二手 AMAT / APPLIED MATERIALS Mirra Mesa #9203803 待售

CMP System, 8" Wafer shape: Flat Application information: Application: Oxide System: Dry in / Dry out Device type: D-RAM Device geometry: 0.09 Microns Consumed process materials: Polish slurry: STI Platen 1 pad: IC1010 Platen 2 pad: IC1010 Platen 3 pad: IC1010 Pad conditioner: Diaphraghm Pad conditioner head: DDF3 Pad conditioner holder: Standard Factory interface options: Cleaner type: MESA (Converted from reflexion) Megasonics Robot type: APPLIED MATERIALS In situ removal rate monitor: Digital SECS GEM Interface Cassette tank Cassette type: SMIF Installation type: Through the wall Integrated system basic fabs: Fabs 212 Platen and head options: Polishing head: (4) TITAN I Heads (4) Retaining rings Pad wafer loss sensor Slurry delivery options: Slurry delivery: (2) Slurries Slurry flow rate: STD Flow Slurry flow monitor Slurry containment bulkhead: Single containment Slurry loop line: No Slurry dispense arm: Extended rinse arm Slurry leak detector: No DI Water High pressure rinse System safety equipment: Red turn to release EMO button: STD EMO Guard ring System labels: English Smoke detector Umbilicals: Polisher to controller cable: 75FT Controller to monitor cable: 75FT Factory hookup upper exhaust: STD Upper exhaust connection: 8" Drain manifold: 4 Line to FAC Drain adapter: NPT Fitting Castors for mirra system: No Weight distribution plate (Skid pad) User interface: Gray area: Monitor Clean room: Monitor Class 1 cart for monitor Stainless cart Mouse or trackball: PC Mouse Hard disk backup: No Maintenance options: Spray gun: Singly Lapping stone: No Spares: Heads Retaining ring Pad conditioner head Electrical requirements: Line frequency: 50/60 HZ Line voltage: 200 ~ 230V Uninterruptible power supply: UPS Battery Delta connection Power lamp: Green Power connected lamp: No Circuit breaker: 200A AC Outlet box: 100V Wide type GFI: 50mA 2000 vintage.