二手 AMAT / APPLIED MATERIALS Endura CL #293752937 待售

AMAT / APPLIED MATERIALS Endura CL
ID: 293752937
晶圆大小: 12"
优质的: 2001
System, 12" Chamber E/F: STD Degas Chamber D: PC-XT Chamber 1: IMP Chamber 2/3: TxZ (2) Scanners Generator rack Distribution rack AC Rack Monitor missing Front monitor Flex controller: VME Type (2) PODs Light curtain: FABS Type(JAPAN) Signal tower: 3 Colors Aligner type: Single axis stand alone Passthrough: Dummy 12-Slot Missing parts: KENSINGTON Robot Robot controller 1/2 FI HDD/FDD CD ROM FI CPU Board (2) Degas Chambers (E/F) Chamber type: STD Heater Type Cryo pump missing Chambers A&B: Chamber A: Passthrough Chamber B: Cooldown Lid type: Clear Lid Buffer and transfer: Robot type: VHP Robot (12) Slit V/V Assemblies (12) Slit V/V Doors Missing parts: Cryo Pump SBC452 Board P-III CPU Board Buffer Interlock Board FE HDD RT HDD FE/RT FDD VHP Robot cover Chamber 1: Process type: Vectra IMP IMP Adaptor Weldment type: STD Controller tower type: CL STD Type Lid hoist type: Gas spring type Heater type: B101 Gate V/V type: 3 Position Shitter option: CL STD Type Missing parts: Coil match Bias match Cryo pump Coil matching box: 2 MHz Bias matching box Shutter driver Wafer lift driver Bias pedestal RF power cable Ion/Convectron gauge controller Pedestal driver Chamber 2: Process Type: TxZ Gas box type: TFTE DLI Type Gas delivery & exhaust: TFTE Type TurboVac 361C Pump Heater type: TxZ STD Turbo isolation valve: Angle valve Baratron gauge: 2T/1000Torr MFC: (5) STEC Missing parts: Throttle valve MFC and valve for purge module Chamber feedthrough DI/O Board TDMAT Bottle Purge module bracket Lid CVGGF Chamber 3: Process Type: TxZ Gas box type: TFTE DLI Type Gas delivery & exhaust: TFTE Type TurboVac 361C Pump Purge module: BOT/EDGE/BS Baratron gauge 2T/1000Torr MFC: (5) STEC Missing parts: Throttle valve MFC and valve for purge module Chamber feedthrough TxZ Heater & Lift pin Purge module bracket Chamber D: Process Type: PC-XT Resonator type: Fan resonator Controller tower type: CL STD Type TurboVac 1000C Pump Gate V/V Type: 2Pos Bias match option: 13.56 MHz MFC: (2) STEC Missing parts: Analog board Bias matching box Pedestal RF Power Pedestal lift assembly Lift/Pedestal driver RGA Manual valve PC-XT Pedestal DI Max Cooler: DI Max Chiller: Steelhead 1 Compressor missing Racks: Distribution rack (2) Generator racks AC Rack Accessories: TDMAT auto re-fill gas cabinet Abatement device 1/2 UPS Umbilical cable Pump frame System earthquake prevention belt brackets INFICON RGA Accessories AC Rack DI/O board missing IMP CDX-1250 Bias generator missing Power supply: Chamber 1: Dual Pinnacle 10 kW+6 kW HFV-8000 5 kW Chamber 2, 3: COMDEL CLX-2500 Chamber D: ENI GMW-25A 2 MHz ENI GHW-12A 123.56 MHz Missing pumps: SWLL Degas RPC 2001 vintage.
AMAT/APPLIED MATERIALS Endura CL是一种扩散系统的高性能晶圆加工反应器。这种专用设备用于从半导体晶圆表面沉积、蚀刻和剥离薄层材料。其化学-机械抛光(CMP)能力使得特征和表面即使在纳米级也能均匀平面化。AMAT Endura CL反应堆标配Chroma 1400晶圆进给器和SpeedTec EBR-2000电源,这两者都有助于确保沉积和图样的均匀。反应堆还设有120 kV E-gun、自动气体处理和喷射设备以及实时温度测量和管理系统,允许处理晶片时的精度和重复性。此外,该设备还内置了容错程序,可帮助实时预测和纠正处理错误。APPLICED MATERIALS Endura CL反应器专为金属化应用而设计,其高功率沉积能力每小时最多可处理50个晶圆。该反应堆具有三真空环境和超高真空(UHV)室,可消除宇宙辐射、感应电流和粒子污染。这种严密的真空环境允许对反应条件进行更大程度的控制,从而产生精确操纵、一致的薄膜外观和均匀性。Endura CL反应堆的紧凑设计使其能够轻松融入洁净室环境。其低维持性的催化化学气相沉积(CVD)工艺允许以快速和可重复的方式均匀沉积介电和金属化膜。反应堆还具有多种不同的特定于工艺的配置,允许各种各样的晶圆加工应用。AMAT/APPLIED MATERIALS Endura CL反应堆有AMAT典型的客户服务和维护计划作为后盾,确保机器获得必要的支持和技术专业知识以保持其高效运行。这种高性能的半导体设备是那些希望从晶圆表面沉积、蚀刻和剥离薄层材料的人必不可少的工具。其先进的特性使得特征和表面即使在纳米级也能均匀平面化。
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