二手 ISIS SENTRONICS SemDex A32-34 #9407579 待售
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ID: 9407579
晶圆大小: 8"-12"
优质的: 2011
Wafer testing and metrology system, 8"-12"
Automatic loading
(2) Load ports (12" FOUB and 8" Open cassette via 12" Mechanical adaptor)
Measurement part:
Automated measurement:
Substrate / Layer / Total thickness
Bow / Warp
Mini-bumps / Vias (Micro 3D metrology) and nm roughness
Integrated sensor heads:
Layer thickness / Bow: StraDex f2 - 80 (Top), StraDex f24 - 300 (Bottom)
3D micro-topography: StraDex a3 (Top, off-center by about 90 mm)
Camera function (Top sensor)
Autofocus:
StraDex a3 (Precision mechanical bearing)
StraDex f2 - 80
StraDex f24 - 300 (Air bearing)
Anti-vibration plate below chuck
Optical wavelengths:
Top sensor: 830 nm (Minimum Silicon thickness 2.5 μm)
Bottom sensor: 1300 nm (Minimum Silicon thickness 7 μm)
Top sensor (Off-center): ~ 500 nm
Integrated calibration samples:
Thickness sample silicon: 123 μm (Roughness in the several nm level)
Thickness sample silicon: 750 μm (Roughness in the several nm level)
Step profiles for 3D Micro topography
Cross hair for top and bottom thickness sensor alignment
Sensor system with (3) StraDex sensor heads (Triple sensor setup):
StraDex f2 - 80 (Top):
Spot size: 8 μm
Autofocus range: 2 - 22 mm
Maximum warp: 3 mm
Acquisition rate: < 4 kHz
Thickness (Undoped silicon):
Fast mode: 2.5 - 80 μm
Slow mode: 2.5 - 80 μm
Thickness (Glass, polymer):
Fast mode: 5 - 200 μm
Slow mode: 5 - 200 μm
StraDex f24 - 300 (Bottom):
Spot size: 24 μm
Autofocus range: 24 - 44 mm
Maximum warp: 2 mm
Acquisition rate: < 4 kHz
Thickness (Silicon):
Fast mode: 8 - 350 μm
Slow mode: 8 - 800 μm
Thickness (Glass, polymer):
Fast mode: 14 - 300 μm
Slow mode: 14 - 1000 μm
StraDex a3 (Top):
Field-of-view: (0.35 mm)²
Lateral pixel size: 0.3 μm
Working distance: 3.5 mm
Autofocus range: 4 mm
Maximum Z-height: 60 μm (High-res.) / 120 μm (Low-res.)
Repeatability: 0.5 nm (High-res.)
Total acquisition time: 2 - 3 sec.
Maximum focusing speed: 200 μm/s
Surface roughness: Rz < 0.1 μm
Confidence range: 2 Sigma
Single sensor mode:
Absolute accuracy: < ± 0.5 μm
Repeatability (Fast mode): < ± 0.1 μm
Repeatability (Slow mode): < ± 0.5 μm
Twin sensor (Layer thickness) mode:
Absolute accuracy: < ± 1 μm
Repeatability (Fast and slow mode): < ± 0.5 μm
Stage:
Maximum X/Y travel range: 300 x 300 mm²
Maximum velocity: 30 mm/s
Lateral accuracy: 4 μm
Maximum height variation repeatable: 2 μm
Free positioning via keypads
Anti-vibration table
Air suspension
Perforated vacuum chuck for double side measurements of 6", 8" and 12" unframed and framed wafers
10 mm Holes at 20 mm inter-center spacing
Vacuum for wafer suction
3 Lift pins to elevate the wafer (≥ 200 mm in diameter) by 9.5 mm
Wafer handling:
Up to 60 wafers / hour
Single ATM robot with vacuum gripper
Pre-aligner
OCR reader (Standard: Top scribe readout)
General:
Industrial computer (2 GHz) with screen
Data interface: LAN
Fan filter unit, ISO class 10
Temperature: 10°C - 35°C
Power supply voltage: 100 V - 240 V, 50-60 Hz
Maximum power consumption: 5 kW
Sensor missing
2011 vintage.
ISIS SENTRONICS SemDex A32-34是一种晶圆测试和计量设备,设计用于元件分析、表面计量和电气评估。它能够测试和测量各种晶片基板,包括薄膜和厚膜、单片和嵌入式电路以及多晶硅。SemDex A32-34集成了全自动测试和计量系统,可实现精确和可重复的结果。它使用X-Y-Z扫描级进行精确的晶圆定位和移动,在晶圆位置之间提供精确的对准和可重复性。此级可由基于PC的控制器(PCBC)控制,并且能够扫描晶圆的100个单独区域。ISIS SENTRONICS SemDex A32-34包括一个高性能的电光检测包,包括一个高分辨率的CMOS相机和光场显微镜,使它能够探测和分析单个晶圆的大面积。这个封装还包括一个电压模式表征单元,允许精确测量晶圆参数。该机还配备了先进的基于算法的软件包,为用户提供了以表面计量计算、故障检测、统计过程控制等多种方式分析其扫描数据的能力。此外,该工具还提供了扫描数据的实时可视化,允许用户快速查看结果。SemDex A32-34的其他关键特性包括能够提供广泛的测试和测量能力,如4点探针测量和电流映射,以及用于检测超小型缺陷和污染物的尖端成像算法。总之,ISIS SENTRONICS SemDex A32-34是一种综合性晶圆测试和计量资产,设计用于精确和可重复的结果。它结合了多种用于测试各种晶片基板的高级功能,如全自动X-Y-Z扫描阶段、高分辨率成像模型和基于算法的软件包,让用户快速准确地分析自己的扫描数据。
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