二手 AMAT / APPLIED MATERIALS Mirra Mesa #9254128 待售

ID: 9254128
晶圆大小: 8"
优质的: 2003
CMP System, 8" Technology: CMP Oxide Wafer shape: Flat / Notch Consumed process materials: Polish slurry Platen 1 pad: IC1010 Platen 2 pad: IC1010 Platen 3 pad: IC1010 Pad conditioner: Diaphragm Pad conditioner head: DDF3 Pad conditioner holder Factory interface options: Cleaner type: MESA (Converted from reflexion) Megasonics Robot type: AMAT / APPLIED MATERIALS In-situ removal rate monitor: Full scan SECS GEM Interface Cassette tank Cassette type: SMIF Open cassette Integrated system basic: FABS 212 FABS Robot blade: Ceramic Cassette type: 25 Slots teflon PFA Platen and head options: Polishing head: (4) TITAN I Heads (4) Retaining rings Pad wafer loss sensor Slurry delivery options: Slurry delivery: Peristaltic pump Slurry flow rate Slurry flow monitor Slurry loop line Slurry loop line A Slurry loop line B Slurry dispense arm DI Water High pressure rinse Safety equipment: Red turn to release EMO button EMO Guard ring Smoke detector Polisher slurry leak sensor Mesa brush leak sensor Umbilicals: Polisher to controller cable: 50 Ft Controller to monitor cable: 50 Ft Factory hookup: Upper exhaust Upper exhaust material: SS Exhaust vent interlock: Upper and lower Upper exhaust connection: 8" Drain manifold:(4) Lines to FAC Drain adapter: NPT Fitting DIW Inlet assy: W/O CDA Regulator User interface: Monitor selection: LCD Monitor Monitor 1 location: LCD Monitor on cart Class 1 cart for monitor 1 Mouse Start stop button: Controller Light tower selection: Controller and FABs Polisher light tower: Controller tower mounting type: Horizon flush mounted Controller tower Controller tower lamp type: Incandescent Light tower: Tower mounting type: Pole mounted Tower lamp type: Incandescent Tower colors sequence Cleaner options: Mesa cleaner Walking beam assemble Megasonic module: Delivery tank Megasonic delivery type: Pressurized Chemical A Chemical B Scrubber module: Scrubber delivery type: Direct feed Brush chemical Scrubber 1 delivery type: Direct feed Brush 2 chemical Brush 1, 2 spray bar SRD Module: SRD Shield SRD Exhaust and drain lines: Single Upper electronic box: UEB Signal tower Pad conditioner head: DDF3 Pad con disk holder Polishing head: TITAN 1 Head Upper Pneumatic assy: UPA Slurry delivery: (2) Slurry line for each platens (6 Slurry line) Endpoint system full scan ISRM (P1, P2) No slurry containment bulkhead No slurry loop line C No Uninterruptible Power Supply (UPS) No delta connection No power connected lamp No AC outlet box No isolation transformer for Mesa No elbow fitting for drain pan No castors No weight distribution plate No internal vacuum ventury No SRD heater lamp Power requirements: Line voltage: 200~230 V Line frequency: 50/60 Hz Delta connection Power lamp Circuit breaker: 200 A Configurable IO: 10 Channels GFI Type: 30 mA 2003 vintage.
AMAT/APPLIED MATERIALS/AKT Mirra Mesa是一种高精密的计算机控制晶圆研磨、研磨和抛光设备。它设计用于半导体工业中,用于复杂晶片的精确研磨、研磨和抛光。该系统利用精确的运动控制和先进的功能集来实现异常精确的几何形状,特别是针对半导体市场。该单元包括一个可编程的旋转压板,它允许精确的极性和方位角控制旋转运动。此运动与刷牙、研磨和抛光技术结合使用,以产生精确的表面几何形状。运动通过一系列旋转编码器进行控制和监控,提供精确和可重复的性能。该机还配备了先进的加热和冷却工具,旨在确保所执行的过程的最佳温度范围,帮助减少零件的磨损。该资产经过精心设计,可在非常严格的公差(>0.02 μ m)下执行研磨、研磨和抛光应用。模型中的所有零件和材料,包括铝制底板、轴承托架和轴,都是按照严格的公差和规格设计和制造的。该设备经NSF批准并设计为符合所有适用的HEPA过滤器标准。此外,AKT Mirra Mesa还提供高级软件控制,允许精确和可重复的操作。该系统支持板载计算机和板载计算机,用于操作、监视和诊断。它还包括一系列模具选项,允许广泛的应用程序。总体而言,AMAT Mirra Mesa是一个前沿设备,旨在提供精确和可重复的研磨、研磨和抛光应用,特别是在半导体行业。它的高级功能集产生了一流的质量结果,肯定超出了客户的期望。
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