二手 KENSINGTON CSMT-3 #9078956 待售
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ID: 9078956
晶圆大小: 6"
Station Sorting/Mapping Tool System, 6"
Wafer Handling robot with Dual Paddle for High Throughput
Advanced Cassette Sort Merge/Randomize/Split Capability
Cassette Tilt Scanning/Mapping System with Transmissive Metrology
Measures Actual Wafer Positions in Cassettes
Detects Two-wafers-in-a-slot & Cross slotted wafers
Wafers Handled through slot center for minimal contamination and gentle handling
High Speed, High Resolution Prealigner
Foresight OCR Recognition System
OS/2 Operating System with Touch Screen Color Display: Pentium PC
User Friendly Graphical Interface for all operations and Recipe Generation
Ergonomic Stainless-Steel Frame
Better that Class-1 Clean Room Compatibility
Fail-Safe, Integrated Vacuum/Motion Controllers (Kensington Model 4000)
Automatic Error-Condition Recovery
Smooth, Digitally-controlled DC Servo Actuation of all axes
Direct Motion Metrology of all axes: Fully Distributed Force/Position Feedback Sensing
Automatic Tilt-Back locates Wafers against back of cassette: prevents migration
90° Tilt-Back Cassette Loading/Unloading addresses Carpel Tunnel Syndrome Concerns
Colored Light System Status Beacon
Un-interruptible Power Supply/Back-up Vacuum (UPS/BUV) System. 110VAC AC 50/60 Hz
Automatically Unloads all wafers safely into their cassettes on total loss of power
Keyboard Drawer
Mirror-Bright #8 Electro-polished Laminar Flow Frame Top
X-Windows Software
Installation and on-site support
System Options:
GEMS/SECS-II Interface
Intel Ether Express W/TCPIP or HSMS.
KENSINGTON CSMT-3是一种晶片处理程序,旨在为半导体行业中的一系列模具连接和封装过程提供直观的晶片负载。它是最先进的全自动晶片加载程序和处理程序,可确保速度、准确性和一致的性能。它设计用于处理3英寸和4英寸晶片,用于模具连接和封装的行业标准工艺。CSMT-3是一种多功能的晶圆处理机。它支持紫外线粘合剂分配和环氧树脂模具连接工艺.该设备小巧,易于集成到小型和标准尺寸的设备区域,但通过提供广泛的控制设置和可定制的参数来保持准确性。该系统确保晶片向各种模具连接和封装工艺的一致流动,并考虑晶片处理和安装工艺。KENSINGTON CSMT-3采用用户友好、符合人体工程学的设计,配备7英寸触摸屏显示屏,可轻松设置和监控设备。该平台提供自动对齐设置,使操作员能够在有限的安装时间内快速设置模具连接或封装过程。晶片处理程序为晶片加载提供了最大的灵活性,可互换对齐基座,并且一次最多可处理四个晶片。CSMT-3还配备了多种安全功能,包括盖升降机互锁、紧急停车和晶片边缘检测传感器。这些安全功能提高了操作员的安全性并确保了一致的结果。KENSINGTON CSMT-3是自动晶圆处理的理想解决方桉。它为半导体生产提供了从加载到模具连接/封装过程的快速协调,具有所有必要的特性和安全特性。控制机用途广泛、速度快、使用方便,是模具连接和封装应用的理想选择。
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