二手 DISCO DFG 82IF/8 #9374771 待售
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ID: 9374771
晶圆大小: 8"
优质的: 1995
Grinder, 8"
Grinding method: In-feed grinding with wafer rotation
Operating modes: Fully-automatic mode and manual mode
Spindle system:
Air spindle: 2-Axes (Single-spindle version selectable)
Direct drive high-frequency motor: 4.2 kW
1000-7000 RPM
Revolving speed / Electrical current real-time display function incorporated
Vertical stroke: 100 mm
Vertical in-feed speed range: 0.0001 to 5.000 mm / Sec
Vertical rapid feed speed: 600 mm / min
Maximum step of vertical displacement: 0.001 mm
Minimum vertical resolution: 0.05 µm
Angle adjustment: X / Y-Axis direction tilting mechanisms in the spindle housing
Height gauge:
Measurement range: 0-1000 µm
Resolution: 0.5 µm
Accuracy: 1 µm
Turntable:
Diameter: 500 mm
Index angle: 180° Reversible
(2) Tables
Wafer chuck table:
Type: Porous
Chucking method: Vacuum chucking
Revolving speed: 1-500 RPM
Applicable wafer size diameter: 8"
(2) Chuck tables per turntable
Settings for dwell after grind: 0-100 Revolutions
Chuck table cleaning: Back-flushing of water and compressed air is combined
With scrubbing by brush and oilstone
Grinding wheel: Diamond wheel, 8"
Wafer loading / Unloading:
Wafer carrier storage quantity: (2) Carriers parallel (Loader and unloader)
Spinner table: Water cleaning plus drying of both sides
Throughput: 60 Wafers / hr
Wafer size: 6"
Grinding depth: 20 µm
Accuracy:
Parallelism (TTV): 0.003 mm
Thickness variation between wafers: ±0.003 mm
Operating control:
Nonglare monitor: 12"
CRT Illumination color: White
Operation panel:
Composed of function keys
Numeric keys
Auxiliary keys
Cursor keys
Operating controls
Manual keyboard: Used for manual operations in which minute manipulation
(3) Relocated places: Center / Loader / Unloader
(13) Grinding / Cleaning water supply unit (Waste method type):
Tank capacity: 401 L (10.6 gal)
Water flow rate: 30 L/min (7.9 GPM)
Pressure: 3 kgf/cm² (42.6 PSI)
Filter: 5 µm
Water: Deionized water
Vacuum pump unit:
Air exhaust rate: 370/450 e/min (50/60 Hz at 160 Torr)
Pressure: 25 Torr
Motor rating: 1.5 kW
Water consumption rate: 5 L/min (1.32 GPM)
Water quality: City water
Alarm signal tower Colors: Green, orange, red
PC Output interface:
Data transmission mode: Full duplex
ASCII / JIS Codes
Data format: Start-stop system
Data rate: 4800 baud
Data signaling format: EIA RS-232C
Air pressure:
5.0 kgf/cm².G - 8.0 kgf/cm².G
71 psi.G - 113.6 psi.G
Pressure variation range: 0.3 kgf/cm².G (4.26 psi-G) or less
Blade hose: 15x22 mm
Flow rate: 500 N/min
Dew point: -15°C or Lower
Residual oil contents: 0.1 ppm wt/wt
Ground resistance: Class 3, 100Ω or less
Noise: 1000 V or Less at a pulse width of 500 NS (Square wave)
Dual-spindle version: 17 kVA
Power supply: 200 VAC ±10%, 3-Phase, 50/60 Hz.
1995 vintage.
DISCO DFG 82IF/8是一种晶圆研磨、研磨和抛光设备,能够实现超精确的表面质量和高精度的步进研磨工艺。其直径可达1000毫米的加工能力允许各种复杂的设备制造和薄膜生产应用。研磨、研磨和抛光工艺可手动编程用于定制设计。DISCO DFG-82IF/8配备了直观、直观、集成的用户界面,可精确、直观地控制所有应用程序功能。提供专门的夹具、工具和夹具,用于表面研磨操作,厚度不超过1 μ米。DFG 82 IF/8配备了两个独立的研磨模块-一个用于研磨,一个用于研磨操作。每个模块都配有变速电机,以便在运行过程中实现最优速度控制。这两个模块都可以与可选的自动进纸器系统配合使用,以提高效率和准确性。磨削模组配备了一系列可调节的磨料介质,晶圆尺寸可达1000毫米。提供了高质量的金刚石浸渍磨削工具,以实现最高的抛光质量和研磨公差。此外,磨削装置还采用抛光篮机设计,在加工过程中达到理想的表面接触。研磨模块配有两个单独的电动平台,用于+/-方向研磨运动。专门的研磨板配有各种砂粒和尺寸,以实现最高精度的优化结果。为DFG-82IF/8提供了必要的特性,以达到最佳的研磨、研磨和抛光效果,并易于操作。对于各种粒度和尺寸的研磨板,DISCO DFG-82I F/8可以产生超高质量的光学表面。此外,该工具设计紧凑,便于操作和畅通无阻地进入工作区,提供安全舒适的工作环境。
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