二手 AMAT / APPLIED MATERIALS Mirra Mesa #9222045 待售
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ID: 9222045
晶圆大小: 8"
优质的: 1997
CMP System, 8"
Technology: CMP STI
Wafer shape: Flat
Application information:
Application: Oxide
System: Dry in / Dry out
Device type: D-RAM
Device geometry: 0.13 Microns
Consumed process materials:
Polish slurry: STI
Platen 1 pad: IC1010
Platen 2 pad: IC1010
Platen 3 pad: IC1010
Pad conditioner: Diaphraghm
Pad conditioner head: DDF3
Pad conditioner holder: Standard
Factory interface options:
Cleaner type: MESA (Converted from reflexion)
Megasonics
Robot type: AMAT
In situ removal rate monitor: Digital
SECS GEM Interface
Cassette tank
Open cassette
Integrated system basic: Fabs 212
Platen and head options:
Polishing head: (4) TITAN I Heads
(4) Retaining rings
Pad wafer loss sensor
Slurry delivery options:
Slurry delivery: (2) Slurries by peristalic pump
Slurry flow rate: STD Flow
Slurry flow monitor
Slurry containment bulkhead
Slurry loop line: No
Slurry dispense arm: Extendad rinse arm
Slurry leak detector: No
DI Water
High pressure rinse
Umbilicals:
Polisher to controller cable: 30 Ft
Controller to monitor cable: 30 Ft
Factory hookup:
Upper exhaust: Standard
Upper exhaust connection: 8"
Drain manifold: 4 Line to Fac
Drain adapter: NPT Fitting
Castors for mirra system: No
Weight distribution plate (Skid pad)
User interface:
Stainless cart
PC Mouse
Hard disk backup: No
Polisher / Fabs light tower:
Tower mounting type: (4) Lights
Tower colors sequence: RYGB
(4) Tower colors
Cleaner option: Mesa cleaner
Maintenance options:
Spray gun: Single
Lapping stone: No
Special options:
Nylon brush: No
E-Chain teflon sheet: Water fall
Low pressure release water: No
Mesa:
Direct checm type:
Megasonic module
Brush 1
Brush 2
Standard:
SRD
Output station
Electrical requirements:
Line voltage: 200~230V
Line frequency: 50/60 Hz
Delta connection
Power lamp: Green
Power connected lamp: No
Circuit breaker: 200A
AC Outlet box: 100V
Configurable I/O: No
Wide type GFI: 50mA
1997 vintage.
AMAT/APPLIED MATERIALS/AKT Mirra Mesa是一种自动化晶片研磨、研磨和抛光设备,用于为先进的薄膜工艺制备半导体晶片。它能够在单一系统中研磨、研磨和抛光晶片,不需要多件设备。AKT Mirra Mesa是一个最先进、高效的单位。其特点包括全自动研磨、研磨和抛光循环时间,以及晶圆的机器人装卸,以及全局命令和控制。它提供高吞吐量、高质量的结果,每小时最多可以处理200个晶圆。该机器能够研磨、研磨和抛光直径达8英寸的晶片。其抛光工艺可确保表面光滑、无缺陷且具有超低K值,这对于需要额外薄膜的设备至关重要。该工具还利用MultiGrit™技术,将所需的抛光步骤数量降至最低,并确保均匀的表面光洁度。AMAT Mirra Mesa可配置,以满足每个流程的特定需求。它的模块化设计允许与现有流程轻松集成,而其高效率的操作使拥有成本降至最低。此外,它还可以与操作员控制台以及其他计算机连接,以最大限度地提高资产效率。型号也高度可靠;其自我监控和自我校准功能可减少停机时间。还建立了保护人员和晶圆的安全系统。总体而言,应用材料Mirra Mesa是一种高效、先进的晶圆研磨、研磨和抛光设备,能够产生高度一致的结果。它的可配置性、高吞吐量和低拥有成本使其成为当今要求最苛刻的半导体工艺的理想选择。
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