressure transducer (gauge) range: 0-45 Cabinet exhaust switch type: AMAT Mainframe: EPICREW Blower and heat exchanger Blower voltage: 480 VAC YASKAWA Variable speed blower Mainframe cabinet exhaust: Channel A side AMAT Lamp fuse tray and fuses AMAT Lamp C/B AMAT Lamp contactor AMAT Lamp harness assembly AMAT Gas lines (From gas panel to floor plate) AMAT Chamber tray AMAT Facilities water supply/Return connections Stainless steel water fittings Remote frame: CB1 Current rating: 300 Amp Umbilical cable length: 25 Feet V452 SBC Board AMAT Video card SSD 1 GB Hard Disk Drive (HDD) Chamber interface board: Chamber A, B and C AMAT SCR Driver AMAT SCR C/B AMAT SCR Contactor with fuses AMAT H/A Breaker to contactor Load lock chambers: Universal platform Wide body Wafer mapping Wafer slide detect Fast backfill Cooldown chamber: Type: Non-contact Center finder : On-the-fly N2 Purge restrictor size: 5 slm Transfer chamber: Transfer chamber lid hoist Robot type: HP AMAT Slit valve N2 Purge restrictor size: 5 slm x 3 Chamber A: Wafer sizes: 8" Standard process: ATM Ushio -B3G Lamps Rotation rev.R3.4 Exhaust line cone baffles (ATM) Reflector cones SWAGELOK Isolation valve Chamber B: Wafer size: 8" Standard process (ATM) USHIO B3G Lamps Rotation rev.R3.4 Reflector cones SWAGELOK Isolation valve Chamber C: Wafer size: 8" Standard process (ATM) USHIO B3G Lamps Rotation rev.R3.4 Reflector cones SWAGELOK Isolation valve Pallets for FUJIKIN: Model / Positions / Process gas / MFC Size FCST / 1 / H2 / 20000 FCST / 3 / H2 / 500 FCST / 5 / HC1-Hi / 30000 FCST / 6 / HC1-Lo / 1000 FCST / 7 / H2 / 100000 FCST / 8 / H2 / 30000 2021 vintage.
AMAT/APPLIED MATERIALS Centura 200 EPI(外延工艺集成)设备是一种晶圆级、基于真空的加工反应器,用于在半导体晶圆上提供层的外延沉积。这种晶圆制造反应堆是专门为提高电介质膜、金属膜和复合半导体材料(如砷化氙、砷化铝,以及改用氘基化合物)的性能、可靠性和吞吐量而设计的。适用于广泛的行业,包括微电子、光电、电信、生物电子等。该系统旨在克服维持高增长率同时保持沉积物质均匀分布的困难。该工艺为多晶硅和二氧化硅的多层提供了支持,并为超薄层的生长和多向外延操作提供了能力。它还提供高温热处理选项,如退火和通道。AMAT Centura 200 EPI使用射频(RF)激发源实现高通量增长率。该单元利用单壁圆柱形加热室,其中多个小型间接等离子体发生器沿该室的方向产生均匀的电场。均匀的电场和高效的射频耦合使得APPLIED MATERIALS Centura 200 EPI适用于低温和高温过程。该机在能耗方面也很高效,能够实现低成核密度,具有较高的沉积选择性。利用附带的软件控制,可以在非常低的副产品形成下实现层的均匀性和稳定性。此外,Centura 200 EPI可以与其他沉积系统结合使用,采用高密度基板的群集配置。该工具采用模块化体系结构设计,可实现自动化选项,包括基于机器人的晶圆处理。它采用紧凑、坚固的外壳,适合集成到洁净室工作流程中。AMAT/APPLIED MATERIALS Centura 200 EPI由强大的真空资产提供动力,可全面控制晶圆温度和工艺参数。总体而言,AMAT Centura 200 EPI模型提供了一种非常可靠的外延沉积解决方桉,适用于广泛的应用。它高效的能耗和模块化的体系结构使其成为需要可靠和一致性能的设备制造商的理想选择。
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