二手 CANON FPA 2500 i3 #293819904 待售
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ID: 293819904
晶圆大小: 8"
优质的: 1996
Stepper, 8"
Exposure Performance:
Normal illumination: 0.40 µm or better
SIA illumination: 0.35 µm or better
SIB illumination: 0.40 µm or better
PFI‑26, 1.025 µmt
CD Depth of focus:
Normal illumination: ≥ 1.0 µm (range)
SIA illumination: ≥ 1.2 µm (range)
SIB illumination: ≥ 1.4 µm (range)
0.40 µm L&S
Image surface width (Normal illumination): ≤ 50 µm
Distortion:
Normal illumination: within ±0.07 µm
SIA illumination: within ±0.08 µm
SIB illumination: within ±0.08 µm
Illuminator:
Illumination Intensity:
Normal illumination: ≥ 550 mW/cm²
SIA illumination: ≥ 330 mW/cm²
SIB illumination: ≥ 330 mW/cm²
Illumination Uniformity:
Normal illumination: Within ±1.2%
SIA illumination: Within ±1.5%
SIB illumination: Within ±1.5%
Dose Control Accuracy
≤ ±1.2%
Masking Accuracy
≤ ±100 µm
Alignment Accuracy:
Reticle Rotation Accuracy: ≤ ±0.02 µm
Reticle Rotation Repeatability: ≤ ±0.03 µm (range)
Alignment Accuracy:
HeNe TV AGA: ≤ ±0.07 µm (| m | + 3s)
Broad Band TV AGA: ≤ ±0.07 µm ( m | + 3s)
Auto Focus:
Repeatability: ≤ 0.12 µm (3s)
Die By Die Leveling:
Repeatability: ≤ 10 µm (3s)
Compensation Range: ≤ ±100 ppm
XY Stage Accuracy
Stepping Accuracy: ≤ 0.06 µm (3s)
Scaling: ≤ ±1.0 ppm
Orthogonality: ≤ ±1.0 ppm
Prealignment Accuracy:
Mechanical PA Accuracy: ≤ ±40 µm
Throughput:
L‑Type Auto Feeder
With Die‑by‑Die Leveling OFF:
6" (45 shots): 62 wafers/hour or more
8" (78 shots): 44 wafers/hour or more
With Die‑by‑Die Leveling ON:
6" (45 shots): 57 wafers/hour or more
8" (78 shots): 40 wafers/hour or more
R‑Type Auto Feeder
With Die‑by‑Die Leveling OFF
6" (45 shots): 61 wafers/hour or more
8" (78 shots): 44 wafers/hour or more
With Die‑by‑Die Leveling ON:
6" (45 shots): 56 wafers/hour or more
8" (78 shots): 40 wafers/hour or more
Reliability:
Reticle handling: 50 cycles
Wafer handling: 300 cycles
Compact chamber:
Temperature Control:
Booth: 21 °C
Stage: 23 °C
Cleanliness: within ±0.1 °C
1996 vintage.
CANON FPA 2500 i3是晶圆步进器-一种用于半导体工业的晶圆製造和检验工具。适合对宽范围的晶片进行鉴定检查,直径从300毫米到200毫米不等。i3是双场对准系统,有两个截然不同的操作区域。专用对准级使得晶片和基板能够精确对准,这要归功于它具有亚微米精度的高精度电动机。然后将晶片置于焦平面阵列中,这是一系列光学元件,可捕获晶片表面的高分辨率图像,然后将其投影到液晶显示器上,以便于查看。CANON FPA-2500I3包括各种旨在提高效率和可靠性的功能。它具有高速横向运动系统,用于晶圆的快速飞行运动,以及用于温度控制和提高吞吐量的全封闭光学组件。它还包括用于检测和放置缺陷的专有模式匹配算法。i3提供先进的晶圆映射功能,包括物理、电气和光学映射,用于高效晶圆鉴定和检查。它允许对诸如划痕和污渍等颗粒进行高清视频检查,从而能够更准确地检测缺陷并拒绝损坏的晶片。最后,系统具有较大的内存容量,支持高达1 TB的内部内存,用于存储图像和数据以进行分析,并生成PDF、PSD和CSV格式的报告。为方便用户,FPA-2500 I3具有用户友好的界面,允许快速轻松浏览复杂的用户控件。此外,它还具有多种扫描参数,包括扫描速度、图像类型和图像分辨率,以及用于收集关键数据以进行质量控制的各种传感器。i3还支持通过互联网更新软件,使用户能够及时了解晶圆检测技术的最新进展。总体而言,FPA 2500 i3是一种高效可靠的晶圆步进器,用于半导体制造和检验过程。i3具有高精度电机、强大的光学组件以及广泛的软件和硬件功能,非常适合以最高效的方式生产和鉴定高质量晶片。
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