二手 DISCO DFG 840 #9054571 待售

Grinder, 8" 6" capable Spindle type: air-bearing with high frequency motor (2) Axes Output (kW): 4, 2 Revolution speed (min-1 <rpm>): 1,000 - 7,000 Z-axis vertical stroke: 110mm Z-axis vertical grinder feed speed 0.001 - 0.08mm/s Height gauge: Measurement range: 0 - 1,000um Resolution: 0.1um Repeatability: +/- 0.5um Wafer chuck table: Type: porous Chuck methord: vacuum Number of revolutions (min-1 <rpm>): 0 - 300 (2) Chuck tables Spark out (chuck table revolution settings): 0 -999 Grinding wheel: diamond, ø200mm Wafer handling / cleaning section: (4) Cassette storage Spinner unit;: water washing and drying Vacuum unit: Discharge speed: 29 / 36 m3/h (50/60Hz) Achievable pressure (kPaxG): -90 (water supply temp. 15ºC, water supply flow rate 1L/min) Electrical motor: 1.5kW Water flow rate: 3L/min when supplied water temperature >22ºC Grinding accuracy: Thickness variation within one wafer: <1.5um Thickness variation between wafers: <+/-1.5um finish surface roughness: ~Ry 0.13um (with #2000 finish) Utilities: Power supply: 200VAC +/-10%, 3 phase, 50/60Hz Power consumption: during processing 5.1kW; during warm-up 3.1kW Max. power: 17KVA Air pressure: 0.5 - 0.8 MPA*G Water pressure: Grinding / cleaning: 0.2 - 0.3 MPa*G Cooling: 0.2 - 0.3 MPa*G Vacuum pump: 0.052 - 0.49 MPa*G Water flow rate: Grinding / cleaning: 15L/min Cooling: 6L/min Exhaust duct capacity: 4 m3/min.