二手 OKAMOTO GNX 300 #9039632 待售

Wafer back grinder, 8"-12" Grinding mode: Continuous down feed 2-Axes grinding spindle Rotation speed: 3,000 RPM Maximum Bearing: Air bearing Motor: 5.5 kW built-in motor Cooling method: Water cooled Maximum vertical stroke: 4" Vertical fast-grind speed: 8" per minute Grinding speed: 1 to 999 um per minute Grinder, 12" Grinding resistance reading: Monitoring current Output to CRT Horizontal angle adjustment: Manual Maximum radial load capacity: 30 kgf Maximum axial load capacity: 150 kgf Air consumption: (2) 20 L per minute Index table: (3) Vacuum chucks Vacuum chuck material: Porous ceramic Vacuum chuck rotation motor: (3) 1.0 kW AC Servo motors Vacuum chuck rotation speed: 400 RPM Maximum Chuck bearing: Air bearing Maximum radial load capacity: 30 kgf Maximum axial load capacity: 150 kgf Air consumption: (3) 36 L per minute Auto measuring device: Wafer thickness measurement method: Two-point in-process gauge Wafer thickness setting method: Final Wafer thickness displaying range: 1.8 mm Table cleaning unit: Cleaning method: Water and ceramic ring Wafer cleaning unit: Cleaning method: Water and brush operation panel Display method: 15" TFT Color touch panel Air supply: Consumption: 160 NL Per minute Pressure: 0.49 to 0.78 MPa Dew point: -15°C or lower Oil removal rate: 0.1 PPM W/W Grinding water: Water used: DI Water Pressure: 0.34 to 0.49 MPa Flow rate: 10 L per wafer Cooling water for vacuum pumps and spindles: Water used: City water Pressure: 0.19 to 0.49 MPa Flow rate: 10 NL Per minute Mist separator duct / General exhaust: Exhaust rate: 2 m³ per minute Vacuum pump duct / General exhaust: Exhaust rate: 75/90 m³/h, 50/60 Hz Power supply: Input power: 200V +/- 10%, 3-Phase, 50/60 Hz Power consumption: 20 kVA Grounding: Ground resistance JIS Type-3 100 Ohms or lower 2001 vintage.