二手 AMAT / APPLIED MATERIALS CMP 3600 #9160608 待售

看起来这件物品已经卖了。检查下面的类似产品或与我们联系,我们经验丰富的团队将为您找到它。

ID: 9160608
晶圆大小: 12"
优质的: 2002
Reflexion system, 12" General features: (4) Titan heads (3) Platen systems Operator interface with monitor and keyboard Windows NT based software control Integrated electronics control cabinet Integrated applied materials factory interface on four-wide frame Integrated mesa cleaner including two brush scrubber modules Spin rinse dry module CD ROM Wafer type: Notch P/N 36-0103 Reflexion polisher type: Reflexion CMP poly system: P/N 36-0004 Software use license: P/N 36-1001E CMP System: Consumed process materials: Politex pads: P/N 36-1022 (2) IC1000 pads: P/N 36-1020 Metrology: Digital in situ removal monitor (ISRM) on cach platen Full scan ISRM on 3 Platens: P/N 36-5153 System regulation compliance: P/N 36-9801 Polisher options: Platen and head options: Clear windows on skins for polisher: P/N 36-5732 (4) UPA zones Profiler UPA: P/N 36-2039 Wafer loss sensor for dark pads: P/N 36-7939 With 50' cable Neslab S2HCFC-Free HX300: P/N AMAT Supplied platen temperature control Facilities options: System safety equipment 31” cleaner workspace: P/N 36-0115 Electrical requirements 200-230VAC 50/60Hz, input voltage: P/N 36-0119 Factory hookup: Cleaner drain manifold - 2 lines (1 slurry, 1 reclaim): P/N 36-0121 Operator interface options: User interface: 4 Color light tower, front of FI: P/N 36-0124 Vertical flush mounted RYGB LED lamp Cleaner for CMP reflexion system Module 1 (Megasonics): Megasonics: P/N 36-0502 Pressurized LDM: P/N 36-0503 Supports chemicals: A: High dilution 29% NH4OH B: 30% Hydrogen peroxide (H202) A: High dilution 29% NH40H B: 0.5% NCW-601A surfactant Module 2 & 3 (Brush scrubber modules): Brush scrubber modules (2) RIPPEY microclean brush: P/N 36-1679 (2) Direct feed LDM: P/N 36-0514 Supports the following chemicals; 0.05% -0.1% Ammonium hydroxide (NH40H) 0.5%-l% Hydrogen fluoride (HF) 200:1 Electroclean Pre-mixed SC-1 Pre-mixed proprietary chemical Module 4 (Spin rinse dry): Rinse with lamp dry: P/N 36-0519 Factory interface options: Integrated applied materials factory interface with 25-Wafer FQUP load ports Upper E84 Sensors and cables (2) Operator access switch: P/N 36-0260 Boron-free ULPA filter: P/N 36-0270 Four-wide factory interface frame with two load Ports: P/N 36-0350 Load Ports in positions 1 and 3. (2) E99 Carrier ID, keyence (BCR FOUP ID reader): P/N 36-0258 Additional options: System manuals: CD ROM manual set: P/N 36-0128 Cleanroom reflexion manual set: P/N 36-0130 (English) printed on cleanroom paper Additional items: Generic monthly consumables kit: P/N 36-78300 Includes: (16) O-ring (2) Filters (3) DDF3 Diaphragm Pad conditioner head assembly: P/N 36-7550 Set up / maintenance options: Polisher to cleaner alignment fixture: P/N 36-8211 Alignment and leveling tool kit (FI – Datum Gauge): P/N 36-0142 Factory interface service lift: P/N 36-0245 One year PM kit: P/N 36-8979 Walking beam alignment tool: P/N 36-2535 Wet robot calibration tool: P/N 36-6141 Spares: (10) Brush disk: P/N 0020-78263 ECO 10424 - REV1P Kit, option 3 slurries AB-AB-AC: P/N 0240-15146 Configuration: Kit, option brush and adapter for pad: P/N 0240-16013 Conditioner, reflexion Option kit, user interface, flat panel, Wall mounted for TTW reflexion: P/N 0240-06004 (4) 300mm Titan heads: P/N 36-5675 Retaining ring: Grooved PL PPS Membrane support plate: 0.5 inch, 0mm Edge bump, WAS Support pad: 0.5 inch Perf holes Edge control ring: 11.434 inch OD Upper ASM: A-2-50 Membrane: Neoprene Dry nova 3030: TEMPNSR-03 300MM Titan head with grooved: TEMPNSR-04 Retaining ring CE Marked 2002 vintage.
AMAT/APPLIED MATERIALS CMP 3600是一种晶圆研磨、研磨和抛光设备,专为各种晶圆类型和尺寸的内部对准结构的自动化、高精度研磨和精加工而设计。它能够将晶片表面抛光至纳米级精度和高表面质量,确保晶片校正各种工艺条件下的任何几何对准误差。AMAT CMP 3600配备15英寸。研磨/抛光板,4英寸。原位计量系统,一个25G力LPU,和一个双区研磨板组件。LPU的设计目的是通过在磨削和抛光过程中对整个晶片表面施加精确的受控力来防止微裂纹的形成。原位计量单元允许在研磨和抛光过程中实时监测晶圆特性,降低失真风险,确保高质量的最终结果。APPLICED MATERIALS CMP 3600是由坚固的材料製造而成,设计成可以长时间连续运行,不需要任何重大的维护要求。该机还配备了自动晶片检查和电化学表面清洁能力,以确保一贯的高质量效果。CMP 3600的控制通过高级台式机PC和基于Windows的GUI进行,从而使操作工具变得简单高效。它还方便地配备了局域网和MODBUS网络接口,用于远程操作或多资产集成。AMAT/APPLIED MATERIALS CMP 3600采用金刚石基研磨和抛光浆料,在各种各样的晶圆类型和尺寸上生产高质量的表面。该模型包括超精密幻灯片、双区域研磨板组件和集成过程控制硬件,以提供最大的灵活性和准确性。AMAT CMP 3600是各种晶圆制造工艺的理想选择,包括蚀刻、剥离和图案化应用。它能够制造具有纳米级精度的复杂结构,确保严格的公差和高的工艺产量。
还没有评论