二手 SIGMA Sputtering System #193698 待售

ID: 193698
Roll to roll sputtering system 8 Ball Vacuum Chamber & Chassis (2) CTI Model 1020CP Cold Head Cryo Pump (2) CTI Model 1020R Compressors Leybold RuVac WS500 Roots Blower Sliding Door Face Plate Sputtering system: RF Matching Networks Mass Flow Controllers Web system: (4) Black Max Motors & Gearboxes (Unwind, rewind, drum and tension drive) Chilled Drum Drum Motor Stand Control system: Human Machine Interface (HMI) - An operator touch-screen for manual and automated operations HMI - A Eurotherm Drives touchscreen for web control Eurotherm Control Cabinet & Network General Control Panel Utilities and accessories: Chiller Air Compressor Cathode Cooling Water Manifold Flexible Electric Trunking Valving: Roughing Vent and interlocks Cryo gate Cryo throttle Regeneration Purge Gauges: Convection gauges (low mtorr range) Baratron gauges Ion gauges Hydrogen vapor pressure gauges Tension drive, load cells and amplifiers Drum rotation motor and gearbox Rewind and unwind motors Gas system and control PLC card Signal connections Auto pumping Rewind and unwind control Plasma treater Sputtering controls: manual, regulate and direct mode RF control, DC control Maintenance mode Missing parts: Leybold DK200 rough pump (rotary piston pump) DK200 Gearbox (2) Cryo Throttle Valves (Butterfly Valves) (1) Cryo-pump gate valve (2) Hydrogen Vapor Pressure Gauges Ion Gauge Baratron Gauge (4) Convectron Gauges (6) Pneumatic Valves (regeneration valves for cryo pumps; purge valves for cryo pumps, rough pump Vent valves) Chamber Connecting Flange for Drum Feed-through Tension Roller Feed-through Unwind/Rewind Feed-through (6) DC Cathodes (40” x 6”) (6) MDX 5 KW sputtering power supplies Gas Control System Gas Lines (3) Load cells (3) Load Cell Amplifiers (1) Unwind/Rewind Shafts Steel Pressure Plate for Floor Gantry System and Crane (parts missing) Door Drive Train Side Steps to gain access to Cathodes Steel Ladder Mezzanine 480 V, 3 phase, approx. 1,000 A.
SIGMA溅射设备是一种先进的、最先进的溅射系统,旨在将薄膜沉积到基板上。用于多种应用,如半导体器件制造、光学涂层、研发、医疗等多个行业。该单元由一个小腔室组成,该小腔室内充斥着氙气,以及一个电压设置可变的电源。一种目标材料,如铝或钛,放置在腔内的阴极板上,并带正电荷生成等离子体。等离子体产生电离的等离子体粒子流,轰击目标物质,释放带正电的离子。这些离子随后被吸引到带负电的基板表面,金属原子在薄层中沉积到基板上。SIGMA Sputtering Machine由一个精密的软件套件控制,允许用户设置广泛的参数以达到最佳效果。用户可以调整各种参数来优化工具,如沉积速率、离子浓度和随时间的沉积均匀性。该软件还允许用户监测和控制沉积速率,使他们能够根据需要停止和启动,而不会干扰最终沉积过程。溅射资产还具有干式溅射模型,有助于防止不需要的颗粒附着在基板上。设备配有后加工干蚀刻,通过去除基板表面可能存在的任何颗粒或污染物,进一步净化沉积层。此外,SIGMA Sputtering System还提供各种附件,例如样品进纸器、晶圆处理程序、盒式磁带和夹具,以及使设备更通用的其他功能。总体而言,溅射机是一种先进、可靠的金属沉积应用解决方桉.它具有很高的可自定义性,为用户提供了多种参数可供选择,以实现所需的结果。此外,其干法和后工艺蚀刻特性确保了均匀和纯净的沉积层。
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