二手 NIKON NSR 2205 i12C #293752261 待售
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ID: 293752261
晶圆大小: 6"
优质的: 1997
Stepper, 6"
Resolution (NA=0.57): Within 0.45 µm
DOF: 0.8 µm
Lens Distortion (incl. magnification error): Within ±55 nm
Lens Distortion Stability: Within ±20 nm
Focus Stability: Within ±0.25 µm
Open Frame (Max. Exposure Area): 22.0 mm × 22.0 mm (17.96–25.20)
Auto Focus Calibration Repeatability: 3σ ≤ 100 nm
Auto Focus Offset Range: Within ±20 µm
Lamp Power: 700 mW/cm²
Lamp Uniformity: Within 1.5 %
Dose Control Accuracy (Integrated Exposure Stability): Within ±1.0 %
Reticle Blind: +0.4 mm ~ +0.8 mm
Reticle Alignment Accuracy: Absolute value within ±0.02 µm of target value, Repeatability within 0.015 µm
LSA Overlay Accuracy: |X| + 3σ ≤ 0.065 µm
FIA Overlay Accuracy: |X| + 3σ ≤ 0.065 µm
Stepping Accuracy: ±0.04 µm (3σ)
Orthogonality: Within ±0.1 sec
Wafer Stage Flatness: Within 2.0 µm / 200 mm
Chip Leveling: Within 4.8 µrad / 22 mm
Wafer Prealignment Repeatability: 3σ within 15 µm
Self Measurement Program (Option): Automatic
Temperature: 23°C
Chamber Type: S20
NA Variable System
Reticle Size: 6" (Normal)
Reticle Microscope: Fix
Max Field Size: 22 mm
PPD
Reticle Barcode Reader
Reticle Loader: Standard (13 Slot)
Reticle Case: 6" Standard
Pre Alignment
Wafer Loader: Type2
Chip Leveling
Wafer Carrier Table: Left, Right
Alignment Sensor: LSA, FIA
Rack Type: Normal (Right)
Body‑OP Ruck Cable: 3 m (Normal)
No Wafer Edge Exposure
Lamp Power: 2 kW (Normal)
Illumination: SHRINC3
1997 vintage.
NIKON NSR 2205 i12C Wafer Stepper是一种全自动、高精度的光刻设备,设计用于生产光掩模和光栅。该系统配备12英寸可变狭缝摄像机(VSC)和12英寸视场(FOV),可确保卓越的成像质量和卓越的吞吐量。其实时散焦控制单元(RDC)确保了晶圆成像的卓越性能。它由智能i系列控制器(i12C)提供动力,提供高端性能和运营效率。它还提供对功能和设置的即时访问,并简化了手动数据输入。软件功能,如智能缝隙选择器(ISS),提高了操作效率和可靠性。NIKON NSR-2205I12C能够在提供精确的曝光均匀性的同时以高速预先对准和步进。它被编程为提供与目标统一控制(TUC)一致的暴露一致性。晶圆步进器还提供了良好的温度稳定性和平稳的操作控制效果的热漂移。NSR 2205 i12C可以曝光高达300毫米(12英寸)曝光范围的晶片,满足当今最苛刻的半导体加工需求。它可以在785 nm波长下达到半微米的分辨率,确保最大保真度和对最先进的10nm工艺节点的支持。NSR-2205I12C专有的六轴电机(SAM)为模式迭加和曝光优化提供了优化的垂直扫描功能。自动刀具维护(ASM)功能可确保用户在长期内获得可靠的现场操作。NIKON NSR 2205 i12C Wafer Stepper专为快速、高效和可靠的成像工作流而设计。其高端光学和先进的软件平台使其成为要求苛刻的半导体成像过程的理想选择。其先进的技术和先进的功能为用户提供了尽可能高的晶圆成像质量和操作可靠性。
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