二手 AMAT / APPLIED MATERIALS Endura 5500 #9219406 待售
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ID: 9219406
晶圆大小: 8"
优质的: 2001
System, 8"
Wafer shape: SNNF
MF Facilities: Bottom
Chamber 1: STD WC Body
Process 1: ESC AL
Chamber 2: Wide body
Process 2: TTN
Chamber 3: Wide body
Process 3: TTN
Chamber 4: Wide body
Process 4: Ti
Chamber A: Pass through
Chamber B: Cooldown
Chamber C/D: PCII
Process C/D: Oxide etch
Chamber F: O/D With temp
Heat exchanger 1: NESLAB I
Loadlock pump type: iL600
Transfer robot type: HP+
Transfer robot blade: Metal
Buffer robot type: HP+
Buffer robot blade: Metal
Wafer sensor: Mini beam
Loadlock type: Narrow BD without tilt out
System umbilical: 50 ft
EMOs: Turn to release
Hard drive: SCSI
(2) CRTs
GEM: No
OTF: No
No Facility power (UPS)
No loadlock pump
Loadlock slit valve O-rings: Viton (Black)
Heat exchanger 1: NESLAB
Heat exchanger 2: M-Pack
Main AC box: 480 V, Wide type
Chamber A:
Chamber type: Pass through
Chamber lid: STD Lid
Lift hoop & finger
Pedestal type: Standard
Chamber B:
Chamber type: Cooldown
Gas valves: Fujakin
Heater / Cathode cooling: PCW
Chamber lid: STD Lid
Pedestal type: Standard without TC option
Chamber C:
Chamber type: PCII
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: Oxide etch
Lid type: RF Resonator
RF Gen / DC supply 1: COMDEL CPS-1001S
RF Gen / DC supply 2: RFPP LF10A
RF Match: 13.56 MHz
No endpoint system
Process kit type: PIK-I
Chamber pump: EDWARD iL70
Turbo pump: LEYBOLD
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 20 SCCM STEC 4400 MFC9 (2) Manifolds
N2 300 SCCM MC-3102E-NC MFC10 (2) Manifolds
Chamber D:
Chamber type: PCII
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: Oxide etch
Lid type: RF Resonator
RF Gen / DC supply 1: COMDEL CPS-1001S
RF Gen / DC supply 2: RFPP LF10A
RF Match: 13.56 MHz
No endpoint system
Process kit type: PIK-I
Chamber pump: EDWARD iL70
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 20 SCCM STEC 4400 MFC12 (2) Manifolds
N2 300 SCCM MC-3102E-NC MFC13 (2) Manifolds
Chamber 1:
Chamber type: STD WC Body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: ESC AL
Lid type: 12.9"
RF Gen / DC Supply 1/2: AE MDX-L12M
Susceptor / Pedestal: MCA ESC
Heater / Cathode cooling: NESELAB I
No endpoint system
Gate valve position: 3 POS
Process kit type: ESC AL
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 100 SCCM STEC 4400 MFC18 (2) Manifolds
N2 20 SCCM STEC 4400 MFC9 (2) Manifolds
Chamber 2:
Chamber type: Wide body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: TTN
Lid type: 12.9"
RF Gen / DC Supply 1: AE MDX-L12M
Susceptor / Pedestal: 101
No endpoint system
Gate valve position: 3 Pos
Process kit type: (2) Ti/TiN
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 300 SCCM STEC 7440 MFC9 (2) Manifolds
N2 100 SCCM STEC 4400 MFC10 (2) Manifolds
Chamber 3:
Chamber type: Wide body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: TTN
Lid type: 12.9"
RF Gen / DC Supply 1: AE MDX-L12M
Susceptor / Pedestal: 101
No endpoint system
Gate valve position: 3 Pos
Process kit type: (2) Ti/TiN
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 100 SCCM STEC 4400 MFC2 (2) Manifolds
N2 300 SCCM STEC 4400 MFC3 (2) Manifolds
Chamber 4:
Chamber type: Wide body
Manometer config: Single
Manometer 1: 100mTorr
No shutter option
Chamber process: TTN
Lid type: 12.9"
RF Gen / DC Supply 1: AE MDX-L12M
Susceptor / Pedestal: MCA ESC
Heater / Cathode cooling: NESELAB I
No endpoint system
Gate valve position: 3 Pos
Process kit type: ESCAL
Chamber pump: Cryo pump (OB8F-3 Phase)
No heated valve stack
Gas MFC Size MFC Type MFC Number Gas stick
N2 20 SCCM STEC 4400 MFC4 Single
N2 100 SCCM STEC 4400 MFC5 (2) Manifolds
N2 200 SCCM STEC 4400 MFC6 (2) Manifolds
Missing ES chuck
System power: 200 VAC, 60 Hz, 3 phase, 343 A,150 kVA
2001 vintage.
AKT (AMAT) AMAT/APPLICED MATERIALS/AKT Endura 5500是为生产先进半导体而设计的高性能、独立式反应堆。AKT Endura 5500能够实现多种基材和材料的高吞吐量和低缺陷率。该设备采用可扩展的模块化体系结构,支持最先进的半导体工艺和制造技术。AMAT ENDURA 5500配备了多种独特的功能,可确保最佳的生产效率。它有一个高性能的晶圆处理系统,可以让晶圆快速轻松地加载。APPLICED MATERIALS Endura 5500还具有自动晶圆映射单元,可确保晶圆加工的均匀性。此外,该机器还具有一个高级工艺控制工具,可连续监控工艺温度和其他关键参数。AMAT Endura 5500旨在为大批量生产提供卓越的生产可靠性。它具有先进的冷却资产,可确保高效运行并最大程度地减少停机时间。此外,Endura 5500还采用了空气排气过滤、真空控制和温度调节等环保措施。这确保了在生产环境和实验室环境中的安全运行。在美学方面,ENDURA 5500具有诱人、圆滑的设计。该模型设计为自成一体,具有易于学习和使用的直观用户界面。该设备还具有一系列可选功能,例如用于分析晶片的高级扫描仪,可以添加这些功能以进一步提高其性能。除了令人印象深刻的性能和美观外,APPLIED MATERIALS ENDURA 5500还提供一系列提高生产力的功能。它专为高吞吐量和低缺陷率而设计,可满足各种光学、晶圆和工艺要求。此外,系统的高级控制单元提供了有关流程参数的详细数据,使用户能够根据需要调整流程。AKT ENDURA 5500是一种极可靠的反应堆,为用户提供了高度的工艺灵活性。它是大容量半导体生产应用的理想解决方桉,非常适合实验室和生产环境。
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