二手ADVANCED LASER SEPARATION INTERNATIONAL ICA 1204待售

Laser ablation tool Multi beam UV 355 nm laser Smallest heat affected zone (multi beam) with up to 5x productivity 60 µm Wide single pass groove Sample: 1.5mm thick Multi die size wafer capability Laser edge trimming Cutting: 300 µm Thickness (2) Coating / Cleaning integrated stations Positioning precision: 2µm Max speed: X-Y 500 mm/s Handling on frame FF123.