二手 DISCO DFG 82IF/8 #9374771 待售

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ID: 9374771
晶圆大小: 8"
优质的: 1995
Grinder, 8" Grinding method: In-feed grinding with wafer rotation Operating modes: Fully-automatic mode and manual mode Spindle system: Air spindle: 2-Axes (Single-spindle version selectable) Direct drive high-frequency motor: 4.2 kW 1000-7000 RPM Revolving speed / Electrical current real-time display function incorporated Vertical stroke: 100 mm Vertical in-feed speed range: 0.0001 to 5.000 mm / Sec Vertical rapid feed speed: 600 mm / min Maximum step of vertical displacement: 0.001 mm Minimum vertical resolution: 0.05 µm Angle adjustment: X / Y-Axis direction tilting mechanisms in the spindle housing Height gauge: Measurement range: 0-1000 µm Resolution: 0.5 µm Accuracy: 1 µm Turntable: Diameter: 500 mm Index angle: 180° Reversible (2) Tables Wafer chuck table: Type: Porous Chucking method: Vacuum chucking Revolving speed: 1-500 RPM Applicable wafer size diameter: 8" (2) Chuck tables per turntable Settings for dwell after grind: 0-100 Revolutions Chuck table cleaning: Back-flushing of water and compressed air is combined With scrubbing by brush and oilstone Grinding wheel: Diamond wheel, 8" Wafer loading / Unloading: Wafer carrier storage quantity: (2) Carriers parallel (Loader and unloader) Spinner table: Water cleaning plus drying of both sides Throughput: 60 Wafers / hr Wafer size: 6" Grinding depth: 20 µm Accuracy: Parallelism (TTV): 0.003 mm Thickness variation between wafers: ±0.003 mm Operating control: Nonglare monitor: 12" CRT Illumination color: White Operation panel: Composed of function keys Numeric keys Auxiliary keys Cursor keys Operating controls Manual keyboard: Used for manual operations in which minute manipulation (3) Relocated places: Center / Loader / Unloader (13) Grinding / Cleaning water supply unit (Waste method type): Tank capacity: 401 L (10.6 gal) Water flow rate: 30 L/min (7.9 GPM) Pressure: 3 kgf/cm² (42.6 PSI) Filter: 5 µm Water: Deionized water Vacuum pump unit: Air exhaust rate: 370/450 e/min (50/60 Hz at 160 Torr) Pressure: 25 Torr Motor rating: 1.5 kW Water consumption rate: 5 L/min (1.32 GPM) Water quality: City water Alarm signal tower Colors: Green, orange, red PC Output interface: Data transmission mode: Full duplex ASCII / JIS Codes Data format: Start-stop system Data rate: 4800 baud Data signaling format: EIA RS-232C Air pressure: 5.0 kgf/cm².G - 8.0 kgf/cm².G 71 psi.G - 113.6 psi.G Pressure variation range: 0.3 kgf/cm².G (4.26 psi-G) or less Blade hose: 15x22 mm Flow rate: 500 N/min Dew point: -15°C or Lower Residual oil contents: 0.1 ppm wt/wt Ground resistance: Class 3, 100Ω or less Noise: 1000 V or Less at a pulse width of 500 NS (Square wave) Dual-spindle version: 17 kVA Power supply: 200 VAC ±10%, 3-Phase, 50/60 Hz. 1995 vintage.
DISCO DFG 82IF/8是一种晶圆研磨、研磨和抛光设备,能够实现超精确的表面质量和高精度的步进研磨工艺。其直径可达1000毫米的加工能力允许各种复杂的设备制造和薄膜生产应用。研磨、研磨和抛光工艺可手动编程用于定制设计。DISCO DFG-82IF/8配备了直观、直观、集成的用户界面,可精确、直观地控制所有应用程序功能。提供专门的夹具、工具和夹具,用于表面研磨操作,厚度不超过1 μ米。DFG 82 IF/8配备了两个独立的研磨模块-一个用于研磨,一个用于研磨操作。每个模块都配有变速电机,以便在运行过程中实现最优速度控制。这两个模块都可以与可选的自动进纸器系统配合使用,以提高效率和准确性。磨削模组配备了一系列可调节的磨料介质,晶圆尺寸可达1000毫米。提供了高质量的金刚石浸渍磨削工具,以实现最高的抛光质量和研磨公差。此外,磨削装置还采用抛光篮机设计,在加工过程中达到理想的表面接触。研磨模块配有两个单独的电动平台,用于+/-方向研磨运动。专门的研磨板配有各种砂粒和尺寸,以实现最高精度的优化结果。为DFG-82IF/8提供了必要的特性,以达到最佳的研磨、研磨和抛光效果,并易于操作。对于各种粒度和尺寸的研磨板,DISCO DFG-82I F/8可以产生超高质量的光学表面。此外,该工具设计紧凑,便于操作和畅通无阻地进入工作区,提供安全舒适的工作环境。
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