二手 AMAT / APPLIED MATERIALS Producer GT #9233074 待售
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ID: 9233074
晶圆大小: 12"
优质的: 2007
CVD System, 12"
Control system: Device net protocol
EFEM Communication: SFEM
Wafer sliding detection sensors: LCF
Signal tower: Common SPEC
Door interlock sensor
Pressure difference interlock: LL->TM->Chamber
Slit valve:
L-Motion
No viton o-ring
Air regulator
EYE Mark display on M/C: LP1, LP2
Chamber A / B / C
Gas box
Turbo pump
RPC
RF Generator
Match
Electric valve & Load lock & Tm installed
TM Blade: ALN
No o-ring in chamber region
No gate valve o-ring & Air regulator
Missing / Detaching parts:
(6) HARP AIN Heaters P/N: 0010-59796
Q-Code Q400-168177
FI. RT, FE Computer
Practical preventing system in EFEM: 0.065µm Filter / Venting air
Process: HARP, BPSG, ARC, P-TEOS
Blue electrostatic chuck: Low temp 300° C
Turbo screen location: Below chamber
Heat exchanger: SUS Connector & Power vaccine
Upgrade list pin mechanism: Dual lock list pin
RF Reflect filter system / BIAS: Auto match
Heat exchanger coolant: ZT180
Chamber lift speed: Stepping motor
ESC Water leak
RF Generator reflect power: Below set point 0.5%
Input / Output port stage: OHT
FOUP Capability: (25) Slots
System monitor: LCD
Remote monitor: Keyboard, LCD
Gas line: 5- RA surface mounted c-seal
Gas configuration: C3H6, O2, NF3
Gas line polishing: E/P 5-RA
Filter: SUS316 SS/NF3 Hastelloy
Gas box temperature: Display by digital gauge
Negative voltage MFC signal: Display interlock
Chamber pump: SAMSUNG
Load lock & TM Pump
Tempered type: Capacitance manometer for chamber pressure control
Pressure transducer for chamber: ATM Switch
TM & Load lock fore line shut-off valve: Electric valve
General power & UPS Power: AC Rack design change for VDP
Ground for D-net: Chassis
Circuit safeguard: Circuit breakers
Internal utility line color: SEMI Standard
Head exchanger: Pressure control
2007 vintage.
AMAT/APPLIED MATERIALS PRODUCER GT是一种垂直电化学沉积反应器,为制造先进电路提供沉积工艺解决方桉。该反应堆是一个喙状圆柱形容器,旨在为铝、铜和钛等各种基材提供优质的沉积工艺。它有AMAT Producer GT-800和APPLIED MATERIALS Producer GT-1000两种型号,具有可调谐的工艺室,可用于多种工艺能力,如镀铜、电镀铜、ALD和CVD工艺。设计基于结合了垂直容器、低热质量电容器和集成基板支撑的高纵横比烧杯架构。这种几何形状创建了一个具有低电阻电触点的均匀、可扩展的过程,这些触点与反应容器的触点和壁之间的均匀空间接触。Producer GT还提供高级可自定义的软件和硬件选项,以实现准确的过程控制。这使得操作方便和可重现的电镀结果与现实和一致的工艺参数。由于严格的工艺控制和真空洗涤程序,该工艺室不受污染。该设计将优化、用户友好的液体输送设备与精密的泵控制逻辑结合在一起,允许精确、一致、可重复的高通量电镀解决方桉。该反应堆配备了先进的温度管理,以确保程序的准确性和可重复性,以及确保过程中受控水分水平的综合湿度控制系统。高级控制单元还通过时间、温度、压力、厚度和其他关键工艺参数的测量提供对工艺的实时监控。AMAT/APPLIED MATERIALS Producer GT反应器上的各种可定制选项提供了卓越的电化学沉积溶液能力。它能够沉积各种材料,从广泛的基板具有特殊的工艺控制。先进、用户友好的机器提供了更大的灵活性和可重复的结果。
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