二手 FHR Line 1100 V #9257517 待售
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ID: 9257517
Inline sputtering system
Deposition of dielectric coatings: 7° front side
Modules:
Module 1: Loading station
Module 2: Input load lock
Module 3: Buffer chamber 1
Module 4: Transfer chamber
Module 5:
Process chamber 1: Etching and sputtering
Module 6:
Process chamber 2: Sputtering
Module 7:
Process chamber 3: Sputtering
Module 8: Transfer chamber
Module 9: Output load lock
Module 10: Unloading station
Substrate load / unload module using (2) KUKA robots
Vacuum:
End pressure: ≤2 x 10^-6 mbar after 8 hours
End pressure: ≤1.5 x 10^-6 mbar after 12 hours
Chambers:
Stainless steel vacuum chamber
Powder coated mild steel chamber frame
Pneumatic gate valves
Modules includes:
Turbo molecular pump: DN 250 ISO-K
View port: DN 100
Front service flange
Flap valves VAT
Rotary dry pump: 300 m³/h and 250 m³/h
Roots pump: 1000 m³/h
1900 Is^-1 for N2 and ca 1400 I/s for N2
Gate valves DN 250
Meissner trap with cryo generator
(6) Pirani gauges fore vacuum sensors: 1000 mbar - 10^-3 mbar
(8) Penning high vacuum sensors: 10^-3 mbar - 10^-8 mbar
(13) Baratrons MKS 627: 10^-1 mbar - 10^-4 mbar
Upstream pressure regulation
Atmospheric pressure sensors
Heater
Vacuum gauges
Inverted magnetron plasma source:
Target length: ~39"
Planar sputtering cathodes:
(10) Cathodes
Target length: 39"
Target substrate distance: 4"
Rotatable sputtering cathodes:
(10) Cathodes
SCI
Type: MC-End block
Target length: 39"
Backing tube diameter: 5"
Target substrate distance: 4"
Gas admission system:
MFC for Ar each sputtering source
Gas lines for 5N purity
Power supplies:
High voltage power supply for inverted magnetron plasma source
DC AE Power supply: ≥1 kW
DC AE Power supply: 2 x 6 kW
DC AE Power supply: 30 kW
(5) DC AE Power supply: 2 x 10 kW
Control and visualization:
PC Surface
Operating system: Windows 7 Professional
PLC General control
Cooling water:
Power supplies (PSU)
Cathode
Cathode surrounds cooled by water loops
Power supplies:
Aggregate connection: 3 / N / PE AC 380 V / 50 Hz
Voltage: 24 V.
FHR 1100 V线溅射设备是一种用途广泛、可靠的涂层系统，旨在将薄膜沉积在多种基板上。它适合生产各种材料，包括金属、陶瓷、氧化物和其他化合物。它是一个高生产力的单元，能够涂覆高达1250 x 1100 mm的表面积。1100 V线是一个真空密封的腔室，让它保持了生产高品质薄膜的合适环境。该腔室包括一个工艺气体入口和出口，允许引入成功溅射所需的气体和蒸气。该机在设计时考虑到高功率输出，从3到6 kW不等。它还设计用于高度精确和可重复的溅射，具有计算机控制的电压映射以及以单声道或双元件模式传输薄膜的能力等特点。此外，1100V能够对各种片状和粉状材料进行反应性溅射、被动溅射以及沉积方法。FHR 1100 V线能够对沉积过程中输送到基板的能量量进行精细控制。计算机控制的电压和电流映射等功能确保在薄膜沉积过程中保持高精度和可重复性。由于该刀具的高效设计和功率输出，使得溅射膜高度均匀，从而能够精确的薄膜层厚度。该资产还提供了一种功能强大的集成控制模型,具有带图形处理单元和灵活编程选项的软件包。这允许用户通过精确的结果和功能（如实时自动监控流程参数）来微调流程参数。Line 1100 V还具有集成的故障查找诊断功能,可以更轻松地诊断过程中的问题。总体而言,FHR Line 1100 V是各种薄膜沉积工艺的理想解决方桉,具有确保可重复和准确结果的特点。其强大的控制系统和一致的性能使其成为许多生产过程的宝贵设备。
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