二手 AMAT / APPLIED MATERIALS Centura AP Ultima X #9162819 待售
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ID: 9162819
晶圆大小: 12"
优质的: 2005
HDP-CVD System, 12"
System SW Rev.: 3.7_31
Factory interface (FI)
(2) 12" FOUP Load-ports
Enhanced 25-slot FOUP support
8-Slot wafer Pass-Thru / Storage
Hermos with RF E99 carrier ID
Upper E84 sensors & cables
Overhead transport WIP delivery system (OHT)
Wafer handling robots: (2) Kawasaki with Edge Grip
Pre-Aligner (Single axis)
Status lamp (DeviceNet, Color configurable, Left-Side pole mounted)
Light curtain
Front facing intake plenum
Mini-Environment with automatic pressure control
12" Centura AP M/F:
Robot: VHP (Std Reach ver)
Robot blade type: Conductive alumina
Clear Lid
Process chamber isolation: Dual pressure VAT Bellows
336 Al slit valve inserts
Umbilicals:
Heat exchanger: 65ft
Heat exchanger hoses: 50ft
Pump: 65ft
Facility connections: AP Front, Thru-the-floor
System safety: M/F AC Dist. Box with LOTO CBs
Std INTLK system
EMO Push turn to release
User interface:
UI-1: Roll-Around stand, Flat panel / Keyboard
UI-2: Thru-the-Wall, Flat panel
Chambers:
LLKA: SWLL (Cool down only)
LLKB: SWLL (Cool down only)
A: Ultima X HDP-CVD (Z7)
B: Ultima X HDP-CVD (Z7)
D: Ultima X HDP-CVD (Z7)
Load locks:
Type: SWLL (AP ver)
Cool-Down enabled
Door type: AP Std
Lid type: Std viewport Lid
VAT Bellows
336 Al slit valve inserts
Process chambers:
Ch-A / B / D: Ultima X HDP-CVD (Z7)
IR Diagnostic
(01) Oxide ¡V USG STI with He / H2
Astron RPS
MKS (ENI) Spectrum power supplies
Turbo pump: Shimadzu H3603L
Turbo CNTRL: Shimadzu
Gas box config:
Gas panel feed: Bottom
Exhaust: Bottom
MFCs: Unit 8565C
Valve type: Veriflo
Filter type: Millipore
Controller type: DeviceNet
Gas lines (Ch-A/B/D):
#1: N2 (pure), #2: O2 (pure), #3: H2 (pure), #4: SiH4, #5: He (pure), #6: He (pure)
#7: Ar (pure), #8: SiH4, #9: O2 (pure), #10: NF3, #11: NF3, #12: N2 (pure)
Heat exchanger / Chiller:
(2) SMC Heat exchanger
Pumps:
Txfr: (1) Alcatel A100L iPUP
Alcatel pump interface box
(2) Equipment racks (Ultima version)
(1) AC Rack
Facilities UPS Interface
Power requirements: 200/208VAC, 3-Phase, 400A, 4-Wire, Freq 60Hz
Primary 400A Drop for 1-2 Process chamber support
Options:
Hynix specific configured FI status lamp
Power vaccine (1s power off time delay)
CE-Marked
2005 vintage.
AMAT/APPLIED MATERIALS Centura AP Ultima X是一种高性能沉积工具，设计用于半导体和微电子制造中金属和介电膜的快速精确沉积。该设备为一系列先进工艺技术（包括介电沉积和金属沉积）提供卓越的"一流"性能,以满足具有挑战性的设备要求。AMAT Centura AP Ultima X配备了最新的功能，包括全自动晶圆传输系统、先进的软件控制功能、高精度压力控制技术以及自动化的清洁和维护能力。该装置由先进的高容量等离子体源提供动力，能够为最具挑战性的沉积过程提供较短的沉积周期和一致的结果。Ultima X的精密运动系统使机器能够精确定位晶片以获得更大的吞吐量和可重复性,而其自动轮廓晶片和边缘偏置保证（CBEA）功能确保薄膜正确、均匀地粘附在基板上。其先进的抽水系统确保工艺气体保持稳定，并在所需浓度范围内。Ultima X的精密气体输送工具也有助于减少污染。在沉积均匀性方面，APPLIED MATERIALS Centura AP Ultima X提供优于+/-5%的均匀性性能。用Ultima X取得的均匀性结果已经被几个独立的第三方研究所证实。而且，Ultima X的优越腔室设计降低了由于侧壁溅射和空气中粒子污染而对晶片造成损坏的可能性。这使得Centura AP Ultima X成为需要高精度和高精度沉积过程的理想选择。此外，资产先进的原位清洗能力有助于保持具有一致晶片对晶片均匀性的高质量沉积。该模型还提供了用于基板和晶片处理的自动化,包括从主控制台调整和设置压力和温度剖面的能力。Ultima X还具有一个直观的用户界面,它提供了进程参数和诊断的清晰视图。总体而言,AMAT/APPLICED MATERIALS Centura AP Ultima X是一款先进、用户友好的沉积设备,具有卓越的均匀性、吞吐量和稳定性。该系统为一系列先进的工艺要求提供了经济高效的解决方桉，从高性能的介电和金属沉积到高精度和可重复的工艺。该设备的功能使其成为半导体、微电子制造以及其他需要高质量、可靠沉积工艺的行业的理想选择。
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