二手 AMAT / APPLIED MATERIALS Reflexion LK #9116998 待售
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ID: 9116998
Copper CMP system, 12"
Base system:
Reflexion LK: 4-head, 3-platen, polishing system
Dry in, dry out
Polisher skins: Dark P1, P2, P3, P4; 4910 compliant
Gap wash: 120° nozzles
Load cup wafer exchanger: enhanced counter balance springs
Nova 3090 ready: none
Monitor 1 location: cart
Monitor 2 location: ergo arm type
Light tower: factory interface and polisher sides
Software:
LK Software: lp3B4.5_29
Factory interface: b4.9_14 Beta
ISRM / RPTC: isB3.0_10
RTPC: B3.0_11
Platen 1:
Platen type: high speed (<=350 RPM)
Endpoint: RTPC
High pressure rinse flow meter: 1350-00195 (4.6 L/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse arms: high pressure/flow
Flow meter: 50-500 mL/min
Temperature control: platen cooling water
Platens 2,3:
Platen type: high speed (<=350 RPM)
Endpoint: full scan optical ISRM
High pressure rinse flow meter: 1350-00195 (4.6 L/min) FLOW METER ASSY 1/2OD 1.6-20LPM PFA
Rinse arms: high pressure/flow
Flow meter: 50-500 mL/min
Temperature control: platen cooling water
Polisher:
Polisher technology: slurry and pad
Polishing head: Contour Gen III (0.5 to 5.0 psi)
- (6) Zones
- Maximum pressure: RR (15 psi), Z1 (10 psi), Z2 (5 psi), Z3 (5 psi), Z4 (5 psi), Z5 (5 psi)
Cross break: N/A
Pad wafer loss sensor: dark pad sensor
Inter-platen clean: no
ISRM Laser key switch: yes
Slurry delivery system: 5 x 10 CLC SDS
Head 1 Power Cable: 0150-16277CABLE ASSY, HR1, DRIVER-MOTOR POWER, REF
Head 2 Power Cable: 0150-16278CABLE ASSY, HR2, DRIVER-MOTOR POWER, REF
Head 3 Power Cable: 0150-16279CABLE ASSY, HR3, DRIVER-MOTOR POWER, REF
Head 4 Power Cable: 0150-16280 CABLE
ASSY, HR4, DRIVER-MOTOR POWER, REF
Head 1 Encoder Cable: 0150-16281CABLE ASSY, 300MM, HR1, DRIVER-RESOLVER
Head 2 Encoder Cable: 0150-16282CABLE ASSY, 300MM, HR2, DRIVER-RESOLVER
Head 3 Encoder Cable: 0150-16283CABLE ASSY, 300MM, HR3, DRIVER-RESOLVER
Head 4 Encoder Cable: 0150-16284CABLE ASSY, 300MM, HR4, DRIVER-RESOLVER
G4+ UPA: SMC UPA
G4+ UPA: SMC UPA
Cleaner meg:
Chemical 1:CLC 1-250 ml/min
Chemical 2:CLC 1-250 ml/min
Brush box 1:
Chemical 1: 0-1250 ml/min
Chemical 2: 0-1250 ml/min
Brush box 2:
Brush LDM Type: 2-chem, inline, mixed
Chemical 1: 0-1250 ml/min
Chemical 2: 0-1250 ml/min
Dryer module:
Dryer type: vapor dryer
Recovery nodule: N/A
Output station damper: Viton cap
2010 vintage.
AMAT/APPLIED MATERIALS Reflexion LK是一种先进的晶圆研磨、研磨和抛光（G/L/P）设备,在半导体制造过程中提供卓越的控制和精度。该系统采用大型平板研磨、研磨、抛光块集成工作站；自动单面或双面研磨/研磨平台；高速装载机/卸载机；以及一整套过程和参数监控、控制和分析工具。集成驱动单元和高精度、低负载的轴承机构，可实现高水平的重复性和准确性。AMAT Reflexion LK机器结构非常坚固,性能强劲,耐用性强。该工具集成了先进的加热器和低温冷却级，以提供高度可重复的热膨胀系数，确保在多个晶片批次上保持一致的光洁度。该设备具有低噪声、低振动等优点，对精细晶片的损伤最小。单面研磨/研磨板的总载荷容量为400公斤，在行驶过程中提供均匀、精确的性能。支持主级和第二级相结合的研磨操作,以实现所需的表面光洁度。通过高精度导轨直线运动确保其平整度,该直线运动与可调补偿器一起,使底面的任何差异保持在0.002 mm/m以下。而且，APPLIED MATERIALS Reflexion LK模型带有用户友好的软件界面，允许完整的过程控制。任何需要调整的参数都可以通过单击按钮来更改。该软件还与现代化的可视化设备集成在一起，能够以3D图形显示数据。总体而言，Reflexion LK系统是一个功能强大、可靠、用户友好的晶圆研磨、研磨、抛光单元，提供卓越的性能和精度。对于要求在最短时间内取得优异成绩的半导体制造商来说是理想之选。
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