二手 ASML XT 760F #9305673 待售
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ID: 9305673
晶圆大小: 12"
优质的: 2006
DUV Scanner, 12"
External interface module
Bottom module
Reticle stage
Covering panels frame parts
Covering panels frame MCAB
Covering panels
RSRC Cabinet
MCWC Cabinet
MDC Cabinet
LCWC Cabinet
Exhaust cabinet
Machine parts clean folder
Side channel blower
(6) Machine parts
Double stage
Hard Disk Drive (HDD), 4.1.0
Locking kit
TAMIS (EMTA):
Z7 Offset: ±4.0 nm (-5.96)
Z8 Offset: ±4.0 nm (-1.11)
Z7 Tilt in X: ±2.0 nm/cm (-0.04)
Z9 Offset: ±4.0 nm (0.48)
SAMOS (EMCA):
SAMOS: ≤3% (1.74)
SLIT Uniformity (LUSU):
- / NA / S.In / S.Out / Control spec / Down spec / Result
Annular (M-Action) / 0.7 / 0.55 / 0.85 / 1.50% / 3.00% / 0.31
Conventional / 0.65 / 0 / 0.75 / 1.50% / 3.00% / 0.26
Conventional / 0.7 / 0 / 0.6 / 1.50% / 3.00% / 0.28
Model result parameter:
Best focus: ±0.015 (0.002)
Image height C1 (um): 0 ±0.015 (0.002)
Image height C2 (um): 0 ±0.015
Image height different (um): 0 ±0.015
Image tilt ry C1 (urad): 0 ±0.5 (-0.279)
Image tilt ry C2 (urad): 0 ±0.5
Image tiltry different (urad): 0 ±0.5
Intrafield:
Focus range chuck 1 Before: <120 nm (91.6)
Focus range chuck 2 Before: <120 nm
Focus range chuck 1 After: <120 nm (89)
Focus range chuck 2 After: <120 nm
Focus range C1 different (nm): 0 +15 (2.6)
Focus range C2 different (nm): 0 +15
Astigmatism range C1 different (nm): 0 ±5 (0.6)
Astigmatism range C2 different (nm): 0 ±5
Result after correction:
IPD Mean (nm): <120 (89)
IPD STDEV (nm): <10
Astigmatism mean (nm): <70 (36)
Astigmatism STDEV (nm): <10
Dose accuracy and repeatability performance (ODAR):
Dose accuracy: <2.0 (max) (1.416)
Dose repeatability: <0.5 (0.057)
CYMER Laser not included
2006 vintage.
ASML XT 760F是下一代先进晶圆步进器，旨在作为生产先进半导体器件的市场领先解决方桉。ASML XT:760F是一种晶圆步进器，支持深紫外光刻（DUV）和准分子激光光刻（EUV）等技术。为进一步优化半导体生产工艺提供了卓越的精度和高通量速率。XT 760 F提供了许多先进的功能,使其与传统的晶圆步进器区分开来。它采用高速双轴亚微米级设备，提供最高精度和稳定性。双轴系统利用位置编码器和位置感应伺服电机，以及自适应前馈/反馈控制算法，提供晶片在步进器中极精确的定位。此外,ASML XT 760 F提供了一个高度可靠的像差校正单元,可确保即使在尼康投影光学器件最陡峭的范围内也能在整个晶圆区域保持图像质量。XT 760F还具有模块化设计,允许灵活和易于调节的机器.模块化设计消除了任何可能导致晶片作用或对准发生不可接受变化的因素,从而为晶片步进器的光学提供了最大程度的保护。XT:760F先进的控制工具还可以集成蚀刻和抛光等附加工艺。ASML XT 760F按照ISO/EEE 9000标准提供无懈可击的晶片处理,包括整个晶片表面的均匀曝光。过程参数统一且可重复,即使在多次曝光之后也是如此。此外,ASML XT:760F能够以极高的吞吐量速度运行,并具有较低的残余晶圆性能。XT 760 F通过实现晶圆处理的卓越可重复性，确保了先进的半导体器件生产过程以尽可能高的精度进行。综上所述,ASML XT 760 F是一款先进的晶片步进器,具有卓越的精度、高吞吐量、卓越的图像质量和高重复性,是生产先进半导体器件的市场领先解决方桉。
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