二手 AMAT / APPLIED MATERIALS Reflexion LK #9005426 待售
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ID: 9005426
晶圆大小: 12"
优质的: 2010
Copper CMP system, 12"
Base System:
Reflexion LK 4 head, 3 platen polishing system, Dry in
Polisher Skins: Dark P1, P2, P3, and P4: 4910 compliant
Gap Wash: 120 degree nozzles
Load Cup Wafer Exchanger: Enhanced counter balance springs
Nova 3090 Ready: None
Monitor 1 Location Cart
Monitor 2 Location Ergo Arm type
Base System Light Tower: Factory Interface and Polisher Sides
Software:
LK Software Main system lp3B4.5_29
Factory Interface Front End fb4.9_14 Beta
ISRM / RTPC Endpoint system isB3.0_10
RTPC with within wafer uniformity control capability B3.0_11
Interface "A" High speed FDC data transfer: N/A
Nova 3090 Insitu Metrology System Software: No use
Wafer to Wafer iAPC: no use
Within Wafer iAPC: no use
Factory interface:
WIP Delivery Type OHT or manual delivery
FOUP Entegris F300
OHT Light Curtain LIGHT CURTAIN
E84 PI O Sensors and Cables: UPPER E84 SENSORS & CABLES
E99 Carrier ID TIRIS WITH RF
Docked E99 Reading Capability YES
Docking Flange Shield YES
Frame Configuration 4 WIDE
Load Ports Semi Compliant MENV and FIMS Assemblies
Load Port Operator Interface STANDARD
Load Port Types ENHANCED 25 WAFER FOUP
Operator Access Switch YES
Platen 1:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM RTPC
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter 1350-00195 (4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Platen 2:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter: 1350-00195(4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Platen 3:
Platen Type: HIGH SPEED (<= 350 RPM)
Endpoint Full Scan Optical ISRM
Endpoint Motor Torque N/A
High Pressure Rinse Flow Meter: 1350-00195(4.6 l/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse Arms High Pressure/Flow
Flow Meter 50-500 ml/min
Temperature Control Platen Cooling Water
Polisher:
Polisher Technology SLURRY AND PAD
Polishing Head CONTOUR GEN III (0.5 TO 5.0 PSI)
Cross Break Pheumatic Box with Reverse Brake Logic
Pad Wafer Loss Sensor DARK PAD SENSOR
InterPlaten Clean Auxillary clean capability: No
ISRM Laser Key Switch Yes
Slurry Delivery System 5 x 10 CLC SDS
Head 1 Power Cable: 0150-16277 CABLE ASSY, HR1, DRIVER-MOTOR POWER, REF
Head 2 Power Cable: 0150-16278 CABLE ASSY, HR2, DRIVER-MOTOR POWER, REF
Head 3 Power Cable: 0150-16279 CABLE ASSY, HR3, DRIVER-MOTOR POWER, REF
Head 4 Power Cable: 0150-16280 CABLE ASSY, HR4, DRIVER-MOTOR POWER, REF
Head 1 Encoder Cable: 0150-16281 CABLE ASSY, 300MM, HR1, DRIVERRESOLVER
Head 2 Encoder Cable: 0150-16282 CABLE ASSY, 300MM, HR2, DRIVERRESOLVER
Head 3 Encoder Cable: 0150-16283 CABLE ASSY, 300MM, HR3, DRIVERRESOLVER
Head 4 Encoder Cable: 0150-16284 CABLE ASSY, 300MM, HR4, DRIVERRESOLVER
G4+ UPA Water rated valves: SMC UPA
G4+ UPA UPA Firmware: SMC UPA
Cleaner Meg:
MEGASONICS Delivery with onboard Mix
Transducer MEGASONICS Transducer
Chemical 1 CLC 1-250 ml/min
Chemical 2 CLC 1-250 ml/min
Brush box 1:
Brush LDM Type: TwoChemInLineMixed
Chemical 1: CLC 0~1250 ml/min
Chemical 2: CLC 0~1250 ml/min
Brush Box Level Spacer: 6mm Spacer for HH alarm reduction
Brush Box Shaft Enhanced tolerance shaft
Toe In Bracket design to allow for Toe In adjustment
Slow drain Plumb to main drain line
Brush box 2:
Brush LDM Type: TwoChemInLineMixed
Chemical 1: CLC 0~1250 ml/min
Chemical 2: CLC 0~1250 ml/min
Brush Box Level Spacer: 6mm Spacer for HH alarm reduction
Brush Box Shaft Enhanced tolerance shaft
Toe In Bracket design to allow for Toe In adjustment
Slow drain Plumb to main drain line
Dryer module:
Dryer Type VAPOR DRYER
Recovery Module CHEM DELIVERY TANK W/5 WAFER BRACKET
Output Station Dampner: Cap is Viton
2010 vintage.
AMAT/APPLIED MATERIALS Reflexion LK是一种高性能晶圆研磨、研磨和抛光设备,提供无与伦比的性能和可靠性。它设计用于处理包括硅、蓝宝石和其他材料在内的多种基板。该系统由先进的多轴级组件组成,可实现晶圆以及超高通量大基板的精确索引、研磨、研磨和抛光。AMAT Reflexion LK的设计为基板工艺步骤提供了最大的灵活性和用户控制,并实现了广泛的应用,如晶圆变薄、背面抛光和表面制备。APPLICED MATERIALS Reflexion LK使用户能够调整研磨、研磨和抛光参数,以满足运行和基板到基板的要求。这允许进行微调,以帮助根据用户要求优化工艺结果,以达到一流的特征大小和曲面质量。此外,Reflexion LK还具有快速高效的基板方向变更功能,无需任何手动干预即可从一个步骤过渡到另一个步骤。AMAT/APPLIED MATERIALS Reflexion LK包含广泛的功能,旨在提高流程一致性、鲁棒性和吞吐量。其中包括集成视觉单元、弹簧的主动调整以及高动态跨控制跟踪(HDFA),它为关键流程应用程序提供了更高的拍摄均匀性。此外,AMAT Reflexion LK利用集成的校准实用程序,可减少长期漂移并提高性能随时间推移的稳定性。APPLICED MATERIALS Reflexion LK的高性能环境提供了多种工艺和产品保护功能,以确保最优质的基板光洁度和可靠的循环后性能。这些特性包括噪声最小化环境、主动仪器校准以及先进的冷却机等,可将热量从基板上散开以确保最小的热应力。最后,Reflexion LK是一种用于晶圆研磨、研磨和抛光的功能强大的工具,可提供一致、可重复和可靠的结果。它提供最大的灵活性,以满足各种基板和应用的独特制造需求,同时提供各种工艺和产品保护功能,以确保最高质量的工艺结果和长期可靠性。
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