二手 CANON FPA 2500 i3 #293819904 待售

ID: 293819904
晶圆大小: 8"
优质的: 1996
Stepper, 8" Exposure Performance: Normal illumination: 0.40 µm or better SIA illumination: 0.35 µm or better SIB illumination: 0.40 µm or better PFI‑26, 1.025 µmt CD Depth of focus: Normal illumination: ≥ 1.0 µm (range) SIA illumination: ≥ 1.2 µm (range) SIB illumination: ≥ 1.4 µm (range) 0.40 µm L&S Image surface width (Normal illumination): ≤ 50 µm Distortion: Normal illumination: within ±0.07 µm SIA illumination: within ±0.08 µm SIB illumination: within ±0.08 µm Illuminator: Illumination Intensity: Normal illumination: ≥ 550 mW/cm² SIA illumination: ≥ 330 mW/cm² SIB illumination: ≥ 330 mW/cm² Illumination Uniformity: Normal illumination: Within ±1.2% SIA illumination: Within ±1.5% SIB illumination: Within ±1.5% Dose Control Accuracy ≤ ±1.2% Masking Accuracy ≤ ±100 µm Alignment Accuracy: Reticle Rotation Accuracy: ≤ ±0.02 µm Reticle Rotation Repeatability: ≤ ±0.03 µm (range) Alignment Accuracy: HeNe TV AGA: ≤ ±0.07 µm (| m | + 3s) Broad Band TV AGA: ≤ ±0.07 µm ( m | + 3s) Auto Focus: Repeatability: ≤ 0.12 µm (3s) Die By Die Leveling: Repeatability: ≤ 10 µm (3s) Compensation Range: ≤ ±100 ppm XY Stage Accuracy Stepping Accuracy: ≤ 0.06 µm (3s) Scaling: ≤ ±1.0 ppm Orthogonality: ≤ ±1.0 ppm Prealignment Accuracy: Mechanical PA Accuracy: ≤ ±40 µm Throughput: L‑Type Auto Feeder With Die‑by‑Die Leveling OFF: 6" (45 shots): 62 wafers/hour or more 8" (78 shots): 44 wafers/hour or more With Die‑by‑Die Leveling ON: 6" (45 shots): 57 wafers/hour or more 8" (78 shots): 40 wafers/hour or more R‑Type Auto Feeder With Die‑by‑Die Leveling OFF 6" (45 shots): 61 wafers/hour or more 8" (78 shots): 44 wafers/hour or more With Die‑by‑Die Leveling ON: 6" (45 shots): 56 wafers/hour or more 8" (78 shots): 40 wafers/hour or more Reliability: Reticle handling: 50 cycles Wafer handling: 300 cycles Compact chamber: Temperature Control: Booth: 21 °C Stage: 23 °C Cleanliness: within ±0.1 °C 1996 vintage.
CANON FPA 2500 i3是晶圆步进器-一种用于半导体工业的晶圆製造和检验工具。适合对宽范围的晶片进行鉴定检查,直径从300毫米到200毫米不等。i3是双场对准系统,有两个截然不同的操作区域。专用对准级使得晶片和基板能够精确对准,这要归功于它具有亚微米精度的高精度电动机。然后将晶片置于焦平面阵列中,这是一系列光学元件,可捕获晶片表面的高分辨率图像,然后将其投影到液晶显示器上,以便于查看。CANON FPA-2500I3包括各种旨在提高效率和可靠性的功能。它具有高速横向运动系统,用于晶圆的快速飞行运动,以及用于温度控制和提高吞吐量的全封闭光学组件。它还包括用于检测和放置缺陷的专有模式匹配算法。i3提供先进的晶圆映射功能,包括物理、电气和光学映射,用于高效晶圆鉴定和检查。它允许对诸如划痕和污渍等颗粒进行高清视频检查,从而能够更准确地检测缺陷并拒绝损坏的晶片。最后,系统具有较大的内存容量,支持高达1 TB的内部内存,用于存储图像和数据以进行分析,并生成PDF、PSD和CSV格式的报告。为方便用户,FPA-2500 I3具有用户友好的界面,允许快速轻松浏览复杂的用户控件。此外,它还具有多种扫描参数,包括扫描速度、图像类型和图像分辨率,以及用于收集关键数据以进行质量控制的各种传感器。i3还支持通过互联网更新软件,使用户能够及时了解晶圆检测技术的最新进展。总体而言,FPA 2500 i3是一种高效可靠的晶圆步进器,用于半导体制造和检验过程。i3具有高精度电机、强大的光学组件以及广泛的软件和硬件功能,非常适合以最高效的方式生产和鉴定高质量晶片。
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