二手 AMAT / APPLIED MATERIALS Mirra 3400 #9411057 待售
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ID: 9411057
优质的: 2001
CMP System
Wet robot
Wet queue tank: Q-Tank with lift
System skins: Clear skins
Load cup: Full contact HCLU
Performance enhancement:
Pad conditioner head 1-3 with screw type DDF3
Factory interface:
Platen 1 ISRM: Legacy
Platen 2 ISRM: Legacy
Platen 3 ISRM: Legacy
SECS GEM Interface
Polisher:
No polishing head 1-4
Upper Pneumatics Assembly (UPA): Profiler
No UPA relocation
Pad wafer loss sensor: Dual sensor
No platen temperature control and cable
No upper platen coating
Grease platen gear assembly
Slurry delivery: Peristaltic pump
Standard slurry flow rate
Slurry dispense arm:
4-Line slurry arm
High pressure rinse
DI Water
Slurry tube
Facilities operations:
EMO guard ring
No EMO IO
System user and labels: English
No LOTO Box
Smoke detector
Polisher slurry leak sensor
Electrical requirements:
Line frequency: 50 HZ
Line voltage: 200/208 VAC
Power lamp: Green lamp
No power connected lamp
Circuit breaker: 200 A
Controller top panel: Holes punched out for AC Power cables entry
No configurable IO
GFI Type: 30 mA
No isolation transformer
Umbilical's:
CAT Track style: Cascading
Polisher to controller cable
Controller to monitor cable: 50 feet
Factory hookup:
Upper exhaust
Upper exhaust material: Stainless steel
Lower exhaust
Process exhaust: Vent interlock sensor
No flange upper exhaust connection
Drain manifold: 1 Line
Operator interface:
No Hard Disk Drive (HDD)
Memory: 128M
PIII CPU
Operating system: Windows NT
Polisher light tower:
Pole mounted type
Polisher tower: (3) Colors
Lamp type: Incandescent
Colors sequence: RYG
Controller light tower:
Pole mounted type
(3) Colors
Lamp type: Incandescent
Color sequence: RYG
2001 vintage.
AMAT/APPLIED MATERIALS Mirra 3400是晶圆研磨、研磨和抛光设备,专门设计用于半导体制造业。系统采用多级抛光单元,包括旋转水平晶片架和金刚石磨轮。该机能够生产出极高质量的表面饰面,表面光滑,微粗糙度值低。AMAT Mirra 3400的主要部件是主机、传输单元和集成过程控制工具。大型机配备了10 HP的电动机,可调速高达2000 rpm。转移单元包括两个伺服电动机,允许晶圆及其相关基板的材料自动处理。这样可以确保晶片在研磨或抛光时的精度和精确度。集成过程控制资产能够控制磨削、研磨和抛光过程,以及存储各类晶片的参数和配方。APPLIED MATERIALS Mirra 3400可以容纳各种晶圆尺寸和厚度,从1英寸到8英寸。该型号还具有内置的安全特性,以保护晶片的完整性。晶片经过分阶段研磨/研磨,从粗到细取决于晶片的表面光洁度要求。研磨完成后,再用抛光溶液抛光晶片,再用细研磨或抛光化合物完成。该设备能够实现非常紧密的公差和表面粗糙度值,在1-2 µm的范围内,使其适合生产高质量的晶片。该系统还利用自动真空技术帮助减少污染,从而提高产量。总体而言,Mirra 3400是一个可靠的设备,它提供数据记录和后处理功能,以确保成品的质量。该机器能够产生非常平滑的结果,具有紧密的公差,使其成为半导体工业的理想选择。
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