二手 AMAT / APPLIED MATERIALS Mirra Mesa #9254128 待售
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ID: 9254128
晶圆大小: 8"
优质的: 2003
CMP System, 8"
Technology: CMP Oxide
Wafer shape: Flat / Notch
Consumed process materials:
Polish slurry
Platen 1 pad: IC1010
Platen 2 pad: IC1010
Platen 3 pad: IC1010
Pad conditioner: Diaphragm
Pad conditioner head: DDF3
Pad conditioner holder
Factory interface options:
Cleaner type: MESA (Converted from reflexion)
Megasonics
Robot type: AMAT / APPLIED MATERIALS
In-situ removal rate monitor: Full scan
SECS GEM Interface
Cassette tank
Cassette type: SMIF
Open cassette
Integrated system basic: FABS 212
FABS Robot blade: Ceramic
Cassette type: 25 Slots teflon PFA
Platen and head options:
Polishing head: (4) TITAN I Heads
(4) Retaining rings
Pad wafer loss sensor
Slurry delivery options:
Slurry delivery: Peristaltic pump
Slurry flow rate
Slurry flow monitor
Slurry loop line
Slurry loop line A
Slurry loop line B
Slurry dispense arm
DI Water
High pressure rinse
Safety equipment:
Red turn to release EMO button
EMO Guard ring
Smoke detector
Polisher slurry leak sensor
Mesa brush leak sensor
Umbilicals:
Polisher to controller cable: 50 Ft
Controller to monitor cable: 50 Ft
Factory hookup:
Upper exhaust
Upper exhaust material: SS
Exhaust vent interlock: Upper and lower
Upper exhaust connection: 8"
Drain manifold:(4) Lines to FAC
Drain adapter: NPT Fitting
DIW Inlet assy: W/O CDA Regulator
User interface:
Monitor selection: LCD Monitor
Monitor 1 location: LCD Monitor on cart
Class 1 cart for monitor 1
Mouse
Start stop button: Controller
Light tower selection: Controller and FABs
Polisher light tower:
Controller tower mounting type: Horizon flush mounted
Controller tower
Controller tower lamp type: Incandescent
Light tower:
Tower mounting type: Pole mounted
Tower lamp type: Incandescent
Tower colors sequence
Cleaner options:
Mesa cleaner
Walking beam assemble
Megasonic module: Delivery tank
Megasonic delivery type: Pressurized
Chemical A
Chemical B
Scrubber module:
Scrubber delivery type: Direct feed
Brush chemical
Scrubber 1 delivery type: Direct feed
Brush 2 chemical
Brush 1, 2 spray bar
SRD Module:
SRD Shield
SRD Exhaust and drain lines: Single
Upper electronic box: UEB
Signal tower
Pad conditioner head: DDF3
Pad con disk holder
Polishing head: TITAN 1 Head
Upper Pneumatic assy: UPA
Slurry delivery: (2) Slurry line for each platens (6 Slurry line)
Endpoint system full scan ISRM (P1, P2)
No slurry containment bulkhead
No slurry loop line C
No Uninterruptible Power Supply (UPS)
No delta connection
No power connected lamp
No AC outlet box
No isolation transformer for Mesa
No elbow fitting for drain pan
No castors
No weight distribution plate
No internal vacuum ventury
No SRD heater lamp
Power requirements:
Line voltage: 200~230 V
Line frequency: 50/60 Hz
Delta connection
Power lamp
Circuit breaker: 200 A
Configurable IO: 10 Channels
GFI Type: 30 mA
2003 vintage.
AMAT/APPLIED MATERIALS/AKT Mirra Mesa是一种高精密的计算机控制晶圆研磨、研磨和抛光设备。它设计用于半导体工业中,用于复杂晶片的精确研磨、研磨和抛光。该系统利用精确的运动控制和先进的功能集来实现异常精确的几何形状,特别是针对半导体市场。该单元包括一个可编程的旋转压板,它允许精确的极性和方位角控制旋转运动。此运动与刷牙、研磨和抛光技术结合使用,以产生精确的表面几何形状。运动通过一系列旋转编码器进行控制和监控,提供精确和可重复的性能。该机还配备了先进的加热和冷却工具,旨在确保所执行的过程的最佳温度范围,帮助减少零件的磨损。该资产经过精心设计,可在非常严格的公差(>0.02 μ m)下执行研磨、研磨和抛光应用。模型中的所有零件和材料,包括铝制底板、轴承托架和轴,都是按照严格的公差和规格设计和制造的。该设备经NSF批准并设计为符合所有适用的HEPA过滤器标准。此外,AKT Mirra Mesa还提供高级软件控制,允许精确和可重复的操作。该系统支持板载计算机和板载计算机,用于操作、监视和诊断。它还包括一系列模具选项,允许广泛的应用程序。总体而言,AMAT Mirra Mesa是一个前沿设备,旨在提供精确和可重复的研磨、研磨和抛光应用,特别是在半导体行业。它的高级功能集产生了一流的质量结果,肯定超出了客户的期望。
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