二手 AMAT / APPLIED MATERIALS CMP 3600 #9160608 待售
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ID: 9160608
晶圆大小: 12"
优质的: 2002
Reflexion system, 12"
General features:
(4) Titan heads
(3) Platen systems
Operator interface with monitor and keyboard
Windows NT based software control
Integrated electronics control cabinet
Integrated applied materials factory interface on four-wide frame
Integrated mesa cleaner including two brush scrubber modules
Spin rinse dry module
CD ROM
Wafer type: Notch P/N 36-0103
Reflexion polisher type:
Reflexion CMP poly system: P/N 36-0004
Software use license: P/N 36-1001E
CMP System:
Consumed process materials:
Politex pads: P/N 36-1022
(2) IC1000 pads: P/N 36-1020
Metrology:
Digital in situ removal monitor (ISRM) on cach platen
Full scan ISRM on 3 Platens: P/N 36-5153
System regulation compliance: P/N 36-9801
Polisher options:
Platen and head options:
Clear windows on skins for polisher: P/N 36-5732
(4) UPA zones
Profiler UPA: P/N 36-2039
Wafer loss sensor for dark pads: P/N 36-7939
With 50' cable
Neslab S2HCFC-Free HX300: P/N
AMAT Supplied platen temperature control
Facilities options:
System safety equipment
31” cleaner workspace: P/N 36-0115
Electrical requirements
200-230VAC 50/60Hz, input voltage: P/N 36-0119
Factory hookup:
Cleaner drain manifold - 2 lines (1 slurry, 1 reclaim): P/N 36-0121
Operator interface options:
User interface:
4 Color light tower, front of FI: P/N 36-0124
Vertical flush mounted
RYGB
LED lamp
Cleaner for CMP reflexion system
Module 1 (Megasonics):
Megasonics: P/N 36-0502
Pressurized LDM: P/N 36-0503
Supports chemicals:
A: High dilution 29% NH4OH B: 30% Hydrogen peroxide (H202)
A: High dilution 29% NH40H B: 0.5% NCW-601A surfactant
Module 2 & 3 (Brush scrubber modules):
Brush scrubber modules
(2) RIPPEY microclean brush: P/N 36-1679
(2) Direct feed LDM: P/N 36-0514
Supports the following chemicals;
0.05% -0.1% Ammonium hydroxide (NH40H)
0.5%-l% Hydrogen fluoride (HF)
200:1 Electroclean
Pre-mixed SC-1
Pre-mixed proprietary chemical
Module 4 (Spin rinse dry):
Rinse with lamp dry: P/N 36-0519
Factory interface options:
Integrated applied materials factory interface with
25-Wafer FQUP load ports
Upper E84 Sensors and cables
(2) Operator access switch: P/N 36-0260
Boron-free ULPA filter: P/N 36-0270
Four-wide factory interface frame with two load
Ports: P/N 36-0350
Load Ports in positions 1 and 3.
(2) E99 Carrier ID, keyence (BCR FOUP ID reader): P/N 36-0258
Additional options:
System manuals:
CD ROM manual set: P/N 36-0128
Cleanroom reflexion manual set: P/N 36-0130
(English) printed on cleanroom paper
Additional items:
Generic monthly consumables kit: P/N 36-78300
Includes:
(16) O-ring
(2) Filters
(3) DDF3 Diaphragm
Pad conditioner head assembly: P/N 36-7550
Set up / maintenance options:
Polisher to cleaner alignment fixture: P/N 36-8211
Alignment and leveling tool kit (FI – Datum Gauge): P/N 36-0142
Factory interface service lift: P/N 36-0245
One year PM kit: P/N 36-8979
Walking beam alignment tool: P/N 36-2535
Wet robot calibration tool: P/N 36-6141
Spares:
(10) Brush disk: P/N 0020-78263
ECO 10424 - REV1P
Kit, option 3 slurries AB-AB-AC: P/N 0240-15146
Configuration:
Kit, option brush and adapter for pad: P/N 0240-16013
Conditioner, reflexion
Option kit, user interface, flat panel, Wall mounted for TTW reflexion: P/N 0240-06004
(4) 300mm Titan heads: P/N 36-5675
Retaining ring: Grooved PL PPS
Membrane support plate: 0.5 inch, 0mm Edge bump, WAS
Support pad: 0.5 inch Perf holes
Edge control ring: 11.434 inch OD
Upper ASM: A-2-50
Membrane: Neoprene
Dry nova 3030: TEMPNSR-03
300MM Titan head with grooved: TEMPNSR-04
Retaining ring
CE Marked
2002 vintage.
AMAT/APPLIED MATERIALS CMP 3600是一种晶圆研磨、研磨和抛光设备,专为各种晶圆类型和尺寸的内部对准结构的自动化、高精度研磨和精加工而设计。它能够将晶片表面抛光至纳米级精度和高表面质量,确保晶片校正各种工艺条件下的任何几何对准误差。AMAT CMP 3600配备15英寸。研磨/抛光板,4英寸。原位计量系统,一个25G力LPU,和一个双区研磨板组件。LPU的设计目的是通过在磨削和抛光过程中对整个晶片表面施加精确的受控力来防止微裂纹的形成。原位计量单元允许在研磨和抛光过程中实时监测晶圆特性,降低失真风险,确保高质量的最终结果。APPLICED MATERIALS CMP 3600是由坚固的材料製造而成,设计成可以长时间连续运行,不需要任何重大的维护要求。该机还配备了自动晶片检查和电化学表面清洁能力,以确保一贯的高质量效果。CMP 3600的控制通过高级台式机PC和基于Windows的GUI进行,从而使操作工具变得简单高效。它还方便地配备了局域网和MODBUS网络接口,用于远程操作或多资产集成。AMAT/APPLIED MATERIALS CMP 3600采用金刚石基研磨和抛光浆料,在各种各样的晶圆类型和尺寸上生产高质量的表面。该模型包括超精密幻灯片、双区域研磨板组件和集成过程控制硬件,以提供最大的灵活性和准确性。AMAT CMP 3600是各种晶圆制造工艺的理想选择,包括蚀刻、剥离和图案化应用。它能够制造具有纳米级精度的复杂结构,确保严格的公差和高的工艺产量。
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